Manufacturing process: how to construct constraining core material into printed wiring board

• US 20060231198A1
• Filed: 03/15/2006
• Published: 10/19/2006
• Est. Priority Date: 03/15/2005
• Status: Abandoned Application

• Current Assignee: Stablcor, Inc.
• Original Assignee: Stablcor, Inc.
• Inventors: Vasoya, Kalu K.
• Application Number:
  US11/376,806
• Publication Number:
  US 20060231198A1
• Time in Patent Office: Days
• US Class Current: 156/256
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/029 Woven fibrous reinforcement or textile
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/09718 Clearance holes
• CPC Class Codes: H05K 2203/056 Using an artwork, i.e. a photomask for exposing photosensitive layers
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0008 for aligning or positioning of tools relative to the circuit board H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015
• CPC Class Codes: H05K 3/0047 Drilling of holes
• CPC Class Codes: H05K 3/0082 characterised by the exposure method of radiation-sensitive masks
• CPC Class Codes: H05K 3/064 Photoresists
• CPC Class Codes: H05K 3/4638 Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores
• CPC Class Codes: Y10T 156/1062 Prior to assembly

Abstract

Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.

Claims

1. A process for manufacturing a printed wiring board, comprising:

aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references; and

forming tooling holes in the panel of electrically conductive material.

2. The process of claim 1, wherein the pair of references include:

at least two mounting pins positioned along a first line;

at least two mounting pins positioned along a second line; and

wherein the first and second lines intersect at a right angle.

3. The process of claim 1, wherein the pair of references include:

a first reference edge; and

a second reference edge;

wherein the first and second reference edges meet at a right angle.

4. The process of claim 1, wherein the tooling holes are formed using a drill.

5. The process of claim 1, wherein the tooling holes are formed using a punch.

6. A process for manufacturing a printed wiring board comprising:

forming a first set of tooling holes in a panel of electrically conductive material;

drilling clearance holes having a first diameter in the electrically conductive panel;

forming a stack of panels by aligning the panel of electrically conductive material with other layers of material using the first set of tooling holes; and

laminating the stack of panels.

7. The process of claim 7, further comprising drilling through holes having a second diameter less than the first diameter through the laminated stack.

8. The process of claim 8, further comprising using the first set of tooling holes as a reference to determine the locations in which to drill the through holes.

9. The process of claim 8, further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

drilling a second set of tooling holes in predetermined locations relative to the at least one reference hole.

10. The process of claim 8, further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

punching a second set of tooling holes in predetermined locations relative to the at least one reference hole.

11. The process of claim 8, further comprising:

aligning artwork against the electrically conductive panel;

screening photoresist over the artwork; and

etching the electrically conductive panel.

12. The process of claim 8, wherein aligning the artwork comprises:

punching holes corresponding to the first set of tooling holes in the artwork; and

aligning the artwork and the electrically conductive panel using the first set of tooling holes.

13. A process for manufacturing a printed wiring board comprising:

forming a first set of tooling holes in a panel of electrically conductive material;

drilling clearance holes having a first diameter in the electrically conductive panel;

forming a second set of tooling holes through the panel of electrically conductive material;

forming a stack of panels by aligning the panel of electrically conductive material with other layers of material using the second set of tooling holes; and

laminating the stack of panels.

14. The process of claim 13, wherein the forming of a second set of tooling holes further comprises:

using the first set of tooling holes as a reference to locate predetermined locations; and

drilling the second set of tooling holes at the predetermined locations.

15. The process of claim 13, wherein the forming of a second set of tooling holes further comprises:

using the first set of holes as a reference to locate at least one predetermined location;

drilling a reference hole in the at least one predetermined location;

using an optical vision system to locate the reference hole; and

using the optical vision system to punch the second set of tooling holes in predetermined locations relative to the reference hole.

16. The process of claim 13, further comprising drilling through holes having a second diameter less than the first diameter through the laminated stack.

17. The process of claim 13, further comprising using either the first or the second set of tooling holes as a reference to determine the locations in which to drill the through holes.

18. The process of claim 13, further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

drilling a second set of tooling holes in predetermined locations relative to the at least one reference hole.

19. The process of claim 13, further comprising:

drilling at least one reference hole;

using an optical vision system to locate the at least one reference hole; and

punching a second set of tooling holes in predetermined locations relative to the at least one reference hole.

20. The process of claim 13, further comprising:

aligning artwork against the electrically conductive panel;

screening photoresist over the artwork; and

etching the electrically conductive panel.

21. The process of claim 20, wherein aligning the artwork comprises:

punching holes corresponding to the first set of tooling holes in the artwork; and

aligning the artwork and the electrically conductive panel using the first set of tooling holes.

22. An optical vision system, comprising:

an X-ray light source;

an X-ray detector configured to generate an output indicative of the regions of the detector on which light is incident; and

a processor connected to the X-ray detector and configured to identify a circular pattern using the output of the X-ray detector.

23. A process for manufacturing a printed wiring board, comprising:

drilling clearance holes in an electrically conductive panel of material;

routing channels in the electrically conductive panels of material laminating the electrically conductive panels with other panels of material to form an array of printed wiring board sub-assemblies;

drilling through holes through each of the printed wiring boards in the array of printed wiring board subassemblies;

plating the linings of the through holes; and

testing each printed wiring board in the array of printed wiring boards.

24. The process of claim 23, wherein the channels are routed in locations that electrically isolate each printed wiring board from the other printed wiring boards in the array of printed wiring boards.