High-efficiency light extraction structures and methods for solid-state lighting

• US 20060237735A1
• Filed: 04/22/2005
• Published: 10/26/2006
• Est. Priority Date: 04/22/2005
• Status: Abandoned Application

• Current Assignee: DiCon Fiber Optics Incorporated
• Original Assignee: DiCon Fiber Optics Incorporated
• Inventors: Lee, Cheng-Tsin, Naulin, Jean-Yves, Lee, Ho-Shang
• Application Number:
  US11/112,641
• Publication Number:
  US 20060237735A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A soft solder flowing into the recesses of a semiconductor thin film LED provides: (a) increased bonding strength and better mechanical durability, (b) improved heat dissipation, (c) enhanced light extraction when the LED film is bonded to a new carrier. Annealing localized islands of absorbing metal creates an ohmic contact. Those isolated islands are inter-connected by a layer of a highly reflective metal. This design enables a significant absorption reduction within the LED device and leads to a significant improvement of light extraction. Additionally, the light extraction efficiency of an isotropic light emitting device is improved via surface shaping of the device by a 2D-array of micro-lenses and photonic band gap structure. For manufacturability purpose the making of micron-size lenses of the surface of the chip may preferably be performed as a final step, preferably with optical lithography.

Claims

1. A light emitting apparatus comprising:

a semiconductor structure comprising a light emitting diode, said structure having recesses therein;

a carrier that has a thermal conductivity that is higher than that of the structure and/or a CTE where there is a substantial mismatch between CTE of the structure and that of said carrier; and

a stress-absorbing material attaching the structure to the carrier, said material substantially filling said recesses.

2. The apparatus of claim 1, wherein the CTE of the carrier is different by at least 10% from that of the structure, said material reducing stress between the structure and the carrier when they are attached together by the material.

3. The apparatus of claim 2, wherein the stress-absorbing material includes solder.

4. The apparatus of claim 3, wherein a melting temperature of the solder is between 100°

C. and 350°

C.

5. The apparatus of claim 2, wherein when the structure and the carrier are attached by heating the stress-absorbing material between the structure and the carrier until it melts and subsequently cooling the material, a clamping force is asserted between the structure and the carrier.

6. The apparatus of claim 5, wherein the stress-absorbing material includes Sn, In and/or Pb and their respective alloys.

7. The apparatus of claim 1, said stress-absorbing material comprising at least one of the following group to enhance heat dissipation:

Au, Ag, Cu, W, Sn, In, Pb.

8. The apparatus of claim 1, said carrier comprising one or more of the following material:

Si, GaAs, Cu, Al, SiC, AlSiC, Cu/M (where M is Mo or W), Graphite, AlN, Al₂O₃, Cu/Mo/Cu.

9. The apparatus of claim 1, said structure comprising an active layer, a p-cladding layer and/or waveguide layer, a n-cladding layer, a window layer, a contact layer, a etching stop layer, a buffer layer and a space layer.

10. The apparatus of claim 1, said structure comprising a light reflective layer on a surface of the structure at the recesses.

11. The apparatus of claim 10, said light reflective layer comprising a metal material.

12. The apparatus of claim 11, said structure further comprising a dielectric layer between the reflective layer and a semiconductive material in the structure.

13. The apparatus of claim 12, said dielectric layer comprising oxide(s) or nitride(s) of any one or more of the following:

Si, Nb, Ta, Al, In, Mg, Sn.

14. The apparatus of claim 11, said light reflective layer comprising any one or more of the following:

Au, Ag, Al.

15. The apparatus of claim 11, further comprising a barrier layer between the reflective layer and the carrier, said barrier layer preventing diffusion of the stress-absorbing material into the semiconductor structure and damage to the light reflective layer when the structure is attached to the carrier.

16. The apparatus of claim 15, wherein said barrier layer comprises Nb.

17. The apparatus of claim 15, further comprising a wetting layer which facilitates uniform adhesion of the barrier layer with the stress-absorbing material.

18. The apparatus of claim 10, said structure further comprising convex and/or concave microlenses on a surface of the structure opposite to the reflective layer, so that light reflected by the reflective layer has a greater chance of escaping from the structure through the microlenses.

19. The apparatus of claim 18, said structure comprising an active layer, wherein said microlenses have focal planes or foci in the active layer of the structure.

20. The apparatus of claim 1, said recesses being in the form of a one or more arrays of trenches.

21. The apparatus of claim 1, said recesses being in the form of two arrays of trenches arranged in directions transverse to each other.

22. The apparatus of claim 1, said structure further comprising a photonic crystal pattern.

23. A light emitting apparatus comprising:

a semiconductor structure comprising a light emitting diode; and

an electrically conductive network for applying a current to the structure to cause the diode to emit light, said network comprising;

an array of metal contacts wherein each of at least some of the contacts is not in contact with any other contact in the array, and wherein the contacts form ohmic contacts with the semiconductor structure; and

an electrically conductive material connecting the contacts, said material being light reflective or substantially transparent with respect to light emitted by the diode.

24. The apparatus of claim 23, wherein said electrically conductive material is in contact with the semiconductor structure, and wherein the contact between the semiconductor structure and the material is substantially non-ohmic.

25. The apparatus of claim 23, said metal contacts comprising Ni, Ge, Pd, Ti, Pt and/or Au.

26. The apparatus of claim 23, said metal contacts comprising an alloy comprising a Ge—

Au, Pd, Al, Mo, Ru, Ge—

Au—

Ni, Pt or NiO/Au based alloy.

27. The apparatus of claim 23, said electrically conductive material comprising Au, Ag, Al or ITO.

28. A method for making a light emitting apparatus comprising:

providing a semiconductor structure comprising a light emitting diode, said structure having recesses therein; and

attaching to the structure a carrier having a thermal conductivity that is higher than that of the structure and/or a CTE where there is a substantial mismatch between CTE of the structure and that of said carrier by means of a stress-absorbing material so that said material substantially fills said recesses.

29. The method of claim 28, wherein the CTE of the carrier is different by at least 10% from that of the structure, so that said material reduces stress between the structure and the carrier when they are attached together by the material.

30. The method of claim 29, said attaching comprising:

placing the material in solid form between the structure and the carrier and heating the material until it melts and enters the recesses; and

cooling the material.

31. The method of claim 30, said carrier having a CTE that is different from that of the structure by at least 10% so that stress caused by different amounts of contraction of the carrier and the structure is reduced by movement of the material relative to the carrier and the structure when it is cooled.

32. The method of claim 31, wherein cooling of the material causes a clamping force to be asserted between the carrier and the structure.

33. The method of claim 28, said semiconductor structure comprising a crystalline current spreading layer, said providing comprising selectively etching said current spreading layer along one of its crystal orientation to form the recesses.

34. The method of claim 28, further comprising shielding the stress-absorbing material from the structure and/or the carrier by means of a barrier layer during the attaching.

35. The method of claim 34, wherein said barrier layer used in the shielding comprises Nb.

36. A method for attaching a semiconductor wafer to a carrier, comprising:

bringing the semiconductor wafer and the carrier into contact in a vacuum environment; and

applying uniform pressure and temperature to the semiconductor wafer and the carrier to create a strong and uniform bonding therebetween, wherein the pressure is unidirectional or isostatic.

37. The method of claim 36, wherein said pressure is applied by means of a hard press or through the use of a fluid.