Thin-layer light-emitting diode chip and method for the production thereof
First Claim
1. A thin-layer LED chip comprising an epitaxial layer sequence that is disposed on a carrier element and comprises an electromagnetic-radiation-generating active region, and a reflective layer that is disposed on a principal surface of said epitaxial layer sequence facing toward said carrier element and reflects at least a portion of the electromagnetic radiation generated in said epitaxial layer sequence back thereinto, wherein-disposed on a radiation extraction surface of said epitaxial layer sequence facing away from said carrier element is a structured layer containing a glass material and exhibiting a structure that includes mutually adjacent protuberances that taper away from said radiation extraction surface and have a lateral grid size that is smaller than one wavelength of an electromagnetic radiation emitted from said epitaxial layer sequence.
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Accused Products
Abstract
A thin-layer LED chip (5) is claimed, comprising an epitaxial layer sequence (6) that is disposed on a carrier element (2) and contains an electromagnetic-radiation-generating active region (8), and a reflective layer (3) that is disposed on a principal surface of the epitaxial layer sequence (6) facing toward the carrier element (2) and reflects at least a portion of the electromagnetic radiation generated in the epitaxial layer sequence (6) back thereinto, in which a structured layer (1) containing a glass material is applied to a radiation extraction surface (7) of the epitaxial layer sequence (6) facing away from said carrier element (2) and has a structure that includes mutually adjacent protuberances (5) that taper in the direction away from the radiation extraction surface (7) and have a lateral grid size that is smaller than one wavelength of an electromagnetic radiation emitted from the epitaxial layer sequence (6). The structured layer (1) is advantageously applied as spin-on glass and structured by grayscale lithography.
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Citations
14 Claims
- 1. A thin-layer LED chip comprising an epitaxial layer sequence that is disposed on a carrier element and comprises an electromagnetic-radiation-generating active region, and a reflective layer that is disposed on a principal surface of said epitaxial layer sequence facing toward said carrier element and reflects at least a portion of the electromagnetic radiation generated in said epitaxial layer sequence back thereinto, wherein-disposed on a radiation extraction surface of said epitaxial layer sequence facing away from said carrier element is a structured layer containing a glass material and exhibiting a structure that includes mutually adjacent protuberances that taper away from said radiation extraction surface and have a lateral grid size that is smaller than one wavelength of an electromagnetic radiation emitted from said epitaxial layer sequence.
- 7. A method for making a thin-layer LED chip comprising an epitaxial layer sequence that is disposed on a carrier element and contains an electromagnetic-radiation-generating active region, and a reflective layer that is disposed on a principal surface of said epitaxial layer sequence facing toward said carrier element and reflects at least a portion of the electromagnetic radiation generated in said epitaxial layer sequence back thereinto, wherein said epitaxial layer sequence disposed on said carrier element is prepared, a layer containing a glass material is applied to a radiation extraction surface of said epitaxial layer sequence facing away from said carrier element, and a structure is introduced into at least a portion of said layer, said structure including mutually adjacent protuberances that taper in the direction away from said radiation extraction surface and have a lateral grid size that is smaller than one wavelength of an electromagnetic radiation emitted from said epitaxial layer sequence.
Specification