Liquid processing method and liquid processing apparatus
First Claim
1. A liquid processing method with use of a nozzle unit having a plurality of processing-liquid nozzles arranged integrally and also connected to respective processing-liquid supply passages, for supplying a surface of a substrate with a processing liquid via one of the processing-liquid nozzles, the method comprising the steps of:
- forming a processing-liquid layer, an air layer and a solvent layer in each tip of the processing-liquid nozzles of the nozzle unit, in order from the side of the processing-liquid supply passages;
subsequently discharging the solvent layer from one of the processing-liquid nozzles of the nozzle unit to a drain part;
supplying the surface of the substrate with a processing liquid through the one processing-liquid nozzle;
sucking the processing liquid remaining in the one processing-liquid nozzle so as to cause a liquid level of the processing liquid in the one processing-liquid nozzle to retreat toward the processing-liquid supply passages;
dipping the tip of at least the one processing-liquid nozzle of the nozzle unit into a solvent in a solvent reservoir for storing the solvent of the processing liquid; and
sucking the one processing-liquid nozzle so as to cause the liquid level of the processing liquid in the one processing-liquid nozzle to further retreat toward the processing-liquid supply passages and also cause the solvent in the solvent reservoir to be sucked into the tip of the one processing-liquid nozzle, thereby forming a processing-liquid layer, an air layer and a solvent layer in the tip of the one processing-liquid nozzle, in order from the side of the processing-liquid supply passages.
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Accused Products
Abstract
In a nozzle unit 4 equipped with processing-liquid nozzles 4A to 4J, an air layer 73 and a solvent layer 74 for processing liquid are successively formed outside a processing-liquid layer 71 included in the tip of each nozzle 4A (4B to 4J). Next, the solvent layer 74 in the nozzle 4A is thrown out into a drain part 62 of a standby unit 6 and subsequently, the processing liquid is supplied from the nozzle 4A to the surface of a wafer W, performing a coating process. After completing the coating process, the processing liquid remaining in the nozzle 4A is sucked and continuously, respective tips of the nozzles 4A to 4J are dipped into respective solvents in solvent reservoir 62A to 62J, respectively. From this state, by sucking in the nozzle 4A, there are newly formed, outside the processing layer 71 in the tip of the nozzle 4A, an air layer 73 and a solvent layer 74. Thus, in supplying a substrate, such as semiconductor wafer, with a processing liquid by use of a nozzle unit having a plurality of processing-liquid nozzles integrated, it is possible to prevent dryness of the processing liquids in the respective nozzles while preventing the nozzle unit from being large-sized.
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Citations
24 Claims
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1. A liquid processing method with use of a nozzle unit having a plurality of processing-liquid nozzles arranged integrally and also connected to respective processing-liquid supply passages, for supplying a surface of a substrate with a processing liquid via one of the processing-liquid nozzles, the method comprising the steps of:
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forming a processing-liquid layer, an air layer and a solvent layer in each tip of the processing-liquid nozzles of the nozzle unit, in order from the side of the processing-liquid supply passages;
subsequently discharging the solvent layer from one of the processing-liquid nozzles of the nozzle unit to a drain part;
supplying the surface of the substrate with a processing liquid through the one processing-liquid nozzle;
sucking the processing liquid remaining in the one processing-liquid nozzle so as to cause a liquid level of the processing liquid in the one processing-liquid nozzle to retreat toward the processing-liquid supply passages;
dipping the tip of at least the one processing-liquid nozzle of the nozzle unit into a solvent in a solvent reservoir for storing the solvent of the processing liquid; and
sucking the one processing-liquid nozzle so as to cause the liquid level of the processing liquid in the one processing-liquid nozzle to further retreat toward the processing-liquid supply passages and also cause the solvent in the solvent reservoir to be sucked into the tip of the one processing-liquid nozzle, thereby forming a processing-liquid layer, an air layer and a solvent layer in the tip of the one processing-liquid nozzle, in order from the side of the processing-liquid supply passages. - View Dependent Claims (2, 3, 4, 5, 11, 12, 13, 14, 15, 16, 17)
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6. A liquid processing method with use of a nozzle unit having a plurality of processing-liquid nozzles arranged integrally and also connected to respective processing-liquid supply passages, for supplying a surface of a substrate with a processing liquid via one of the processing-liquid nozzles, the method comprising:
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a first step of forming a processing-liquid layer, an air layer and a solvent layer in each tip of the processing-liquid nozzles of the nozzle unit, in order from the side of the processing-liquid supply passages; and
a second step of refilling the solvent layer reduced due to its evaporation after a predetermined time has passed since an execution of the first step;
whereinthe second step includes the steps of;
discharging the solvent layers from the respective processing-liquid nozzles of the nozzle unit to a drain part;
dipping respective tips of the processing-liquid nozzles of the nozzle unit into a solvent in a solvent reservoir for storing the solvent of the processing liquid; and
sucking the processing-liquid nozzles so as to cause liquid levels of the processing liquids in the processing-liquid nozzles to retreat toward the processing-liquid supply passages and also cause the solvent to be sucked into the tips of the processing-liquid nozzles, thereby forming a processing-liquid layer, an air layer and a solvent layer in the each tip of the processing-liquid nozzles, in order from the side of the processing-liquid supply passages. - View Dependent Claims (7, 8, 9, 10, 18, 19, 20, 21, 22, 23, 24)
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Specification