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SILICON CARBIDE POWER DEVICES WITH SELF-ALIGNED SOURCE AND WELL REGIONS

  • US 20060237728A1
  • Filed: 07/11/2006
  • Published: 10/26/2006
  • Est. Priority Date: 04/24/2003
  • Status: Active Grant
First Claim
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1. A silicon carbide power semiconductor device, comprising:

  • a first silicon carbide layer having a first conductivity type;

    a source region in the first silicon carbide layer and having the first conductivity type, the source region having a higher carrier concentration than a carrier concentration of the first silicon carbide layer and extending to a first surface of the first silicon carbide layer;

    a buried region of silicon carbide of the second conductivity type in the first silicon carbide layer adjacent a bottom portion of the source region and at a depth in the first silicon carbide layer greater than a depth of the source region;

    a well region of silicon carbide of the second conductivity type in the first silicon carbide layer outside of the source region and extending toward the first surface of the first silicon carbide layer, the well region having a lower carrier concentration than a carrier concentration of the buried region;

    a plug region of silicon carbide of the second conductivity type inside the source region opposite the well region and extending to the first face of the first silicon carbide layer;

    a gate oxide on the first silicon carbide layer, the well region and the source region;

    a gate contact on the gate oxide;

    a source contact on the plug region and the source region; and

    a drain contact on the first silicon carbide layer opposite the first surface of the first silicon carbide layer.

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