Managing method of building material and wireless chip applied to the method

• US 20060231974A1
• Filed: 04/12/2006
• Published: 10/19/2006
• Est. Priority Date: 04/19/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Asami, Yoshinobu
• Granted Patent: US 8,649,895 B2
• Time in Patent Office: Days
• US Class Current: 264/219
• CPC Class Codes: G06Q 10/06 Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
• CPC Class Codes: H01L 21/00 Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A lot of buildings have been built while it is concerned that a building material is used fraudulently. Therefore, the present invention provides a managing method of the material and a system thereof. The present invention provides a managing method including a step of attaching a sheet including a plurality of memories to each surface of a plurality of materials, a step of dividing the plurality of materials with the sheet in accordance with data in the memory, a step of constructing a building by using the divided material in accordance with the data in the memory, and a step of checking the data on the constructed building, which is stored in the plurality of memories.

Claims

1. A material management method comprising the step of:

attaching a sheet including a plurality of memories to each surface of a plurality of materials;

dividing each of the plurality of materials with the sheet in accordance with data in the memory;

constructing a building by using the plurality of materials which are divided in accordance with the data in the memory; and

checking the data on the constructed building, which is stored in the plurality of memories.

7. The material management method according to claim 1, wherein the data is stored in a server through a reader/writer device.

16. The material management method according to claim 1, wherein the plurality of memories are protected from the data erasing.

22. The material management method according to claim 1, wherein the plurality of materials are wood materials.

2. A material management method comprising the step of:

attaching a sheet including a plurality of write-once memories each storing data of the material to each surface of a plurality of materials;

dividing each of the plurality of materials with the sheet in accordance with the data in the memory;

writing data on the division in the write-once memory;

constructing a building by using the plurality of material which are divided;

writing data on the construction in the write-once memory; and

checking the data on the constructed building, which is stored in the plurality of write-once memories.

8. The material management method according to claim 2, wherein the data is stored in a server through a reader/writer device.

17. The material management method according to claim 2, wherein the plurality of memories are protected from the data erasing.

23. The material management method according to claim 2, wherein the plurality of materials are wood materials.

28. The material management method according to claim 2, wherein the step of dividing each of the plurality of materials is conducted after the step of writing data on the division.

29. The material management method according to claim 2, wherein the step of dividing each of the plurality of materials is conducted before the step of writing data on the division.

30. The material management method according to claim 2, wherein the step of constructing the building is conducted after the step of writing data on the construction.

31. The material management method according to claim 2, wherein the step of constructing the building is conducted before the step of writing data on the construction.

3. A material management method comprising the step of:

attaching a sheet including a plurality of memories to each surface of a plurality of the materials;

wherein data on a material are stored in the plurality of memories and a log preventing a writing are each set in the plurality of memories;

dividing each of the plurality of materials with the sheet in accordance with data in the memory;

constructing a building by using the plurality of material which are divided in accordance with the data in the memory;

checking the data on the building, which is stored in the memory;

canceling the log of the memory; and

writing a data in the memory.

9. The material management method according to claim 3, wherein the data is stored in a server through a reader/writer device.

18. The material management method according to claim 3, wherein the plurality of memories are protected from the data erasing.

24. The material management method according to claim 3, wherein the plurality of materials are wood materials.

4. A material management method comprising the step of:

attaching a sheet including a plurality of memories each storing data of a material to each surface of a plurality of the materials by a first processor;

reading the data in the memory and dividing each of the plurality of materials with the sheet in accordance with the data by a second processor;

reading the data in the memory and constructing a building by using the plurality of material which are divided in accordance with the data by a third processor; and

checking the data on the building, which is stored in the memory and providing the data to a client by a fourth processor.

10. The material management method according to claim 4, wherein the data is stored in a server through a reader/writer device.

13. The material management method according to claim 10, wherein the stored data is provided to the client and first to fourth processors through a bus.

19. The material management method according to claim 4, wherein the plurality of memories are protected from the data erasing.

25. The material management method according to claim 4, wherein the plurality of materials are wood materials.

5. A material management method comprising the step of:

attaching a sheet including a plurality of write-once memories each storing data of a material to each surface of a plurality of the materials by a first processor;

reading the data in the write-once memory, dividing each of the plurality of materials with the sheet, and storing data on the ting by a second processor;

reading the data in the write-once memory, constructing a building by using the plurality of material which are divided, and storing data on the construction by a third processor; and

checking the data on the building, which is stored in the write-once memory and providing the data to a client by a fourth processor.

11. The material management method according to claim 5, wherein the data is stored in a server through a reader/writer device.

14. The material management method according to claim 11, wherein the stored data is provided to the client and first to fourth processors through a bus.

20. The material management method according to claim 5, wherein the plurality of memories are protected from the data erasing.

26. The material management method according to claim 5, wherein the plurality of materials are wood materials.

6. A material management method comprising the step of:

attaching a sheet including a plurality of memories to each surface of a plurality of the materials by a first processor;

wherein data on a material are stored in the plurality of memories and a log preventing a writing are each set in the plurality of memories;

dividing each of the plurality of materials with the sheet in accordance with read data in the memory by a second processor;

constructing a building by using the plurality of material which are divided in accordance with read data in the memory by a third processor; and

checking the data on the constructed building, which is stored in the memory, canceling the log of the memory, writing a data in the memory, and providing the data to a client by a fourth processor.

12. The material management method according to claim 6, wherein the data is stored in a server through a reader/writer device.

15. The material management method according to claim 12, wherein the stored data is provided to the client and first to fourth processors through a bus.

21. The material management method according to claim 6, wherein the plurality of memories are protected from the data erasing.

27. The material management method according to claim 6, wherein the plurality of materials are wood materials.

32. A wireless chip comprising:

an adhesive layer having a first portion and a second portion over a material;

a barrier layer over the adhesive layer;

a sheet including a plurality of wireless chips attached to the material via the adhesive layer and the barrier layer;

an integrated circuit portion storing data on the material; and

an antenna for supplying power to the integrated circuit portion,

wherein the first portion overlaps the wireless chip; and

wherein adhesive intensity of the first portion is higher than that of the second portion.

34. The wireless chip according to claim 32, further comprising:

a protective layer over the adhesive layer.

36. The wireless chip according to claim 32, wherein the wireless chip includes a plurality of memories.

33. A wireless chip comprising:

an adhesive layer having a first portion and a second portion over a material;

a barrier layer over the adhesive layer;

a sheet including a plurality of wireless chips attached to the material via the adhesive layer and the barrier layer;

an integrated circuit portion storing data on the material; and

an antenna for supplying power to the integrated circuit portion,

wherein the first portion overlaps the wireless chip;

wherein an edge of the second portion overlaps the wireless chip;

wherein adhesive intensity of the first portion is higher than that of the second portion.

35. The wireless chip according to claim 33, further comprising:

a protective layer over the adhesive layer.

37. The wireless chip according to claim 33, wherein the wireless chip includes a plurality of memories.