Semiconductor package repair method

• US 20060228878A1
• Filed: 03/24/2006
• Published: 10/12/2006
• Est. Priority Date: 04/06/2005
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Kyung-Du, Oh, Hyun-Jong, Kim, Yong-Hyun, Park, Chang-Yong, Chun, Kwang-Ho, Kim, Byung-Man
• Application Number:
  US11/387,801
• Publication Number:
  US 20060228878A1
• Time in Patent Office: Days
• US Class Current: 438/613
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/15331 being a ball array, e.g. BGA
• CPC Class Codes: H05K 2201/10992 Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3463 Solder compositions in relation to features of the printed circuit board or the mounting process
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A lower-melting-point solder having a lower melting point than solder balls is used to bond the solder balls with a module substrate. The lower-melting-point solder has a melting point lower than the solder balls. A bonding temperature is at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls.

Claims

1. A method of bonding a ball grid array (BGA) package, comprising:

providing a lower-melting-point solder on solder balls of the BGA package; and

bonding the lower-melting-point solder on the solder balls to a module substrate at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls,

wherein the lower-melting-point solder has a melting point lower than the solder balls.

2. The method of claim 1, wherein the solder balls and the lower-melting point solder are each selected from solder materials consisting of Sn/Pb, Sn/Ag/Cu, Sn/Ag, Sn/Cu, Sn/Bi, Sn/Zn/Bi, Sn/Ag/Bi, Sn/Ag/Zn, In/Sn, In/Ag, Sn/Pb/Ag, In/Pb, Sn, Sn/Pb/Bi, and Sn/Pb/Bi/Ag.

3. The method of claim 2, wherein the solder balls are formed of Sn/Ag/Cu having a distribution ratio of 96.5/3/0.5 and a melting point of about 217°

C., and the lower-melting-point solder is formed of Sn/Pb having a distribution ratio of 63/37 and a melting point of about 183°

C.

4. The method of claim 1, wherein providing the lower-melting-point solder includes placing a stencil on the solder balls, the stencil having openings formed corresponding to locations of the solder balls, providing the lower-melting-point solder on the stencil, and applying the lower-melting-point solder into the openings.

5. The method of claim 4, wherein a diameter of the opening is smaller than a diameter of the solder balls.

6. The method of claim 1, wherein the bonding of the lower-melting-point solder to the module substrate is a solder reflow process including preheating and stabilizing.

7. The method of claim 3, wherein the bonding of the lower-melting-point solder to the module substrate is a solder reflow process including preheating and stabilizing, and wherein a peak temperature is between about 210°

C. and 230°

C.

8. The method of claim 7, wherein a preheating temperature is between about 140°

C. and 160°

C. and a preheating gradient is between about 1.6/sec and 2.5/sec, and a stabilization temperature is between about 155°

C. and 175°

C. and a stabilization time is between about 60 seconds and 100 seconds.

9. The method of claim 1, wherein the BGA package is a BGA stack package.

10. The method of claim 1, wherein the lower-point-melting solder of the solder balls are bonded to substrate pads on the module substrate.

11. A method of repairing a ball grid array (BGA) package, comprising:

removing a defective BGA package from a module substrate;

providing a lower-melting-point solder on solder balls of a replacement BGA package; and

bonding the lower-melting-point solder on the solder balls to the module substrate at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls,

wherein the lower-melting-point solder has a melting point lower than the solder balls.

12. The method of claim 11, wherein the solder balls and the lower-melting point solder are each selected from solder materials consisting of Sn/Pb, Sn/Ag/Cu, Sn/Ag, Sn/Cu, Sn/Bi, Sn/Zn/Bi, Sn/Ag/Bi, Sn/Ag/Zn, In/Sn, In/Ag, Sn/Pb/Ag, In/Pb, Sn, Sn/Pb/Bi, and Sn/Pb/Bi/Ag.

13. The method of claim 12, wherein the solder balls are formed of Sn/Ag/Cu having a distribution ratio of 96.5/3/0.5 and a melting point of 217°

C., and the lower-melting-point solder is formed of Sn/Pb having a distribution ratio of 63/37 and a melting point of 183°

C.

14. The method of claim 11, wherein forming the lower-melting-point solder includes placing a stencil on the solder balls, the stencil having openings formed corresponding to locations of the solder balls, providing the lower-melting-point solder on the stencil, and applying the lower-melting-point solder into the openings.

15. The method of claim 14, wherein a diameter of the opening is smaller than a diameter of the solder balls.

16. The method of claim 11, wherein the bonding of the lower-melting-point solder to the module substrate is a solder reflow process including a preheating step and a stabilization step.

17. The method of claim 13, wherein the bonding of the lower-melting-point solder to the module substrate is a solder reflow process including a preheating step and a stabilization step, and wherein a peak temperature is between about 210°

C. and 230°

C.

18. The method of claim 17, wherein a preheating temperature is between about 140°

C. and 160°

C. and a preheating gradient is between about 1.6/sec and 2.5/sec, and a stabilization temperature is between about 155°

C. and 175°

C. and a stabilization time is between about 60 seconds and 100 seconds.

19. The method of claim 11, wherein the BGA package is a BGA stack package.

20. The method of claim 11, wherein the lower-point-melting solder of the solder balls are bonded to substrate pads on the module substrate.