Isothermal control of a process chamber

• US 20060225769A1
• Filed: 03/30/2005
• Published: 10/12/2006
• Est. Priority Date: 03/30/2005
• Status: Abandoned Application

• Current Assignee: Toyko Electron Limited
• Original Assignee: Toyko Electron Limited
• Inventors: Goshi, Gentaro, Jones, William
• Application Number:
  US11/094,876
• Publication Number:
  US 20060225769A1
• Time in Patent Office: Days
• US Class Current: 134/10
• CPC Class Codes: H01L 21/67248 Temperature monitoring

Abstract

An apparatus for use in providing a fluid at a predetermined temperature is disclosed. The apparatus comprises: means for supplying a first quantity of a fluid at a first temperature; means for supplying a second quantity of a fluid at a second temperature; and flow-control means for controlling a ratio of the first quantity of the fluid to the second quantity of the fluid for forming a mixed fluid, wherein the ratio is determined in response to a measured temperature of the mixed fluid.

Claims

1. An apparatus for providing a temperature controlled fluid, comprising:

a processing chamber having a processing chamber inlet and a processing chamber outlet;

a recirculation system having an inlet coupled to the processing chamber outlet and an outlet coupled to the processing chamber inlet;

a fluid supply subassembly coupled to the processing chamber for providing the temperature controlled fluid to the processing chamber, wherein the fluid supply subassembly comprises means for supplying a first quantity of a fluid at a first temperature, means for supplying a second quantity of a fluid at a second temperature, and flow-control means coupled to the means for supplying a first quantity of a fluid at a first temperature and to the means for supplying a second quantity of a fluid at a second temperature, the flow-control means for forming the temperature controlled fluid; and

a controller coupled to the fluid supply subassembly for determining a temperature of the temperature controlled fluid and controlling a ratio of the first quantity of the fluid to the second quantity of the fluid in response to the temperature.

2. The apparatus of claim 1, wherein the flow-control means includes a flow control valve coupled to the means for supplying a first quantity of a fluid at a first temperature and to the means for supplying a second quantity of a fluid at a second temperature.

3. The apparatus of claim 1, wherein the flow-control means includes a mixing chamber coupled to the means for supplying a first quantity of a fluid at a first temperature and to the means for supplying a second quantity of a fluid at a second temperature.

4. The apparatus of claim 1, further comprising means for supplying process chemistry coupled to the flow-control means, the means for supplying the first quantity of the fluid at a first temperature, or the means for supplying the second quantity of the fluid at a second temperature, or a combination of two or more thereof.

5. The apparatus of claim 1, further comprising means for measuring temperature coupled to the flow-control means, the means for supplying the first quantity of the fluid at a first temperature, or the means for supplying the second quantity of the fluid at a second temperature, or a combination of two or more thereof.

6. The apparatus of claim 1, further comprising means for measuring fluid flow coupled to the flow-control means, the means for supplying the first quantity of the fluid at a first temperature, or the means for supplying the second quantity of the fluid at a second temperature, or a combination of two or more thereof.

7. The apparatus of claim 1, further comprising means for measuring pressure coupled to the flow-control means, the means for supplying the first quantity of the fluid at a first temperature, or the means for supplying the second quantity of the fluid at a second temperature, or a combination of two or more thereof.

8. The apparatus of claim 1 wherein the temperature controlled fluid comprises gaseous, liquid, supercritical, or near-supercritical carbon dioxide, or a combination of two or more thereof.

9. The apparatus of claim 1 wherein the temperature controlled fluid comprises solvents, co-solvents, or surfactants, or a combination of two or more thereof.

10. The apparatus of claim 1 further comprising a fluid source coupled to the flow-control means, the means for supplying the first quantity of the fluid at a first temperature, or the means for supplying the second quantity of the fluid at a second temperature, or a combination of two or more thereof.

11. The apparatus of claim 10, wherein the fluid source comprises substantially pure CO₂.

12. The apparatus of claim 1 further comprising a heating device coupled to the flow-control means, the means for supplying the first quantity of the fluid at a first temperature, or the means for supplying the second quantity of the fluid at a second temperature, or a combination of two or more thereof.

13. The apparatus of claim 11, wherein the heating device comprises a heat exchanger.

14. The apparatus of claim 13 wherein the heat exchanger comprises:

a thermal mass;

heating means for heating the thermal mass; and

fluid conveying means adapted and positioned to achieve heat transfer from the thermal mass, or the heating means, or a combination thereof.

15. The apparatus of claim 1 further comprising a heated storage vessel coupled to the flow-control means, the means for supplying the first quantity of the fluid at a first temperature, or the means for supplying the second quantity of the fluid at a second temperature, or a combination of two or more thereof.

16. The apparatus of claim 1, wherein the recirculation system, the processing chamber, and piping coupling the recirculation system to the processing chamber form a recirculation loop and the fluid supply subassembly comprises means for filling the recirculation loop with the temperature controlled fluid, wherein a temperature variation of the temperature controlled fluid during filling is less than approximately ten degrees Celsius.

17. The apparatus of claim 16, wherein the recirculation loop is configured for supercritical processing.

18. The apparatus of claim 1, wherein the recirculation system, the processing chamber, and piping coupling the recirculation system to the processing chamber form a recirculation loop and the fluid supply subassembly comprises means for pressurizing the recirculation loop using the temperature controlled fluid wherein a temperature variation of the temperature controlled fluid during pressurizing is less than approximately ten degrees Celsius.

19. The apparatus of claim 1, wherein the recirculation system, the processing chamber, and piping coupling the recirculation system to the processing chamber form a recirculation loop and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a push-through process in which the first volume is larger than the volume of the recirculation loop, wherein the temperature differential within the first volume of temperature controlled fluid during the push-through process is less than approximately ten degrees Celsius.

20. The apparatus of claim 1, wherein the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a push-through process in which the first volume is larger than the processing chamber volume, wherein the temperature differential within the first volume of temperature controlled fluid during the push-through process is less than approximately ten degrees Celsius.

21. The apparatus of claim 1, wherein the recirculation system, the processing chamber, and piping coupling the recirculation system to the processing chamber form a recirculation loop and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a compression cycle in which the first volume is larger than the volume of the recirculation loop, wherein the temperature differential within the first volume of temperature controlled fluid during the compression cycle is less than approximately ten degrees Celsius.

22. The apparatus of claim 1, wherein the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a compression cycle in which the first volume is larger than the processing chamber volume, wherein the temperature differential within the first volume of temperature controlled fluid during the compression cycle is less than approximately ten degrees Celsius.

23. The apparatus of claim 1, wherein the recirculation system, the processing chamber, and piping coupling the recirculation system to the processing chamber form a recirculation loop and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a decompression cycle in which the first volume is larger than the volume of the recirculation loop, wherein the temperature differential within the first volume of temperature controlled fluid during the decompression cycle is less than approximately ten degrees Celsius.

24. The apparatus of claim 1, wherein the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a decompression cycle in which the first volume is larger than the processing chamber volume, wherein the temperature differential within the first volume of temperature controlled fluid during the decompression cycle is less than approximately ten degrees Celsius.

25. The apparatus of claim 1, wherein the recirculation system, the processing chamber, and piping coupling the recirculation system to the processing chamber form a recirculation loop and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a compression cycle and means for providing a second volume of temperature controlled fluid during a decompression cycle, wherein the first volume and the second volume are larger than the volume of the recirculation loop, the temperature differential within the first volume of temperature controlled fluid during the compression cycle being less than approximately ten degrees Celsius, and the temperature differential within the second volume of temperature controlled fluid during the decompression cycle being less than approximately ten degrees Celsius.

26. The apparatus of claim 1, wherein the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a compression cycle and means for providing a second volume of temperature controlled fluid during a decompression cycle, wherein the first volume and the second volume are larger than the volume of the processing chamber, the temperature differential within the first volume of temperature controlled fluid during the compression cycle being less than approximately ten degrees Celsius, and the temperature differential within the second volume of temperature controlled fluid during the decompression cycle being less than approximately ten degrees Celsius.

27. The apparatus of claim 1, wherein the fluid supply subassembly further comprises a fluid measurement element coupled to the flow-control means for measure the temperature of temperature controlled fluid passing therethrough.

28. The apparatus of claim 1, wherein the fluid supply subassembly further comprises a fluid measurement element coupled to the flow-control means for measure the flow rate of temperature controlled fluid passing therethrough.

29. The apparatus of claim 1, wherein the fluid supply subassembly further comprises a fluid measurement element coupled to the flow-control means for measure the pressure of temperature controlled fluid passing therethrough.

30. The apparatus of claim 1, wherein the recirculation system, the processing chamber, and piping coupling the recirculation system to the processing chamber form a recirculation loop and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a system cleaning process in which the first volume is larger than the volume of the recirculation loop, wherein the temperature differential within the first volume of temperature controlled fluid during the decompression cycle is less than approximately ten degrees Celsius.

31. The apparatus of claim 1, wherein the processing chamber comprises a substrate holder that includes means for holding a substrate, and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a supercritical substrate cleaning process, wherein the temperature differential within the first volume of temperature controlled fluid during the supercritical substrate cleaning process is less than approximately five degrees Celsius.

32. The apparatus of claim 1, wherein the processing chamber comprises a substrate holder that includes means for holding a substrate, and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a supercritical substrate rinsing process, wherein the temperature differential within the first volume of temperature controlled fluid during the supercritical substrate rinsing process is less than approximately five degrees Celsius.

33. The apparatus of claim 1, wherein the processing chamber comprises a substrate holder that includes means for holding a substrate, and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a supercritical substrate curing process, wherein the temperature differential within the first volume of temperature controlled fluid during the supercritical substrate curing process is less than approximately five degrees Celsius.

34. The apparatus of claim 1, wherein the processing chamber comprises a substrate holder that includes means for holding a substrate, and the fluid supply subassembly further comprises means for providing a first volume of temperature controlled fluid during a supercritical substrate drying process, wherein the temperature differential within the first volume of temperature controlled fluid during the supercritical substrate drying process is less than approximately five degrees Celsius.

35. A method of operating a fluid supply subassembly comprising:

supplying a first quantity of a fluid at a first temperature to a flow-control means;

supplying a second quantity of a fluid at a second temperature to the flow-control means;

forming a temperature controlled fluid in the flow-control means by controlling a ratio of the first quantity of the fluid to the second quantity of the fluid;

determining a temperature of the temperature controlled fluid;

controlling the ratio of the first quantity of the fluid to the second quantity of the fluid in response to the temperature.

36. A method of operating a processing system comprising a recirculation loop including a processing chamber, a recirculation system, and piping coupling the processing chamber to the recirculation system, the method comprising:

positioning a substrate on a substrate holder in the processing chamber;

sealing the processing chamber;

pressurizing the recirculation loop to a supercritical pressure, wherein a fluid supply subassembly pressurizes the recirculation loop using a first volume of temperature controlled fluid, and wherein a temperature variation of the first volume of temperature controlled fluid during pressurizing is less than approximately ten degrees Celsius;

processing the substrate using a supercritical substrate cleaning process;

performing a push-through process, wherein the fluid supply subassembly provides a second volume of temperature controlled fluid during a push-through process, the second volume being larger than the volume of the recirculation loop, wherein the temperature differential within the second volume of temperature controlled fluid during the push-through process is less than approximately ten degrees Celsius;

performing a pressure cycling process, wherein the fluid supply subassembly provides a third volume of temperature controlled fluid during a first portion of the pressure cycling process and provides a fourth volume of temperature controlled fluid during a second portion of the pressure cycling process, the third volume and the fourth volume being larger than the volume of the recirculation loop, and wherein the temperature differential within the third volume of temperature controlled fluid being less than approximately ten degrees Celsius, and the temperature differential within the fourth volume of temperature controlled fluid being less than approximately ten degrees Celsius;

performing a chamber venting process; and

removing the substrate.

37. The method of operating a processing system as claimed in claim 36 further comprising:

supplying a first quantity of a fluid at a first temperature to the fluid supply subassembly;

supplying a second quantity of a fluid at a second temperature to the fluid supply subassembly;

forming a temperature controlled fluid in the fluid supply subassembly by controlling a ratio of the first quantity of the fluid to the second quantity of the fluid;

flowing the first volume of the temperature controlled fluid from the fluid supply subassembly;

determining a temperature of the temperature controlled fluid in the fluid supply subassembly while pressurizing the recirculation loop;

measuring the temperature of the temperature controlled fluid in the processing chamber while pressurizing the recirculation loop;

determining a temperature difference between the temperature of the temperature controlled fluid in the fluid supply subassembly and the temperature of the temperature controlled fluid in the processing chamber; and

controlling the ratio of the first quantity of the fluid to the second quantity of the fluid in response to the temperature difference.

38. The method of operating a processing system as claimed in claim 37 further comprising keeping the temperature difference less than approximately ten degrees Celsius.

39. The method of operating a processing system as claimed in claim 36 further comprising:

supplying a first quantity of a fluid at a first temperature to the fluid supply subassembly;

supplying a second quantity of a fluid at a second temperature to the fluid supply subassembly;

forming a temperature controlled fluid in the fluid supply subassembly by controlling a ratio of the first quantity of the fluid to the second quantity of the fluid;

flowing the second volume of the temperature controlled fluid from the fluid supply subassembly during the push-through process;

determining a temperature of the temperature controlled fluid in the fluid supply subassembly during the push-through process;

measuring the temperature of the temperature controlled fluid in the processing chamber during the push-through process;

determining a temperature difference between the temperature of the temperature controlled fluid in the fluid supply subassembly and the temperature of the temperature controlled fluid in the processing chamber; and

controlling the ratio of the first quantity of the fluid to the second quantity of the fluid in response to the temperature difference.

40. The method of operating a processing system as claimed in claim 39 further comprising keeping the temperature difference less than approximately ten degrees Celsius.

41. The method of operating a processing system as claimed in claim 36 further comprising:

supplying a first quantity of a fluid at a first temperature to the fluid supply subassembly;

supplying a second quantity of a fluid at a second temperature to the fluid supply subassembly;

forming a temperature controlled fluid in the fluid supply subassembly by controlling a ratio of the first quantity of the fluid to the second quantity of the fluid;

flowing the third volume of the temperature controlled fluid from the fluid supply subassembly during the first portion of the pressure cycling process;

determining a temperature of the temperature controlled fluid in the fluid supply subassembly during the first portion of the pressure cycling process;

measuring the temperature of the temperature controlled fluid in the processing chamber during the first portion of the pressure cycling process;

determining a temperature difference between the temperature of the temperature controlled fluid in the fluid supply subassembly and the temperature of the temperature controlled fluid in the processing chamber; and

controlling the ratio of the first quantity of the fluid to the second quantity of the fluid in response to the temperature difference.

42. The method of operating a processing system as claimed in claim 41 further comprising keeping the temperature difference less than approximately ten degrees Celsius.

43. The method of operating a processing system as claimed in claim 36 further comprising:

supplying a first quantity of a fluid at a first temperature to the fluid supply subassembly;

supplying a second quantity of a fluid at a second temperature to the fluid supply subassembly;

forming a temperature controlled fluid in the fluid supply subassembly by controlling a ratio of the first quantity of the fluid to the second quantity of the fluid;

flowing the fourth volume of the temperature controlled fluid from the fluid supply subassembly during the second portion of the pressure cycling process;

determining a temperature of the temperature controlled fluid in the fluid supply subassembly during the second portion of the pressure cycling process;

measuring the temperature of the temperature controlled fluid in the processing chamber during the second portion of the pressure cycling process;

determining a temperature difference between the temperature of the temperature controlled fluid in the fluid supply subassembly and the temperature of the temperature controlled fluid in the processing chamber; and

controlling the ratio of the first quantity of the fluid to the second quantity of the fluid in response to the temperature difference.

44. The method of operating a processing system as claimed in claim 42 further comprising keeping the temperature difference less than approximately ten degrees Celsius.