SINGLE IC-CHIP DESIGN ON WAFER WITH AN EMBEDDED SENSOR UTILIZING RF CAPABILITIES TO ENABLE REAL-TIME DATA TRANSMISSION

• US 20060234398A1
• Filed: 04/15/2005
• Published: 10/19/2006
• Est. Priority Date: 04/15/2005
• Status: Abandoned Application

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Snyder, Gary L., Little, Timothy E., Gluschenkov, Oleg
• Application Number:
  US10/907,798
• Publication Number:
  US 20060234398A1
• Time in Patent Office: Days
• US Class Current: 438/5
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers

Abstract

An apparatus and method for real-time monitoring process conditions of a semiconductor wafer processing operation. A semiconductor wafer subject to processing in a wafer processing tool is embedded with one or more sensor devices. In response to receipt of wireless electromagnetic signals, the embedded sensor devices are activated for generating sensory data. The electromagnetic signals are further utilized to activate a transmitter device provided in the wafer to wirelessly transmit the sensory data generated from the activated embedded sensor device. The transmitted electromagnetic signals comprising the sensory data are communicated to a control device for controlling processing conditions of the process tool based upon the received sensory data.

Claims

1. A method for real-time monitoring process conditions of a semiconductor wafer processing operation comprising the steps of:

a) providing a semiconductor wafer subject to processing in a wafer processing tool with one or more embedded sensor devices;

b) receiving wireless electromagnetic signals to activate an embedded sensor device for generating sensory data, said signals further activating a transmitter device provided in said wafer to wirelessly transmit said sensory data generated from said activated embedded sensor device; and

,

c) transmitting electromagnetic signals comprising said sensory data to a control device for controlling processing conditions of the process tool based upon the received sensory data.

2. The method as claimed in claim 1, wherein said electromagnetic signals comprise one of Radio Frequency (RF) or microwave signals.

3. The method as claimed in claim 2, further comprising the step of converting received RF signals into voltage signals for input to an embedded sensor device for activating said device.

4. The method as claimed in claim 1, wherein said transmitting step c) includes transmitting sensory data via electromagnetic signals.

5. The method as claimed in claim 1, wherein said sensory data are transmitted to a control device via one of Radio Frequency (RF) or microwave signals.

6. The method as claimed in claim 1, further comprising the steps of:

converting sensory data obtained from said embedded sensor device to digital signals; and

,

storing said digital signals in a memory storage device provided on said wafer prior to transmission.

7. The method as claimed in claim 1, further comprising the steps of:

providing a unique identification code associated with each respective one or more embedded sensor device, said unique identification code stored in a memory storage device associated with said embedded sensor device, wherein said sensory data transmitting step c) further includes transmitting said unique identification code with said sensory data to thereby identify the sensor device.

8. The method as claimed in claim 7, wherein said unique identification code associates said sensor device with a particular location on the wafer, said method further including identifying the wafer location where received sensor data originated.

9. The method as claimed in claim 8, wherein said sensor device comprises a temperature sensor, said sensory data comprising wafer temperature at a particular location on said wafer.

10. The method as claimed in claim 9, further comprising the step of profiling of wafer chuck zone temperatures due to wafer positioning.

11. The method as claimed in claim 9, further comprising the steps:

processing said sensory data to calculate correction factors and new operating range setpoints;

communicating said correction factors and new operating range setpoints to said wafer process tool; and

,

providing real-time adjusting of processing condition parameters in response to said correction factors and new operating range setpoints.

12. An apparatus for real-time monitoring of process conditions of a semiconductor wafer processing operation comprising:

a wafer processing tool adapted to receive and process a semiconductor wafer therein, said semiconductor wafer including one or more sensor devices embedded therein;

a means for generating wireless electromagnetic signals for receipt by said embedded one or more sensor devices, said embedded sensor device generating sensory data in response to said electromagnetic signals,

a transmitter means provided in said wafer for transmitting said sensory data;

a receiver means located externally from said wafer processing tool for receiving said transmitted sensory data; and

,

a means for controlling processing conditions of the wafer process tool based upon the received sensory data.

13. The apparatus as claimed in claim 12, wherein means for generating said electromagnetic signals comprises a Radio Frequency (RF) transmitter, said electromagnetic signals comprising RF signals.

14. The apparatus as claimed in claim 13, further comprising:

an antenna device embedded in said wafer for receiving said RF signals; and

,

a means for converting received RF signals into voltage signals for input to an embedded sensor device for activating said device.

15. The apparatus as claimed in claim 12, wherein said transmitter means provided in said wafer for transmitting said sensory data comprises an RF signal transmitter device for transmitting said sensory data via RF signals.

16. The apparatus as claimed in claim 12, further comprising:

a means for converting sensory data obtained from said embedded sensor device to digital signals; and

,

means for storing said digital signals provided on said wafer prior to transmission.

17. The apparatus as claimed in claim 12, wherein each said one or more embedded sensor devices includes an associated unique identification code, said unique identification code stored in a memory storage device associated with said sensor, said sensory data being transmitted along with said unique identification code to thereby identify the sensor device at the receiver means.

18. The apparatus as claimed in claim 17, wherein said unique identification code associates said sensor device with a particular location on the wafer, said means for controlling processing conditions of the wafer process tool further identifying a wafer location where received sensor data originated.

19. The apparatus as claimed in claim 18, wherein said sensor device comprises a temperature sensor, said sensory data comprising wafer temperature at a particular location on said wafer.

20. The apparatus as claimed in claim 19, wherein said means for controlling processing conditions of the wafer process tool further comprises means for profiling wafer chuck zone temperatures due to wafer positioning.

21. The apparatus as claimed in claim 19, wherein said means for controlling processing conditions of the wafer process tool further comprises:

a means for processing said sensory data to calculate correction factors and new operating range setpoints for said wafer process tool;

a means for communicating said correction factors and new operating range setpoints to said wafer process tool; and

,

a means for providing real-time adjusting of processing condition parameters in response to said correction factors and new operating range setpoints.

22. A system for controlling processing condition parameters of a wafer processing chamber comprising:

a means for generating RF signals for receipt by a monitoring wafer positioned within said chamber, said monitoring wafer having one or more embedded sensor circuits, each embedded sensor circuit comprising;

a sensor device adapted for generating environmental parameter sensory data;

an antenna device for receiving said RF signals;

a means for converting received RF signals into voltage signals for input to a sensor device for activating said sensor device;

a means for converting sensory data obtained from said embedded sensor device to digital signals;

a means for storing said digital signals representing said sensory data; and

,

an RF transmitter means adapted for wirelessly transmitting said sensory data;

a receiver means located externally from said wafer processing tool for receiving said transmitted sensory data; and

,

a processing means for calculating operating condition correction factors and operating range setpoints based upon said received sensory data; and

,

means for providing real-time adjusting of processing condition parameters in response to said correction factors and new operating range setpoints.

23. The system as claimed in claim 22, wherein each said each embedded sensor circuit includes an associated unique identification code, said unique identification code stored in said storing means, said unique identification code being transmitted along with said sensory data to thereby identify the sensor device at the receiver means.

24. The system as claimed in claim 23, wherein said unique identification code associates said sensor device with a particular location on the wafer, said processing means further identifying a monitor wafer location where received sensor data originated.

25. The system as claimed in claim 23, wherein said processing condition parameters include one ore more of:

temperature, RF power, gas flows, pressures, DC bias voltages, either singly or in combination.

26. A system for calibrating a semiconductor wafer process chamber utilizing the monitoring wafer as claimed in claim 23.