Method of manufacturing an implantable wireless sensor

• US 20060235310A1
• Filed: 06/22/2006
• Published: 10/19/2006
• Est. Priority Date: 09/16/2003
• Status: Active Grant

• Current Assignee: St. Jude Medical Luxembourg Holdings Ii S.A.R.L.
• Original Assignee: David O'Brien, David Stern, Jason Kroh, Jason White, Mark Allen, Michael Fonseca
• Inventors: O'Brien, David, Allen, Mark, White, Jason, Stern, David, Kroh, Jason, Fonseca, Michael
• Granted Patent: US 7,574,792 B2
• Time in Patent Office: Days
• US Class Current: 600/486
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/02014 Determining aneurysm
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core

Abstract

In the disclosed method of manufacturing an implantable wireless sensor, a cavity is etched in one side of a first substrate. A conductive structureare formed on the base of the cavity. A second conductive structureare formed on a surface of a second substrate, and the two substrates are mutually imposed such that the two conductive plates and coils are disposed in opposed, spaced-apart relation. A laser is then used to cut away perimeter portions of the imposed substrates and simultaneously to heat bond the two substrates together such that the cavity in the first substrate is hermetically sealed.

Claims

1. A method of manufacturing a sensor, comprising the steps of:

forming a first cavity in a first side of a first substrate, the first cavity having a base;

forming a first conductive structure on the base of the first cavity;

forming a second conductive structure on a surface of a second substrate;

mutually imposing the first and second substrates such that the first and second conductive structures are disposed in opposed, spaced-apart relation; and

using heat to bond the first and second substrates together and simultaneously to individualize the sensor, the heat being controlled such that said first and second conductive structures are not damaged thereby.

2. The method of claim 1, wherein the step of using heat to heat bond the first and second substrates together and simultaneously to individualize the sensor comprises the step of creating a hermetic seal between the first and second substrates.

3. The method of claim 1, wherein the step of forming a first conductive structure further comprises the step of forming a first coil.

4. The method of claim 3, wherein the step of forming a second conductive structure further comprises the step of forming a second coil.

5. The method of claim 1, wherein the step of forming a first conductive structure on the base of the first cavity further comprises forming a first conductive spiral coil on the base of the first cavity;

and wherein the step of forming a second conductor on a surface of a second substrate further comprises forming a second conductive spiral coil on the second substrate.

6. The method of claim 1, wherein the step of forming a first conductive structure on the base of the first cavity further comprises forming a first conductive spiral coil and a first conductive plate attached to a terminal end of said first conductive spiral coil on the base of the first cavity;

and wherein the step of forming a second conductor on a surface of a second substrate further comprises forming a second conductive spiral coil and a second conductive plate attached to a terminal end of said second conductive spiral coil on the second substrate.

7. The method of claim 1, wherein the step of forming a second conductive structure on a surface of a second substrate comprises the steps of:

etching a second cavity in a first side of the second substrate, the second cavity having a base; and

forming the second conductive structure on the base of the second cavity.

8. The method of claim 7, wherein the step of mutually imposing the first and second substrates comprises the step of mutually imposing the first and second substrates such that the first and second cavities communicate to form a hollow space, and wherein said step of using highly localized heat to bond the first and second substrates together such that the cavity in the first substrate is sealed comprises the step of using a laser to heat bond the first and second substrates together such that the hollow space defined by the first and second substrates is hermetically sealed.

9. The method of claim 1, wherein the step of etching a first cavity in a first side of a first substrate comprises the step of etching a first cavity in a first side of a substrate comprised of a material selected from the group consisting of fused silica, glass, quartz, silicon, and ceramic.

10. The method of claim 9, wherein the step of forming a second conductive structure on a surface of a second substrate comprises the step of forming a second conductive structure on a surface of a second substrate comprised of a material selected from the group consisting of fused silica, glass, quartz, silicon, and ceramic.

11. The method of claim 1, wherein the step of etching a first cavity in a first side of a first substrate comprises the steps of:

applying a mask to the first side of the first substrate, the mask exposing portions of the first side of the first substrate therethrough; and

etching away the portions of the first side of the first substrate exposed through the mask to form the recess.

12. The method of claim 11, wherein the step of etching away the portions of the first side of the first substrate exposed through the mask to form the recess is accomplished by a process selected from the group consisting of chemical etching, acid etching, plasma etching, and reactive ion etching.

13. The method of claim 1, wherein the step of etching a first cavity in a first side of a first substrate comprises the step of etching a first cavity in a first side of a first substrate to a depth of from about 20 to about 200 micrometers.

14. The method of claim 1, wherein the step of etching a first cavity in a first side of a first substrate comprises the step of etching a first cavity in a first side of a first substrate having a thickness of from about 100 to about 1500 microns.

15. The method of claim 1, wherein the step of forming a first conductive structure on the base of the first cavity comprises the steps of:

applying a layer of photo-resistive material to the base of the recess;

using ultraviolet light in a photolithographic process to transfer a pattern from a mask to the photo-resistive material on the base of the recess;

chemically removing portions of the photo-resistive material to create a mold;

depositing a metal into the mold; and

etching away the photo-resistive material to leave the metal.

16. The method of claim 15, wherein the step of applying a layer of photo-resistive material to the base of the recess comprises the steps of:

depositing a seed layer onto the base of the recess; and

applying the layer of photo-resistive material onto the seed layer.

17. The method of claim 16, wherein the step of depositing a seed layer onto the base of the recess is achieved using a process selected from the group consisting of sputtering, plating, and metal evaporation.

18. The method of claim 15, wherein the step of applying a layer of photo-resistive material to the base of the recess is achieved by a spin coating procedure.

19. The method of claim 15, wherein the step of depositing a metal into the mold comprises the step of depositing copper into the mold.

20. The method of claim 15, wherein the step of depositing a metal into the mold comprises the step of depositing a metal into the mold to a height of from about 5 to about 35 microns above the base of the recess.

21. The method of claim 1, further comprising applying a silicone rubber coating to the exterior of the sensor.

22. The method of claim 21, wherein the step of applying a silicone rubber coating to the exterior of the sensor further comprises applying silicone coating to a thickness of about 200 microns.

23. The method of claim 1, wherein mutually imposing the first and second substrates further comprises mutually imposing the first and second substrates such that they are spaced from about 3 to about 35 micrometers apart.

24. The method of claim 1, wherein the step of etching a first cavity in a first side of a first substrate further comprises creating a pressure sensitive membrane.

25. The method of claim 24, wherein the step of creating a pressure sensitive membrane further comprises etching a first cavity in a first side of a first substrate to such a depth that the substrate at the base of the cavity has a thickness from about 85 to about 120 micrometers.