×

Chip level biostable interconnect for implantable medical devices

  • US 20060241731A1
  • Filed: 04/26/2005
  • Published: 10/26/2006
  • Est. Priority Date: 04/26/2005
  • Status: Active Grant
First Claim
Patent Images

1. A lead connection structure for an implantable medical device, comprising:

  • an integrated circuit having a lead bonding region that includes a lead-receiving recessed region; and

    a lead conductor having at least a portion thereof bonded in the lead-receiving recessed region.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×