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Stack-up configuration for a wireless communication device

  • US 20060233356A1
  • Filed: 12/15/2004
  • Published: 10/19/2006
  • Est. Priority Date: 12/15/2004
  • Status: Active Grant
First Claim
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1. An assembly stack-up configuration for a wireless communication device, the assembly arrangement comprising:

  • a main circuit board for holding a plurality of communication circuits, the main circuit board comprising a top surface and a bottom surface;

    a battery having a battery upper surface and a battery lower surface, the battery located above the top surface of the main circuit board;

    a display positioned above at least a portion of the battery upper surface such that the battery is positioned between the main circuit board and the display; and

    at least one shield located below the bottom surface of the main circuit board for shielding at least one circuit of the plurality of communication circuits.

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