Heat sink apparatus for electronic device

• US 20060225867A1
• Filed: 02/03/2006
• Published: 10/12/2006
• Est. Priority Date: 04/11/2005
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kang, Jong-Tae, Park, Hee-Sung, Kim, Kwang
• Application Number:
  US11/346,196
• Publication Number:
  US 20060225867A1
• Time in Patent Office: Days
• US Class Current: 165/80.400
• CPC Class Codes: F28F 9/0263 by varying the geometry or cross-section of header box
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

A heat sink apparatus is provided for an electronic device. The heat sink apparatus includes a body in which an inlet and an outlet are formed. A heat absorbing fluid flows through a plurality of channels. An inflow guide unit has a cross-section that narrows as it extends away from the inlet to guide substantially the same amount of the heat absorbing fluid into each of the channels. An outflow guide unit formed substantially identically to the inflow guide unit guides the heat absorbing fluid from the channels to the outlet.

Claims

1. A heat sink apparatus for an electronic device, comprising:

a body in which an inlet, an outlet, and a plurality of channels are formed through which a heat absorbing fluid flows;

an inflow guide unit having a cross-section that narrows as it extends away from the inlet to guide substantially the same amount of the heat absorbing fluid into each of the channels; and

an outflow guide unit formed substantially identically to the inflow guide unit to guide the heat absorbing fluid from the channels to the outlet.

2. The heat sink apparatus of claim 1, wherein the inflow guide unit includes

an inflow guide plate, a surface of which faces the plurality of channels and is inclined towards the channels as the inflow guide plate extends further away from the inlet so that a cross-section of the inflow guide plate widens as the inflow guide plate extends away from the inlet.

3. The heat sink apparatus of claim 1, wherein the inflow guide unit includes

an inflow guide plate, a surface of which faces the plurality of channels and is curved towards the channels as the inflow guide plate extends further away from the inlet so that a cross-section of the inflow guide plate widens as the inflow guide plate extends further away from the inlet.

4. The heat sink apparatus of claim 3, wherein

the surface of the inflow guide plate facing the plurality of channels is convex.

5. The heat sink apparatus of claim 3, wherein

the surface of the inflow guide plate facing the plurality of channels is concave.

6. The heat sink apparatus of claim 1, wherein

the plurality of channels have first and second ends, and the distances between the first ends and the inflow guide unit become smaller further away from the inlet.

7. The heat sink apparatus of claim 6, wherein

the distances between the second ends and the outflow guide unit become smaller further away from the outlet.

8. The heat sink apparatus of claim 7, wherein

the first and second ends form substantially straight and parallel inclined lines extending away from the inlet and the outlet, respectively.

9. The heat sink apparatus of claim 7, wherein

the first and second ends form a concave curve extending away from the inlet and the outlet, respectively.

10. The heat sink apparatus of claim 7, wherein

the first and second ends form convex curves extending away from the inlet and the outlet, respectively

11. A heat sink apparatus for an electronic device, comprising:

a body in which an inlet, an outlet, and a plurality of channels are formed through which a heat absorbing fluid flows;

an inflow guide unit for guiding the heat absorbing fluid to flow into the plurality of channels; and

an outflow guide unit for guiding the heat absorbing fluid from the plurality of channels to the outlet;

wherein the plurality of channels are disposed to respectively extend further towards the inlet guide unit and the outlet guide unit as the plurality of channels are disposed further away from the inlet and the outlet, respectively, such that cross-sections of the inlet guide unit and the outlet guide unit narrow as inlet and outlet guide units respectively extend away from the inlet and the outlet, thereby allowing substantially the same amount of the heat absorbing fluid to flow through each of the plurality of channels.

12. The heat sink apparatus of claim 11, wherein

ends of the plurality of channels respectively corresponding to the inlet guide unit and the outlet guide unit respectively form inclined lines substantially parallel to each other.

13. The heat sink apparatus of claim 11, wherein

ends of the channels respectively corresponding to the inlet guide unit and the outlet guide unit respectively form convex curves.

14. The heat sink apparatus of claim 11, wherein

ends of the channels respectively corresponding to the inlet guide unit and the outlet guide unit respectively form concave lines.