Tape-manufacturing system having extended operational capabilities

• US 20060231033A1
• Filed: 06/13/2006
• Published: 10/19/2006
• Est. Priority Date: 11/04/2003
• Status: Active Grant

• Current Assignee: Superpower, Inc. (Furukawa Electric Company Limited)
• Original Assignee: Superpower, Inc. (Furukawa Electric Company Limited)
• Inventors: Selvamanickam, Venkat
• Granted Patent: US 7,914,848 B2
• Time in Patent Office: Days
• US Class Current: 118/723.EB
• CPC Class Codes: C23C 14/087 of copper or solid solutions thereof
• CPC Class Codes: C23C 14/22 characterised by the process of coating
• CPC Class Codes: C23C 14/30 by electron bombardment
• CPC Class Codes: C23C 14/54 Controlling or regulating the coating process
• CPC Class Codes: C23C 14/562 for coating elongated substrates
• CPC Class Codes: H10N 60/0381 by evaporation independent of heat source, e.g. MBE

Abstract

A tape-manufacturing system for coating at least one tape substrate such as, for example, for the manufacture of a high-temperature superconductor (HTS) conductor is disclosed. The tape-manufacturing system includes at least two electron beam (e-beam) deposition sources, at least one assist source and, optionally, a controller. Each e-beam deposition source may be in-process repairable. Each e-beam deposition source is capable of communicating an evaporant material with at least a portion of at least one tape substrate to deposit a coating thereon. The at least one assist source is capable of communicating a beam of a species to the coating. The controller communicates with the at least two e-beam deposition sources and the at least one assist source.

Claims

1-65. -65. (canceled)

66. A method for coating at least one tape substrate said method comprising the steps of:

providing at least a portion of at least one tape substrate to an enlarged deposition zone, defined by least two electron beam (e-beam) deposition sources;

communicating an evaporant material with the at least a portion of at least one tape substrate to deposit a coating thereon;

communicating an assist beam of a species to the evaporant material communicating with the at least a portion of at least one tape substrate such that the coating is biaxially textured;

providing at least another portion of at least one tape substrate to the enlarged deposition zone;

communicating an evaporant material with the at least another portion of at least one tape substrate to deposit a coating thereon;

communicating an assist beam of the species to the evaporant material communicating with the at least another portion of at least one substrate such that the coating is biaxially textured; and

.

67. The method of claim 66, wherein the at least two electron beam (e-beam) deposition sources are capable of in-process repair.

68. (canceled)

69. A method of forming a high temperature superconducting (HTS) conductor structure, comprising the steps of:

translating a tape substrate through an evacuated chamber of a manufacturing system, the evacuated chamber having (i) a plurality of e-beam sources arranged serially to create an elongated coating deposition zone along a length of the tape substrate, the plurality of e-beam sources including first and second e-beam sources, and (ii) at least one material source;

operating the plurality of e-beam sources to form evaporant material from the at least one material source;

irradiating the evaporant material with a species from an assist source such that the evaporant material deposits on the tape substrate to form a biaxially textured coating on the tape substrate; and

repairing the first e-beam source while maintaining vacuum in the evacuated chamber.

70. The method of claim 69, further comprising monitoring wear the first e-beam source.

71. The method of claim 70, wherein wear is monitored by monitoring a change in resistance the first e-beam source.

72. The method of claim 69, wherein the first e-beam source has a line of sight to the substrate as the substrate translates through the evacuated chamber, the method further comprising blocking the line of sight of the first e-beam source to isolate the first e-beam source from the substrate.

73. The method of claim 72, wherein the first e-beam source has a plurality of filaments, and repairing is carried out by shutting down the first e-beam source and switching operation from one filament to another filament of the first e-beam source.

74. The method of claim 72, wherein the manufacturing system includes an auxiliary vacuum chamber in communication with evacuated chamber, and repairing is carried out by retracting the first e-beam source into the auxiliary chamber, closing off the auxiliary chamber from the evacuated chamber, accessing first e-beam source in the auxiliary chamber while vacuum in the evacuated chamber is maintained.

75. The method of claim 74, further comprising reestablishing vacuum in the auxiliary chamber after repairing the first e-beam source, followed by reestablishing communication between the auxiliary chamber and the evacuated chamber.

76. The method of claim 69, wherein translation of the tape substrate and deposition of the biaxially textured coating thereon is continued during repairing.

77. The method of claim 76, wherein translating is carried out at a reduced translational velocity during repairing.

78. The method of claim 69, wherein the biaxially textured coating consist essentially of MgO or YSZ.

79. The method of claim 69, wherein the biaxially textured coating is deposited at a rate of at least 1 Angstrom per second.

80. The method of claim 69, wherein the first and second e-beam sources have first and second evaporant material flux profiles that are superimposed to form a substantially flat combined evaporant material flux profile.

81. The method of claim 69, wherein the assist source is oriented such that a beam of the species from the assist source form an incident angle between 30 degrees and 50 degrees with respect to a surface of the tape substrate.

82. The method of claim 81, wherein the assist source is an ion source, the species from the assist source comprising ions.

83. The method of claim 81, wherein the beam of species from the assist source is collimated.

84. A method of forming a high temperature superconducting (HTS) conductor structure, comprising the steps of:

translating a tape substrate through an evacuated chamber of a manufacturing system, the evacuated chamber having (i) a plurality of e-beam sources arranged serially to create an elongated coating deposition zone along a length of the tape substrate, the plurality of e-beam sources including first and second e-beam sources and the first e-beam source having a line of sight to the substrate as the substrate translates through the evacuated chamber, and (ii) at least one material source;

operating the plurality of e-beam sources to form evaporant material from the at least one material source;

irradiating the evaporant material with a species from the an assist source such that the evaporant material deposits on the tape substrate to form a biaxially textured coating on the tape substrate;

monitoring wear of the first e-beam source;

blocking the line of sight of the first e-beam source to isolate the first e-beam source from the substrate; and

repairing the first e-beam source while maintaining vacuum in the evacuated chamber.