Patterning on surface with high thermal conductivity materials

• US 20060234576A1
• Filed: 04/03/2006
• Published: 10/19/2006
• Est. Priority Date: 04/15/2005
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Power Generation, Inc.
• Inventors: Wood, John W., Stevens, Gary, Smith, James D. B.
• Granted Patent: US 7,651,963 B2
• Time in Patent Office: Days
• US Class Current: 442/110
• CPC Class Codes: B32B 2255/12 on paper layer
• CPC Class Codes: B32B 2255/24 Organic non-macromolecular coating
• CPC Class Codes: B32B 2260/021 Fibrous or filamentary layer
• CPC Class Codes: B32B 2260/028 Paper layer
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2264/104 Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
• CPC Class Codes: B32B 2264/108 Carbon, e.g. graphite particles
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2307/54 Yield strength; Tensile strength
• CPC Class Codes: B32B 2405/00 Adhesive articles, e.g. adhesive tapes
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2554/00 Paper of special types, e.g. banknotes
• CPC Class Codes: B32B 2581/00 Seals; Sealing equipment; Gaskets
• CPC Class Codes: B32B 29/02 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 29/06 specially treated, e.g. surfaced, parchmentised
• CPC Class Codes: D21H 13/44 Flakes, e.g. mica, vermiculite
• CPC Class Codes: D21H 17/67 Water-insoluble compounds, e.g. fillers, pigments
• CPC Class Codes: D21H 17/69 modified, e.g. by association with other compositions prior to incorporation in the pulp or paper
• CPC Class Codes: D21H 19/64 Inorganic compounds
• CPC Class Codes: D21H 21/54 : being spherical, e.g. microcapsules, beads
• CPC Class Codes: Y10T 428/24793 : Comprising discontinuous or differential impregnation or bond
• CPC Class Codes: Y10T 428/24851 : Intermediate layer is discontinuous or differential
• CPC Class Codes: Y10T 428/24893 : including particulate material
• CPC Class Codes: Y10T 442/2418 : Coating or impregnation increases electrical conductivity or anti-static quality
• CPC Class Codes: Y10T 442/2426 : Elemental carbon containing
• CPC Class Codes: Y10T 442/2475 : Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing
• CPC Class Codes: Y10T 442/2992 : Coated or impregnated glass fiber fabric

Abstract

The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.

Claims

1. A high thermal conductivity paper comprising:

a host matrix; and

high thermal conductivity materials added to a surface of said host matrix in a specific pattern;

wherein said high thermal conductivity materials are comprised of at least one of nanofillers, diamond like coatings directly on said host matrix, and diamond like coatings on said nanofillers.

2. The high thermal conductivity paper of claim 1, wherein said host matrix is mica.

3. The high thermal conductivity paper of claim 1, wherein said high thermal conductivity materials comprise 1-25% by volume of said high thermal conductivity paper.

4. The high thermal conductivity paper of claim 1, wherein said nanofillers have an aspect ratio greater than 5.

5. The high thermal conductivity paper of claim 1, wherein said high thermal conductivity paper is combined into a high thermal conductivity electrical insulation tape.

6. The high thermal conductivity paper of claim 1, wherein said specific pattern comprises at least one of a grid, edging, banding centering and combinations thereof.

7. The high thermal conductivity paper of claim 1, wherein said specific pattern is formed by the drying of a solution containing said high thermal conductivity materials.

8. The high thermal conductivity paper of claim 1, wherein the high thermal conductivity materials cover 5-80% of said surface of said host matrix.

9. The thermal conductivity paper of claim 8, wherein the high thermal conductivity materials cover 15-55% of said surface of said host matrix.

10. The thermal conductivity paper of claim 1, wherein said surface of said host matrix is a sub-surface, whereby said sub-surface becomes an internal layer in a finished paper.

11. An electrically insulating tape comprising:

a mica paper layer with high thermal conductivity materials added to said mica paper layer in a specific pattern;

a glass fiber backing layer;

an interface between said mica paper layer and said glass fiber backing layer; and

resin is impregnated through said mica paper layer and said glass fiber backing layer;

wherein said high thermal conductivity materials are comprised of at least one of nanofillers, diamond like coatings directly on said host matrix, and diamond like coatings on said nanofillers;

wherein said high thermal conductivity materials comprise 1-25% by volume of said mica paper;

whereby the impregnation of said resin increases the distribution of said high thermal conductivity materials through said tape.

12. The electrically insulating tape of claim 11, wherein said specific pattern is added to a surface of said mica paper layer.

13. The electrically insulating tape of claim 11, wherein said specific pattern is added as a sub-layer to said mica paper layer.

14. The electrically insulating tape of claim 11, wherein multiple specific patterns are added to said mica paper layer.

15. A method of making high thermal conductivity paper comprising:

obtaining a substrate;

adding high thermal conductivity materials onto said substrate;

producing a paper product from said substrate;

wherein said high thermal conductivity materials comprise nanofillers that are added to said substrate by a solvent containing said nanofillers onto said substrate then evaporating said solvent so that said high thermal conductivity materials form a pattern on said substrate.

16. The method of claim 15 wherein said nanofillers have a DLC.

17. A method of making high thermal conductivity paper comprising:

obtaining a substrate;

adding high thermal conductivity materials onto a surface of said substrate in a specific pattern, wherein said specific pattern takes up 5-80% of said surface; and

producing a paper product from said substrate;

wherein said high thermal conductivity materials comprise a surface coating that is dispersed onto said substrate by deposition.

18. The method of claim 17, wherein producing of said paper product staggers said specific pattern.