Thermal dissipation device with thermal compound recesses

• US 20060238984A1
• Filed: 04/20/2005
• Published: 10/26/2006
• Est. Priority Date: 04/20/2005
• Status: Abandoned Application

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Belady, Christian L., Peterson, Eric C.
• Application Number:
  US11/110,404
• Publication Number:
  US 20060238984A1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Embodiments include apparatus, methods, and systems providing a thermal dissipation device with thermal compound recesses. In one embodiment, the thermal dissipation device includes a body with plural recesses formed in a planar surface of the body. The recesses are adapted to receive a thermal compound that conducts heat from an electronic heat generating component to the thermal dissipation device.

Claims

1. ) A thermal dissipation device, comprising:

a body with plural recesses formed in a planar surface of the body, the recesses adapted to receive a thermal compound that conducts heat from an electronic heat generating component to the thermal dissipation device.

2. ) The thermal dissipation device of claim 1, wherein the recesses are manufactured in a pattern on the planar surface.

3. ) The thermal dissipation device of claim 1, wherein the recesses are parallel and spaced grooves extending along substantially all of a length or width of the planar surface.

4. ) The thermal dissipation device of claim 1, wherein the recesses form a rectangular grid.

5. ) The thermal dissipation device of claim 1, wherein the recesses are evenly distributed pits formed in the planar surface.

6. ) The thermal dissipation device of claim 1, wherein the recesses evenly distribute the thermal compound between the planar surface and an interface with the electronic heat generating component.

7. ) The thermal dissipation device of claim 1, wherein the body includes a second planar surface opposite the planar surface, the second planar surface having plural recesses adapted to receive a thermal compound.

8. ) A thermal dissipation device, comprising:

a body with plural recesses manufactured in a surface of the body, wherein the recesses at least partially fill with a thermal compound to uniformly distribute the thermal compound between the surface and an electronic heat generating component.

9. ) The thermal dissipation device of claim 8, wherein the recesses have a rectangular shape.

10. ) The thermal dissipation device of claim 8, wherein the recesses have a circular shape.

11. ) The thermal dissipation device of claim 8, wherein the recesses are evenly distributed on the surface.

12. ) The thermal dissipation device of claim 8, wherein the recesses include parallel grooves that are evenly spaced along the surface.

13. ) The thermal dissipation device of claim 8, wherein the recesses fill with excess thermal compound that is applied between the surface and the heat generating component.

14. ) The thermal dissipation device of claim 8, wherein the recesses include two sets of grooves that intersect at right angles.

15. ) The thermal dissipation device of claim 8, wherein the recesses form a pattern of repeating indentations having a same geometric shape.

16. ) A method, comprising:

disposing a thermal compound between a surface of a thermal dissipation device and a surface of an electronic heat generating component such that at least a portion of the thermal compound flows into recesses manufactured into the surface of the thermal dissipation device.

17. ) The method of claim 16 further comprising forming a uniform distribution of the thermal compound between the surface of the heat generating component and the surface of the thermal dissipation device.

18. ) The method of claim 16 further comprising forming the recesses into a pattern on the surface of the thermal dissipation device.

19. ) The method of claim 16 further comprising forming the recesses into a grid of evenly spaced grooves on the surface of the thermal dissipation device.

20. ) The method of claim 16 further comprising filling the recesses with excess thermal compound to prevent the thermal compound from seeping from an interface formed between the surface of the thermal dissipation device and the surface of the heat generating component.