Chip card including tamper-proof security features
First Claim
1. A chip card, comprising:
- a card body, and chip module embedded in said card body and incorporating an integrated circuit, said card body including at least one security feature incorporated in a layer, or applied on a surface, of the card body, wherein said card body comprises an additional tamper-detection layer including a conductive pattern forming an electrical loop connected between terminals of the integrated circuit, said conductive pattern having at least one region located beneath or above said security feature, and wherein said integrated circuit is adapted to perform an integrity check of said conductive pattern for conditionally performing further operations only in case said integrity is recognized.
2 Assignments
0 Petitions
Accused Products
Abstract
The chip card comprises a card body (10) and a chip module (12) embedded in the card body and incorporating an integrated circuit. The card body includes at least one security feature (20, 22) incorporated in a layer, or applied on a surface, of the card body. An additional tamper-detection layer (26) is provided including a conductive pattern (28) forming an electrical loop connected between terminals of the integrated circuit, said conductive pattern having at least one region located beneath or above said security feature (20, 22). The integrated circuit is adapted to perform an integrity check of said conductive pattern for conditionally performing further operations only in case said integrity is recognized.
-
Citations
7 Claims
-
1. A chip card, comprising:
-
a card body, and chip module embedded in said card body and incorporating an integrated circuit, said card body including at least one security feature incorporated in a layer, or applied on a surface, of the card body, wherein said card body comprises an additional tamper-detection layer including a conductive pattern forming an electrical loop connected between terminals of the integrated circuit, said conductive pattern having at least one region located beneath or above said security feature, and wherein said integrated circuit is adapted to perform an integrity check of said conductive pattern for conditionally performing further operations only in case said integrity is recognized. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
Specification