In vivo imaging device and method of manufacture thereof

• US 20060224040A1
• Filed: 03/31/2005
• Published: 10/05/2006
• Est. Priority Date: 03/31/2005
• Status: Abandoned Application

• Current Assignee: Given Imaging Limited (Medtronic Plc)
• Original Assignee: Given Imaging Limited (Medtronic Plc)
• Inventors: Khait, Semion, Gilad, Zvika
• Application Number:
  US11/094,288
• Publication Number:
  US 20060224040A1
• Time in Patent Office: Days
• US Class Current: 600/102
• CPC Class Codes: A61B 1/041 Capsule endoscopes for imaging
• CPC Class Codes: A61B 1/051 Details of CCD assembly

Abstract

An in vivo imaging device including one or more components for example an imager, a transmitter and a circuit board having rigid sections and flexible sections According to some embodiments, the in vivo imaging device components may be electrically joined and/or stacked together using three-dimensional (3D) chip scale packaging solutions.

Claims

1. An autonomous in vivo imaging device comprising a housing and a plurality of components packaged vertically upon a single support within the housing.

2. The in vivo imaging device of claim 1, wherein said components are selected from the group consisting of:

an imager, a transmitter, a memory, a circuit board and a buffer.

3. The in vivo imaging device of claim 1, wherein said support is a circuit board.

4. The in vivo imaging device of claim 1, wherein said support comprises a plurality of rigid sections and a plurality of flexible sections.

5. The in vivo imaging device of claim 4, wherein said plurality of components are positioned on a rigid section of said support.

6. The in vivo imaging device of claim 1, comprising a lens holder.

7. The in vivo imaging system of claim 1, wherein said in vivo imaging device comprises a swallowable capsule.

8. An autonomous in vivo imaging device comprising a package of vertically stacked multiple die, the die being electrically interconnected.

9. The device according to claim 8 wherein the die include components of the device.

10. The device according to claim 8, wherein the components are selected from the group consisting of:

an imager, a transmitter, a memory, a buffer and a circuit board.

11. The device according to claim 8, comprising connecting layers according to techniques selected from the group consisting of. Stacked tape carrier, Solder edge conductor bonding, Folded Flex Circuits, Thin Film Conductors, and stacked chips

12. A method of manufacturing an in vivo imaging device, the method comprising:

vertically stacking a plurality of components on a support, and

folding the support into an in vivo imaging device housing.

13. The method of claim 13, comprising inserting the folded circuit board into a swallowable capsule.

14. The method of claim 13, comprising interconnecting said components to each other.

15. The method of claim 13, comprising electrically interconnecting said components. 16. A method for vertically stacking an imager and a transmitter in an in-vivo imaging device comprising:

interconnecting the transmitter to a support by a conductive path; and

vertically interconnecting the imager to the transmitter.