SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20060234459A1
• Filed: 03/29/2006
• Published: 10/19/2006
• Est. Priority Date: 04/18/2005
• Status: Abandoned Application

• Current Assignee: OKI Electric Industry Company Limited
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: TANI, Kouichi
• Application Number:
  US11/277,930
• Publication Number:
  US 20060234459A1
• Time in Patent Office: Days
• US Class Current: 438/329
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for manufacturing a semiconductor device in which a plurality of wiring layers are formed includes the steps of (a) preparing a semiconductor device on which a plurality of semiconductor elements are formed on one surface thereof, (b) forming a spiral inductor on the semiconductor substrate astride three or more wiring layers, and (c) forming a circuit wiring other than the spiral inductor in the wiring layer. The step of forming the spiral inductor and the step of forming the circuit wiring are performed simultaneously.

Claims

1. A method for manufacturing a semiconductor device in which a plurality of wiring layers are formed, comprising the steps of:

preparing a semiconductor device on which a plurality of semiconductor elements are formed on one surface thereof;

forming a spiral inductor on the semiconductor substrate astride three or more wiring layers; and

forming a circuit wiring other than the spiral inductor in the plurality of wiring layers;

wherein the step of forming the spiral inductor and the step of forming the circuit wiring are performed simultaneously.

2. The method according to claim 1, wherein the step of forming the spiral inductor further comprises the steps of:

forming a first lead wiring in a first wiring layer;

forming an interlayer insulation film in the first wiring layer, the first interlayer insulation film covering the first lead wiring;

forming a first contact hole in the first interlayer insulation film, the first contact hole exposing a portion of the surface of the first lead wiring;

forming a first contact by implanting a conductive material into the interior of the first contact hole;

forming a spiral shaped first conductive pattern in a second wiring layer located on the first wiring layer, the spiral shaped first conductive pattern connected to the first lead wiring through the first contact;

forming a second interlayer insulation film in the second wiring layer, the second interlayer insulation film covering the first conductive pattern;

forming a second contact hole in the second interlayer insulation film, the second contact hole exposing a portion of the surface of the first conductive pattern;

forming a second contact by implanting a conductive material into the interior of the second contact hole;

forming a spiral shaped second conductive pattern in a third wiring layer located on the second wiring layer, the spiral shaped second conductive pattern connected to the first conductive pattern through the second contact and overlapped with the first conductive pattern; and

forming a second lead wiring that is connected to an end portion of the second conductive pattern and integrated with the second conductive pattern.

3. The method according to claim 2, wherein a plurality of second contact holes are formed on the first conductive pattern at predetermined intervals.

4. The method according to claim 2, wherein the step of forming the second contact and the step of forming the second conductive pattern are performed simultaneously.

5. The method according to claim 2, wherein one or more first contact holes are formed in an end portion of the first lead wiring.

6. The method according to claim 2, wherein the step of forming the first contact and the step of forming the first conductive pattern are performed simultaneously.

7. The method according to claim 2, wherein the second contact hole is formed in a slit planar shape and formed along the first conductive pattern.

8. The method according to claim 1, wherein the step of forming the spiral inductor further comprises the steps of:

forming a first lead wiring in a first wiring layer;

forming an interlayer insulation film in the first wiring layer, the first interlayer insulation film covering the first lead wiring;

forming a first contact hole in the first interlayer insulation film, the first contact hole exposing a portion of the surface of the first lead wiring;

forming a first contact by implanting a conductive material into the interior of the first contact hole;

forming a spiral shaped first conductive pattern in a second wiring layer located on the first wiring layer, the spiral shaped first conductive pattern connected to the first lead wiring through the first contact;

forming a second interlayer insulation film in the second wiring layer, the second interlayer insulation film covering the first conductive pattern;

forming a second contact hole in the second interlayer insulation film, the second contact hole exposing a portion of the surface of the first conductive pattern;

forming a second contact by implanting a conductive material into the interior of the second contact hole;

forming a spiral shaped second conductive pattern in a third wiring layer located on the second wiring layer, the spiral shaped second conductive pattern connected to the first conductive pattern through the second contact and overlapped with the first conductive pattern;

forming a third interlayer insulation film in the third wiring layer, the third insulation film covering the second conductive pattern;

forming a third contact hole in the third interlayer insulation film, the third contact hole exposing a portion of the surface of the second conductive pattern;

forming a third contact by implanting a conductive material into the interior of the third contact;

forming a spiral shaped third conductive pattern in a fourth wiring layer located on the third wiring layer, the spiral shaped third conductive pattern connected to the second conductive pattern through the third contact and overlapped with the second conductive pattern;

forming a fourth interlayer insulation film in the fourth wiring layer, the fourth interlayer insulation film covering the third conductive pattern;

forming a fourth contact hole in the fourth interlayer insulation film, the fourth contact hole exposing a portion of the surface of the third conductive pattern;

forming a fourth contact by implanting a conductive material into the interior of the fourth contact hole;

forming a spiral shaped fourth conductive pattern in a fifth wiring layer located on the fourth wiring layer, the spiral shaped fourth conductive pattern connected to the third conductive pattern through the fourth contact and overlapped with the third conductive pattern; and

forming a second wiring that is connected to an end portion of the fourth conductive pattern and integrated with the fourth conductive pattern.

9. The method according to claim 8, wherein

a plurality of the second contact holes are formed on the first conductive pattern at predetermined intervals;

a plurality of the third contact holes are formed on the second conductive pattern at predetermined intervals; and

a plurality of the fourth contact holes are formed on the third conductive pattern at predetermined intervals.

10. The method according to claim 8, wherein

the step of forming the second contact and the step of forming the second conductive pattern are performed simultaneously;

the step of forming the third contact and the step of forming the third conductive pattern are performed simultaneously; and

the step of forming the fourth contact and the step of forming the fourth conductive pattern are performed simultaneously;

11. The method according to claim 8, wherein one or more first contacts are formed in an edge portion of the first lead wiring.

12. The method according to claim 8, wherein the step of forming the first contact and the step of forming the first conductive pattern are performed simultaneously.

13. The method according to claim 8, wherein the first lead wiring, the second lead wiring, the first conductive pattern, the second conductive pattern, the third conductive pattern, the fourth conductive pattern, the first contact, the second contact, the third contact, and the fourth contact are comprised of am alloy that is primarily comprised of aluminum.

14. The method according to claim 8, wherein

the second contact hole is formed in a slit planar shape and formed along the first conductive pattern;

the third contact hole is formed in a slit planar shape and formed along the second conductive pattern; and

the fourth contact hole is formed in a slit planar shape and formed along the third conductive pattern.

15. The method according to claim 1, wherein the step of forming the spiral inductor is comprised of the steps of:

forming a first lead wiring in a first wiring layer;

forming an interlayer insulation film in the first wiring layer, the first interlayer insulation film covering the first lead wiring;

forming a first contact hole in the first interlayer insulation film, the first contact hole exposing a portion of the surface of the first lead wiring;

forming a first contact by implanting a conductive material into the interior of the first contact hole;

forming a spiral shaped first conductive pattern in a second wiring layer located on the first wiring layer, the spiral shaped first conductive pattern connected to the first lead wiring through the first contact;

forming a second interlayer insulation film in the second wiring layer, the second interlayer insulation film covering the first conductive pattern;

forming a third interlayer insulation film in a third wiring layer located on the second wiring layer;

forming a fourth interlayer insulation film in a fourth wiring layer located on the third wiring layer;

integrally forming a second contact hole in the second interlayer insulation film, the third interlayer insulation film, and the fourth interlayer insulation film, the second contact hole exposing a portion of the surface of the first conductive pattern;

forming a second contact by implanting a conductive material into the interior of the second contact hole;

forming a spiral shaped second conductive pattern in a fifth wiring layer located on the fourth wiring layer, the spiral shaped second conductive pattern connected to the first conductive pattern through the second contact and overlapped with the first conductive pattern; and

forming a second lead wiring that is connected to an end portion of the second conductive pattern and integrated with the second conductive pattern.

16. The method according to claim 15, wherein the second contact hole is formed in a slit planar shape and formed along the first conductive pattern.

17. The method according to claim 15, wherein the step of forming the second contact is conducted with a selective aluminum chemical vapor deposition method and not simultaneously conducted with the step of forming the second conductive pattern.

18. The method according to claim 15, wherein one or more first contacts are formed in an edge portion of the first lead wiring.

19. The method according to claim 15, wherein the step of forming the first contact and the step of the first conductive pattern are performed simultaneously.

20. The method according to claim 15, wherein the first lead wiring, the second lead wiring, the first conductive pattern, the second conductive pattern, and the first contact are comprised of an alloy that is primarily comprised of aluminum.