Methods of removing resist from substrates in resist stripping chambers

• US 20060228889A1
• Filed: 03/31/2005
• Published: 10/12/2006
• Est. Priority Date: 03/31/2005
• Status: Abandoned Application

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Kuo, Jack K., Edelberg, Erik A., Lo, Gladys S.
• Application Number:
  US11/094,689
• Publication Number:
  US 20060228889A1
• Time in Patent Office: Days
• US Class Current: 438/689
• CPC Class Codes: G03F 7/427 using plasma means only
• CPC Class Codes: H01J 2237/3342 Resist stripping
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01L 21/31138 by dry-etching

Abstract

Methods for stripping resist from a semiconductor substrate in a resist stripping chamber are provided. The methods include producing a remote plasma containing reactive species and cooling the reactive species inside the chamber prior to removing the resist with the reactive species. The reactive species can be cooled by being passed through a thermally-conductive gas distribution member. By cooling the reactive species, damage to a low-k dielectric material on the substrate can be avoided.

Claims

1. A method of stripping resist from a semiconductor substrate in a resist stripping chamber, comprising:

providing a semiconductor substrate in a resist stripping chamber, the semiconductor substrate including a low-k dielectric material and a resist layer overlying the low-k dielectric material, the low-k dielectric material having a thermal degradation temperature;

producing a remote plasma from a process gas and supplying therefrom a gas containing reactive species at a temperature above the thermal degradation temperature of the low-k dielectric material into the resist stripping chamber;

cooling the reactive species in the plasma stripping chamber to a temperature below the thermal degradation temperature of the dielectric material; and

stripping the resist layer from the semiconductor substrate with the cooled reactive species such that the semiconductor substrate does not exceed the thermal degradation temperature of the low-k dielectric material.

2. The method of claim 1, wherein the cooling comprises passing the reactive species through flow passages of a thermally-conductive gas distribution member facing the semiconductor substrate.

3. The method of claim 2, wherein the gas distribution member is of aluminum and has an outer aluminum oxide layer.

4. The method of claim 2, wherein the gas distribution member thermally contacts a portion of the resist stripping chamber that is at a temperature below the thermal degradation temperature of the low-k dielectric material.

5. The method of claim 4, wherein the gas distribution member and the portion of the resist stripping chamber are at approximately the same temperature during the resist stripping.

6. The method of claim 4, wherein the portion of the resist stripping chamber is actively cooled.

7. The method of claim 1, wherein the semiconductor substrate is supported on a support surface of a substrate support, the substrate support includes a heater which heats the support surface to a temperature below the thermal degradation temperature of the low-k dielectric material.

8. The method of claim 1, wherein the remote plasma is produced by applying power to the process gas using a microwave energy source.

9. The method of claim 8, wherein the low-k dielectric material is an organic low-k dielectric material.

10. The method of claim 1, comprising consecutively processing a plurality of the semiconductor substrates in the resist stripping chamber such that each of the semiconductor substrates is maintained at a temperature that does not exceed the thermal degradation temperature of the low-k dielectric material during the stripping of the resist layer.

11. The method of claim 1, wherein the process gas comprises oxygen, hydrogen and fluorine.

12. A method of stripping resist from a semiconductor substrate in a resist stripping chamber, comprising:

providing a semiconductor substrate in a resist stripping chamber, the semiconductor substrate including an organic low-k dielectric material and a resist layer overlying the low-k dielectric material, the low-k dielectric material having a thermal degradation temperature;

producing a remote plasma from a process gas and supplying therefrom a gas containing reactive species at a temperature above the thermal degradation temperature of the low-k dielectric material into the resist stripping chamber;

passing the reactive species through flow passages of a thermally-conductive gas distribution member facing the semiconductor substrate, thereby cooling the reactive species to a temperature below the thermal degradation temperature of the low-k dielectric material; and

stripping the resist layer from the semiconductor substrate with the cooled reactive species such that the semiconductor substrate does not exceed the thermal degradation temperature of the low-k dielectric material.

13. The method of claim 12, wherein the gas distribution member thermally contacts a wall of the resist stripping chamber that is at a temperature below the thermal degradation temperature of the low-k dielectric material.

14. The method of claim 13, wherein the gas distribution member and the wall are at approximately the same temperature during the resist stripping.

15. The method of claim 13, comprising actively cooling the wall.

16. The method of claim 12, wherein the semiconductor substrate is supported on a support surface of a substrate support, the substrate support includes a heater which heats the support surface to a temperature below the thermal degradation temperature of the low-k dielectric material.

17. The method of claim 16, wherein:

the thermal degradation temperature of the low-k dielectric material is about 100°

C.; and

the support surface is heated to a temperature of from about 25°

C. to about 95°

C. by the heater.

18. The method of claim 17, wherein the reactive species are supplied into the resist stripping chamber at a temperature of up to about 225°

C. prior to passing through the gas distribution member.

19. The method of claim 12, wherein:

the thermal degradation temperature of the low-k dielectric material is about 100°

C.; and

the reactive species are supplied into the resist stripping chamber at a temperature of up to about 225°

C. prior to passing through the gas distribution member.

20. The method of claim 12, wherein the chamber wall is cooled to a temperature of from about 20°

C. to about 35°

C. during the resist stripping.

21. The method of claim 12, wherein the remote plasma is produced by applying microwave energy to the process gas at a power level of from about 2000 W to about 3000 W.

22. The method of claim 12, comprising consecutively processing a plurality of the semiconductor substrates in the resist stripping chamber such that each of the semiconductor substrates is maintained at a temperature that does not exceed the thermal degradation temperature of the low-k dielectric material during the stripping of the resist layer.

23. The method of claim 12, wherein the process gas comprises oxygen, hydrogen and fluorine.

24. A method of stripping resist from a semiconductor substrate in a resist stripping chamber, comprising:

supporting a semiconductor substrate on a support surface in a resist stripping chamber, the semiconductor substrate including a resist layer overlying an organic low-k dielectric material having a thermal degradation temperature;

heating the support surface to a temperature below the thermal degradation temperature of the low-k dielectric material;

applying energy to a process gas using a microwave energy source to produce a remote plasma and supplying reactive species therefrom at a temperature above the thermal degradation temperature of the low-k dielectric material into the resist stripping chamber;

cooling the reactive species to a temperature below the thermal degradation temperature of the low-k dielectric material inside the resist stripping chamber; and

removing the resist layer from the semiconductor substrate with the cooled reactive species such that the semiconductor substrate does not exceed the thermal degradation temperature of the low-k dielectric material.

25. The method of claim 24, comprising consecutively processing a plurality of the semiconductor substrates in the resist stripping chamber such that each of the semiconductor substrates is maintained at a temperature that does not exceed the thermal degradation temperature of the low-k dielectric material during the stripping of the resist layer.

26. The method of claim 24, wherein the process gas comprises oxygen, hydrogen and fluorine.