Ceramic chip-type electronic component with electrode covering resin and method of making the same
First Claim
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1. A chip-type electronic component comprising:
- a ceramic chip body incorporating an element and including a mount surface and a side surface;
an external electrode for the element formed on the side surface of the chip body;
a conductive elastic resin film which is larger in width than the external electrode and formed to cover the external electrode and extend onto part of the mount surface of the chip body; and
a metal plating film for soldering formed on the conductive elastic resin film.
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Abstract
A chip-type electronic component includes a ceramic chip body incorporating an element, an external electrode formed on a side surface of the chip body, a conductive elastic resin film which is larger in width than the external electrode and formed to cover the external electrode and extend onto part of a mount surface of the chip body, and a metal plating film for soldering formed on the conductive elastic resin film.
19 Citations
5 Claims
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1. A chip-type electronic component comprising:
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a ceramic chip body incorporating an element and including a mount surface and a side surface;
an external electrode for the element formed on the side surface of the chip body;
a conductive elastic resin film which is larger in width than the external electrode and formed to cover the external electrode and extend onto part of the mount surface of the chip body; and
a metal plating film for soldering formed on the conductive elastic resin film. - View Dependent Claims (2, 3)
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4. A method of making a ceramic chip-type electronic component comprising the steps of:
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forming, on a side surface of a ceramic chip body incorporating an element, an external electrode for the element;
forming a conductive elastic resin film, which is larger in width than the external electrode, on the external electrode so that the conductive elastic resin film covers the external electrode and extends onto part of either an upper surface or a lower surface of the chip body; and
forming, on an obverse surface of the conductive elastic resin film, a metal plating film for soldering. - View Dependent Claims (5)
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Specification