Keyboard module heat dissipation film

• US 20060227503A1
• Filed: 08/08/2005
• Published: 10/12/2006
• Est. Priority Date: 04/19/2005
• Status: Abandoned Application

• Current Assignee: Quanta Computer
• Original Assignee: Quanta Computer
• Inventors: Ho, Su-O, Lee, Kun-Ho, Chen, I-Hao, Liao, Shun-Yung
• Application Number:
  US11/198,157
• Publication Number:
  US 20060227503A1
• Time in Patent Office: Days
• US Class Current: 361/679.80
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops

Abstract

A keyboard module heat dissipation film is described. The keyboard module heat dissipation film is utilized in a notebook computer and can endure a working temperature of interior components in the notebook computer. The film is made of a water repellent material and includes a plurality of needle apertures to allow the cooling air passing therethrough. Dropped water can form sweat on the surface of the film due to the water repellent property of the film so as to prevent from dropping into the notebook computer.

Claims

1. A keyboard module heat dissipation film inside a notebook computer and fixed on a keyboard module, the heat dissipation film being a film made of a water repellent material that endures a working temperature of interior components in the notebook computer and comprises a plurality of needle apertures.

2. The keyboard module heat dissipation film of claim 1, wherein the water repellent material includes PE and PP.

3. The keyboard module heat dissipation film of claim 1 comprising a melt-blown nonwoven fabric.

4. The keyboard module heat dissipation film of claim 3, wherein the melt-blown nonwoven fabric has a density of 35 g/mm².

5. The keyboard module heat dissipation film of claim 1, wherein the density of the needle apertures includes the specification of 200 meshes.

6. The keyboard module heat dissipation film of claim 1 attached to the keyboard module.

7. The keyboard module heat dissipation film of claim 1 fixed on the keyboard module using a fixing device.

8. The keyboard module heat dissipation film of claim 1 fixed on the notebook using a fixing device.

9. The keyboard module heat dissipation film of claim 1 fixed between the keyboard module and the interior components.

11. The keyboard module of claim 1, wherein the water repellent material includes PE and PP.

12. The keyboard module of claim 1 comprising a melt-blown nonwoven fabric.

13. The keyboard module of claim 12, wherein the melt-blown nonwoven fabric has a density of 35 g/mm².

14. The keyboard module of claim 1, wherein the density of the needle apertures includes the specification of 200 meshes.

15. The keyboard module of claim 1, wherein the heat dissipation film is fixed on the back and attached to the keyboard module.

16. The keyboard module of claim 15, wherein the heat dissipation film is fixed on the keyboard module using a fixing device.

17. The keyboard module of claim 1, wherein the heat dissipation film is fixed inside the notebook using a fixing device.

18. The keyboard module of claim 1, wherein the heat dissipation film is fixed between the keyboard module and the interior components.

10. A keyboard module with a heat dissipation film for a notebook computer, the notebook computer including a plurality of interior components, and the heat dissipation film being made of a water repellent material that endures a working temperature of the interior components in the notebook computer and comprises a plurality of needle apertures.