Composite insulation tape with loaded HTC materials

• US 20060231201A1
• Filed: 04/03/2006
• Published: 10/19/2006
• Est. Priority Date: 04/15/2005
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Power Generation, Inc.
• Inventors: Wood, John W., Stevens, Gary, Smith, James D. B.
• Granted Patent: US 7,776,392 B2
• Time in Patent Office: Days
• US Class Current: 156/307.300
• CPC Class Codes: B32B 2255/04 on a particulate layer
• CPC Class Codes: B32B 2255/24 Organic non-macromolecular coating
• CPC Class Codes: B32B 2260/021 Fibrous or filamentary layer
• CPC Class Codes: B32B 2260/025 Particulate layer
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2264/102 Oxide or hydroxide
• CPC Class Codes: B32B 2264/104 Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
• CPC Class Codes: B32B 2264/108 Carbon, e.g. graphite particles
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2405/00 Adhesive articles, e.g. adhesive tapes
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2581/00 Seals; Sealing equipment; Gaskets
• CPC Class Codes: B32B 2605/00 Vehicles
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 29/02 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 5/16 characterised by features of a layer formed of particles, e.g. chips, powder or granules layer formed of natural mineral particles B32B19/00; layer being formed of wood fibres, chips or particles B32B21/02
• CPC Class Codes: B32B 5/24 one layer being a fibrous or filamentary layer
• CPC Class Codes: B32B 5/30 one layer being formed of particles, e.g. chips, granules, powder
• CPC Class Codes: H01B 3/004 with conductive additives or conductive layers

Abstract

In one embodiment of the present invention as used for impregnating a composite tape (56) with HTC particles provides for permeating a fabric layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer (51). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer (52) bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.

Claims

1. A method for impregnating a composite tape with HTC particles comprising:

permeating a fabric layer of said composite tape with HTC particles;

impregnating an impregnating resin into said composite tape through said fabric layer;

wherein at least 1% of said HTC particles permeated into said fabric layer are carried out of said fabric layer and into a mica layer bound to said fabric layer by said impregnating resin.

2. The method of claim 1, wherein the permeating of said fabric layer is performed after said fabric layer is bound to said mica layer.

3. The method of claim 2, wherein said fabric layer has a resinous backcoating on a side opposite to the side which said mica layer is bound, whereby said resinous backcoating keeps said HTC particles within said fabric layer.

4. The method of claim 1, wherein said HTC particles are comprised of a mixture of small and larger groups of particles, and where said small group comprise particles in the 5-100 nm in length with aspect rations of 1-10 and comprises at least 5% of the total volume of HTC particles in said composite tape, and said larger groups of particles is generally greater than 100 nm in length.

5. The method of claim 1, wherein said small group of particles are comprised predominately of spheroid and platelet shapes.

6. The method of claim 1, wherein said impregnating resin contains HTC particles.

7. The method of claim 1, wherein an amount of HTC particles accumulate at the fabric layer/mica layer interface, whereby a region of densely packed HTC particles is created at the interface.

8. The method of claim 1, wherein said HTC particles are dry when they are permeated into said fabric layer.

9. The method of claim 1, wherein said HTC particles are mixed with at least one of resin and solvent when they are permeated into said fabric layer.

10. The method of claim 1, wherein said HTC particles comprise at least one of oxides, nitrides, and carbides.

11. The method of claim 10, wherein said HTC particles comprise at least one of Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2 with mixed stoichiometric and non-stoichiometric combinations.

12. The method of claim 1, wherein said HTC particles are from 1-1000 nm in length, and wherein high thermal conductivity fillers have an aspect ratio of between 3-100.

17. The method of claim 1, wherein said HTC particles comprise 0.1-65% by volume of composite tape.

18. The method of claim 17, wherein said HTC particles comprise 1-25% by volume of composite tape.

13. A method for impregnating a composite tape with HTC particles comprising:

dry packing a fabric layer of said composite tape with HTC particles, wherein said HTC particles comprise a mixture of smaller and larger particles;

sealing exposed surfaces of said fabric layer with a resin layer; and

impregnating said composite tape with an impregnating resin;

wherein said resin layer is soluble in said impregnating resin;

wherein said impregnating resin flows from said fabric layer into a mica layer bound to said fabric layer;

wherein at least 5% of said HTC particles in said fabric layer is carried by said impregnating resin into said mica layer, and where said smaller particles tend to be carried further than said larger particles, and wherein approximately 10% by volume of said HTC particles remain at the fabric layer/mica layer interface whereby creating a region with a higher concentration of HTC particles.

14. The method of claim 13, wherein said HTC particles are at least one of oxides, nitrides, and carbides.

15. The method of claim 13, wherein said HTC particles have been surface functionalized.

16. The method of claim 15, wherein said smaller particles have been surface functionalized to limit interaction with other smaller particles.

19. The method of claim 13, wherein said fabric layer is at least one of glass.

20. A method for impregnating a mica layer within a composite tape, comprising:

joining a mica layer to at least one fabric layer;

packing said fabric layer with HTC particles;

sealing exposed surfaces of said fabric layer with a resin layer; and

impregnating said composite tape with an impregnating resin;

wherein at least 5% of said HTC particles in said fabric layer is carried by said impregnating resin into said mica layer.