Method, system, and apparatus for transfer of integrated circuit dies using an attractive force

• US 20060223225A1
• Filed: 03/29/2005
• Published: 10/05/2006
• Est. Priority Date: 03/29/2005
• Status: Abandoned Application

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Application Number:
  US11/091,528
• Publication Number:
  US 20060223225A1
• Time in Patent Office: Days
• US Class Current: 438/106
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67333 Trays for chips magazine for components H05K13/0084
• CPC Class Codes: H01L 21/67336 characterized by a material, a roughness, a coating or the like
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95144 Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body

Abstract

A method, system, and apparatus for transferring integrated circuit dies is described. A die receptacle structure has a first surface. The first surface has a plurality of cells formed therein. Each cell is configured to contain an integrated circuit die. A bottom surface of each cell is configured to attract dies having a first material thereon. Example forces that can be used to attract dies into cells include a magnetic force, a chemical force, and an electrostatic force.

Claims

1. A method for transferring a plurality of integrated circuit dies, comprising:

(a) receiving a plurality of dies, wherein each die of the plurality of dies has a surface at least partially covered with a first material; and

(b) transferring dies of the plurality of dies into cells formed in a first surface, wherein the dies are transferred into the cells due to an attraction between the first material and the cells.

2. The method of claim 1, wherein step (a) comprises:

receiving a second surface having the plurality of dies thereon; and

releasing the plurality of dies from the second surface.

3. The method of claim 1, wherein the first surface is located in a liquid, wherein step (a) comprises:

depositing the plurality of dies into the liquid.

4. The method of claim 1, wherein step (b) comprises:

using a magnetic force to attract dies of the plurality of dies into the cells.

5. The method of claim 4, wherein the first material is magnetic, wherein said using step comprises:

using a magnetic material of the cells to attract the magnetic first material, thereby attracting dies of the plurality of dies into the cells.

6. The method of claim 4, wherein the first material is a metal, wherein said using step comprises:

using a magnetic material of the cells to attract the metal, thereby attracting dies of the plurality of dies into the cells.

7. The method of claim 3, wherein the first material is magnetic, wherein said using step comprises:

allowing the magnetic first material to be attracted to a metal material of the cells, thereby attracting dies of the plurality of dies into the cells.

8. The method of claim 1, wherein step (b) comprises:

using a chemical attraction to attract dies of the plurality of dies into the cells.

9. The method of claim 8, wherein said using step comprises:

applying a second material to an inner surface of the cells, wherein the first material and second material are chemically attracted.

10. The method of claim 1, wherein step (b) comprises:

using an electrostatic attraction to attract dies of the plurality of dies into the cells.

11. The method of claim 10, wherein step (b) comprises:

applying a bias voltage to the first surface to induce the electrostatic attraction.

12. A system for transferring a plurality of integrated circuit dies, comprising:

a die receptacle structure having a first surface, wherein the first surface has a plurality of cells formed therein, each cell configured to contain an integrated circuit die;

wherein a bottom surface of each cell is configured to attract dies having a first material thereon.

13. The system of claim 12, wherein the die receptacle structure is a web of substrates.

14. The system of claim 12, wherein the die receptacle structure is a substrate.

15. The system of claim 12, wherein the die receptacle structure is a die holder.

16. The system of claim 12, wherein each cell has a rectangular shaped cross-section.

17. The system of claim 12, wherein each cell has a trapezoidal shaped cross-section.

18. The system of claim 12, wherein the die receptacle structure has a layer that forms the bottom surface of each cell.

19. The system of claim 18, wherein the first material is a magnetic material, wherein the layer comprises a metal to be magnetically attracted to the first material of the dies.

20. The system of claim 18, wherein the layer comprises a magnetic material to magnetically attract the first material of the dies.

21. The method of claim 19, further comprising:

a voltage source coupled to said layer to apply a bias voltage to the layer to electrostatically attract the first material of the dies.

22. The method of claim 12, wherein the bottom surface of each cell is treated with a first material to chemically attract the first material of the dies.