Electrical interconnect

• US 20060228140A1
• Filed: 03/31/2005
• Published: 10/12/2006
• Est. Priority Date: 03/31/2005
• Status: Active Grant

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Swift, Joseph A., Wallace, Stanley John
• Granted Patent: US 8,018,059 B2
• Time in Patent Office: Days
• US Class Current: 399/411
• CPC Class Codes: G03G 15/80 Details relating to power supplies, circuits boards, electrical connections
• CPC Class Codes: Y10S 428/903 Microfiber, less than 100 micron diameter

Abstract

An electrical interconnect includes an electrical pathway having a first member a second member, the first member being disposed at an oblique or perpendicular angle to the second member at a location adjacent to the second member, wherein at least one of the first member and the second member have a cross-sectional dimension of less than or equal to 10 micrometers.

Claims

1. An interconnect comprising, an electrical pathway including a first member and a second member, the first member being disposed at an oblique or perpendicular angle to the second member at a location adjacent to the second member;

wherein the first member and the second member have a cross-sectional dimension of less than or equal to 100 micrometers.

2. The interconnect of claim 1, wherein at least one of the first member or the second member is formed of a material that does not permanently deform until being subjected to an elongation of greater than approximately 2%.

3. The interconnect of claim 1, wherein at least one of the first member or the second member has an aspect ratio of at least 100.

4. The interconnect of claim 1, wherein the first member and the second member share multiple common electrical contact points, thereby having connection redundancy between at least a first point and a second point.

5. The interconnect of claim 1, wherein the electrical pathway forms a structural support.

6. The interconnect of claim 1, wherein the electrical pathway has a contact point for an electrical interface, and the contact point has a cross-sectional area less than or equal to approximately 7850 square micrometers.

7. The interconnect of claim 1, wherein at least one of the first member or second member are formed of carbon.

8. A xerographic device comprising the interconnect of claim 1.

9. The interconnect of claim 1, wherein the electrical pathway is formed of a composition comprising a metallic element.

10. The interconnect of claim 1, wherein the electrical pathway includes a matrix of other material.

11. The interconnect of claim 10, wherein the other material is a polymer resin and the polymer resin contains at least one of a clay, a silica or a titania material.

12. The interconnect of claim 10, wherein the other material is a polymer resin and the polymer resin contains a thermosetting polymer, the thermosetting polymer providing in-process handling and shaping of the interconnect prior to, generally, completely curing.

13. The interconnect of claim 10, wherein the other material is a polymer resin and the polymer resin contains conductive ceramic materials.

14. The interconnect of claim 10, wherein the other material is a polymer resin and the polymer resin contains a nanoelement.

15. The interconnect of claim 14, wherein the nanoelement is formed of at least one of nickel, titanium, tungsten, copper, boron, tin, lead or a noble metal.

16. The interconnect of claim 14, wherein the nanoelement is formed of carbon.

17. An interconnect comprising,

an electrical pathway including a first member having a cross-sectional dimension of less than or equal to 100 micrometers.

18. The interconnect of claim 17, wherein the electrical pathway has a contact point for an electrical interface, and the contact point has a cross-sectional area less than or equal to approximately 7850 square micrometers.

19. A xerographic device comprising the interconnect of claim 17.

20. A method of forming an electrical interconnect comprising, forming a sheet including a first layer of multiple, generally, parallel members of a material in a matrix of other material, the other material including a thermosetting polymer;

cutting an area of the first layer into an initial shape, the area having a first electrical contact point and a second electrical contact point;

at least one of heating or pressurizing the area;

allowing the thermosetting polymer to partially cross-link and cure;

mechanically deforming the area;

allowing the thermosetting polymer to further cross-link and cure; and

inserting the first point into an electrical interface and the second point into another electrical interface.