Techniques for partitioning radios in wireless communication systems

• US 20060223456A1
• Filed: 03/31/2005
• Published: 10/05/2006
• Est. Priority Date: 03/31/2005
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Black Sand Technologies, Inc. (Qualcomm, Inc.)
• Inventors: Ouzillou, Mendy M.
• Granted Patent: US 7,912,499 B2
• Time in Patent Office: Days
• US Class Current: 455/78
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H04B 1/005 adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
• CPC Class Codes: H04B 1/40 Circuits

Abstract

A method and apparatus is provided for partitioning a radio using a multi-chip module to group some or all of the components of the radio in a single package. In one example, a radio uses a multi-chip module, including a chip carrier. Various components of the radio reside in integrated circuits that are mounted to the chip carrier. If desired, one or more antennas can be integrated into the chip carrier.

Claims

1. A multi-band RF apparatus used for wireless communications comprising:

a transceiver configured to transmit and receive in multiple frequency bands;

a first power amplifier electrically coupled to the transceiver and configured to amplify signals in a first frequency band;

a second power amplifier electrically coupled to the transceiver and configured to amplify signals in a second frequency band;

a first antenna electrically coupled to the first power amplifier for transmitting and receiving signals in the first frequency band; and

a second antenna electrically coupled to the second power amplifier for transmitting and receiving signals in the second frequency band.

2. The multi-band RF apparatus of claim 1, further comprising an antenna switch module electrically coupling the first and second antennas with the respective first and second power amplifiers.

3. The multi-band RF apparatus of claim 1, further comprising one or more circulators electrically coupling the first and second antennas with the respective first and second power amplifiers.

4. The multi-band RF apparatus of claim 1, wherein the transceiver is formed on a first integrated circuit.

5. The multi-band RF apparatus of claim 4, wherein the first and second power amplifiers each include multiple stages, and wherein at least one stage of each of the first and second power amplifiers is formed on the first integrated circuit and at least one stage of each of the multi-stage power amplifiers is formed on a second integrated circuit.

6. The multi-band RF apparatus of claim 5, wherein the first and second integrated circuits are mounted on a chip carrier.

7. The multi-band RF apparatus of claim 6, wherein the first and second antennas are integrated in the chip carrier.

8. The multi-band RF apparatus of claim 1, further comprising a baseband controller electrically coupled to the transceiver.

9. The multi-band RF apparatus of claim 1, further comprising:

a third power amplifier electrically coupled to the transceiver and configured to amplify signals in a third frequency band; and

a third antenna electrically coupled to the third power amplifier for transmitting and receiving signals in the third frequency band.

10. The multi-band RF apparatus of claim 9, further comprising:

a fourth power amplifier electrically coupled to the transceiver and configured to amplify signals in a fourth frequency band; and

a fourth antenna electrically coupled to the third power amplifier for transmitting and receiving signals in the fourth frequency band.

11. A multi-band RF apparatus used for wireless communications comprising:

a transceiver configured to transmit and receive in multiple frequency bands;

a first power amplifier electrically coupled to the transceiver and configured to amplify signals in a first frequency band;

a second power amplifier electrically coupled to the transceiver and configured to amplify signals in a second frequency band;

a first antenna electrically coupled to the first power amplifier for transmitting signals at the first frequency band;

a second antenna electrically coupled to the transceiver for receiving signals at the first frequency band;

a third antenna electrically coupled to the second power amplifier for transmitting signals at the second frequency band; and

a fourth antenna electrically coupled to the transceiver for receiving signals at the second frequency band.

12. The multi-band RF apparatus of claim 11, further comprising a first low pass filter electrically coupled between the first antenna with the first power amplifier.

13. The multi-band RF apparatus of claim 12, further comprising a second low pass filter electrically coupled between the third antenna with the second power amplifier.

14. The multi-band RF apparatus of claim 11, further comprising a first band pass filter electrically coupled between the second antenna with the transceiver.

15. The multi-band RF apparatus of claim 14, further comprising a second band pass filter electrically coupled between the fourth antenna with the transceiver.

16. The multi-band RF apparatus of claim 11, further comprising a first surface-acoustic-wave (SAW) filter electrically coupled between the second antenna with the transceiver.

17. The multi-band RF apparatus of claim 16, further comprising a second surface-acoustic-wave (SAW) filter electrically coupled between the fourth antenna with the transceiver.

18. The multi-band RF apparatus of claim 11, further comprising a first isolator electrically coupled between the first antenna with the first power amplifier.

19. The multi-band RF apparatus of claim 18, further comprising a second isolator electrically coupled between the third antenna with the second power amplifier.

20. The multi-band RF apparatus of claim 11, wherein the transceiver is formed on a first integrated circuit.

21. The multi-band RF apparatus of claim 20, wherein the first and second power amplifiers each include multiple stages, and wherein at least one stage of each of the first and second power amplifiers is formed on the first integrated circuit and at least one stage of each of the multi-stage power amplifiers is formed on a second integrated circuit.

22. The multi-band RF apparatus of claim 20, wherein the first and second power amplifier are at least partially formed on a second integrated circuit, and wherein the first and second integrated circuits are mounted to a chip carrier.

23. The multi-band RF apparatus of claim 22, wherein the first, second, third, and fourth antennas are integrated as a part of the chip carrier.

24. The multi-band RF apparatus of claim 23, wherein the chip carrier is a ceramic chip carrier.

25. A method of providing wireless RF communications comprising:

configuring a transceiver to transmit and receive signals in multiple frequency bands;

configuring a first power amplifier to amplify signals in a first frequency band;

configuring a second power amplifier to amplify signals in a second frequency band;

coupling a first antenna to the first power amplifier for transmitting and/or receiving signals in the first frequency band;

coupling a second antenna to the second power amplifier for transmitting and/or receiving signals in the second frequency band.

26. The method of claim 25, further comprising:

forming the transceiver and the power amplifiers in one or more integrated circuits;

mounting the one or more integrated circuits to a chip carrier; and

forming the first and second antennas in the chip carrier.

27. The method of claim 26, wherein the chip carrier is a ceramic chip carrier.

28. The method of claim 25, wherein the first antenna is configured to transmit signals in the first frequency band, and wherein the second antenna is configured to transmit signals in the second frequency band, the method further comprising:

coupling a third antenna to the transceiver for receiving signals in the first frequency band; and

coupling a fourth antenna to the transceiver for receiving signals in the second frequency band.