Wireless communication module

• US 20060229013A1
• Filed: 01/25/2006
• Published: 10/12/2006
• Est. Priority Date: 04/08/2005
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Lin, Chin-Shan, Shih, Chen-Yen
• Application Number:
  US11/338,682
• Publication Number:
  US 20060229013A1
• Time in Patent Office: Days
• US Class Current: 455/41.200
• CPC Class Codes: H01Q 9/28 Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00

Abstract

A wireless communication module. A base includes a first surface and a at least one cavity formed on the first surface. First electronic element is disposed within the cavity. A plate includes a second surface. A wireless transmitting element is formed on a second surface in a patterning method and exposed to the outside of the wireless communication module. The plate is coupled to the base.

Claims

1. A wireless communication module comprising:

a base comprising a first surface and at least one cavity formed on the first surface;

a first electronic element disposed within the cavity;

a plate comprising a second surface; and

a wireless transmitting element formed on a second surface in a patterning method and exposed to the outside of the wireless communication module, wherein the plate is coupled to the base.

2. The wireless communication module as claimed in claim 1, wherein the wireless communication module is a bluetooth module.

3. The wireless communication module as claimed in claim 1, wherein the first electronic element is disposed within the cavity using a surface mounting technology (SMT).

4. The wireless communication module as claimed in, claim 1, wherein the first electronic element comprises at least one active component and a plurality of passive components.

5. The wireless communication module as claimed in claim 4, wherein the active component is a bluetooth single-chip and the passive components comprise a resistor and a capacitor.

6. The wireless communication module as claimed in claim 1, wherein the base is a multi-layer ceramic structure formed by a low temperature co-fire ceramic (LTCC) technology.

7. The wireless communication module as claimed in claim 6, further comprising a second electronic element formed in the multi-layer ceramic structure by a patterning method.

8. The wireless communication module as claimed in claim 6, wherein the second electronic element comprises passive components selected from a group of a filter, a balance-unbalance converter, an inductor, a capacitor, or a resistor.

9. The wireless communication module as claimed in claim 1, further comprising a plurality of connection pads disposed on the first surface, wherein the plate is coupled to the base through the connection pads.

10. The wireless communication module as claimed in claim 9, wherein each of the connection pads is a surface mounting bonding pad or a die bond bonding pad.

11. The wireless communication module as claimed in claim 1, wherein the wireless transmitting element is an antenna.

12. The wireless communication module as claimed in claim 1, wherein the wireless transmitting element is formed by an ink printing method or an etching method.

13. The wireless communication module as claimed in claim 1, wherein the material of the wireless transmitting element is a metal material.

14. The wireless communication module as claimed in claim 1, wherein the plate is made of a material with a low permittivity selected from a group of a glass fiber, an organic compound, or a polytetra-fluoroethylene (PTFE).

15. A wireless communication module comprising:

a signal processing module; and

a wireless transmitting module comprising;

a plate; and

a wireless transmitting element formed on a surface of the plate by a patterning method;

wherein the signal processing module overlaps the wireless transmitting module such that the wireless transmitting element is exposed to the outside of the wireless communication module.

16. The wireless communication module as claimed in claim 15, wherein the signal processing module is a bluetooth module.

17. The wireless communication module as claimed in claim 15, wherein the signal processing module is a multi-layer ceramic structure,formed by a low temperature co-fire ceramic (LTCC) technology.

18. The wireless communication module as claimed in claim 17, wherein the signal processing module comprises:

a plurality of cavities; and

a plurality of first electronic elements respectively embedded in the cavities.

19. The wireless communication module as claimed in claim 18, wherein the first electronic elements comprise at least one active component and a plurality of passive components.

20. The wireless communication module as claimed in claim 17, wherein the signal processing module further comprises a plurality of second electronic elements formed in the multi-layer ceramic structure by the patterning method.

21. The wireless communication module as claimed in claim 20, wherein the second electronic elements are passive components selected form a group of a filter, a balance-unbalance converter, an inductor, a capacitor, or a resistor.

22. The wireless communication module as claimed in claim 15, wherein the signal processing module further comprises a plurality of connection pads coupled to the wireless transmitting module.

23. The wireless communication module as claimed in claim 22, wherein each of the connection pads is a surface mounting bonding pad or a die bond bonding pad.