Vertical microprobes for contacting electronic components and method for making such probes
First Claim
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1. A compliant probe device for making electric contact with an electronic component, comprising:
- (A) a tip element;
(B) an elongated compliant element formed from a plurality of adhered layers of a deposited material adhered to the tip element, wherein at least one of the following criteria is met;
(1) the elongate compliant element comprises a plurality of steps with a number of the steps separated from adjacent steps by a bridge of material that is common to a lower adjacent step and a higher adjacent step;
(2) the elongate compliant element comprises at least two compliant springs that are oriented so as to provide balanced compliance under compressive force;
(3) the compliant element comprises a plurality of compliant spring elements located in parallel;
(4) the compliant element comprises a plurality of compliant elements a portion of which are in parallel to each other and a portion which are in series with each other;
(5) the compliant element is located in proximity to a stiffening element such that lateral displacement of the compliant element is hindered upon contact with the stiffening element;
(6) the compliant element comprises a first spring element in series with a second spring element wherein during compression the first spring element is placed in a net compressive state while the second spring element is placed in a net tensional state;
or (7) the compliant element comprises a first spring element in series with a second spring element, where the first spring element has a first compliance and the second spring element has a second compliance and where the first and second compliance are different.
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Abstract
Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
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Citations
2 Claims
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1. A compliant probe device for making electric contact with an electronic component, comprising:
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(A) a tip element;
(B) an elongated compliant element formed from a plurality of adhered layers of a deposited material adhered to the tip element, wherein at least one of the following criteria is met;
(1) the elongate compliant element comprises a plurality of steps with a number of the steps separated from adjacent steps by a bridge of material that is common to a lower adjacent step and a higher adjacent step;
(2) the elongate compliant element comprises at least two compliant springs that are oriented so as to provide balanced compliance under compressive force;
(3) the compliant element comprises a plurality of compliant spring elements located in parallel;
(4) the compliant element comprises a plurality of compliant elements a portion of which are in parallel to each other and a portion which are in series with each other;
(5) the compliant element is located in proximity to a stiffening element such that lateral displacement of the compliant element is hindered upon contact with the stiffening element;
(6) the compliant element comprises a first spring element in series with a second spring element wherein during compression the first spring element is placed in a net compressive state while the second spring element is placed in a net tensional state;
or(7) the compliant element comprises a first spring element in series with a second spring element, where the first spring element has a first compliance and the second spring element has a second compliance and where the first and second compliance are different.
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2. A compliant probe array for making electric contact with an electronic component, comprising:
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(A) a plurality of tip elements;
(B) a plurality of elongated compliant elements formed from a plurality of adhered layers of a deposited material with each elongate compliant element adhered to a respect tip element, wherein at least one of the following criteria is met;
(1) the array is formed of elongate compliant elements with each comprising a plurality of steps with a number of the steps separated from adjacent steps by a bridge of material that is common to a lower adjacent step and a higher adjacent step wherein the bridging elements provide a spacing necessary to position adjacent probe elements apart from one another by a distance which is less than a cross-sectional width of the elongate elements;
or(2) the array is formed of elongate compliant extension elements that may move independently of other elongate compliant extension elements which are position is series with a plurality of elongate compliant base elements whose movement is coupled to other compliant base elements but a bridging element that is located between the elongate compliant extension elements and the elongate compliant base elements.
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Specification