Substrate processing apparatus and substrate processing method
0 Assignments
0 Petitions
Accused Products
Abstract
The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
-
Citations
35 Claims
-
1-19. -19. (canceled)
-
20. A substrate processing apparatus, comprising:
-
a loading/unloading area for carrying in and out a substrate;
a cleaning area for cleaning the substrate; and
a plating area provided with a processing tank for plating the substrate, wherein the plating area is provided with a plating solution supply device including a plating solution circulation tank for storing a plating solution and circulating the plating solution between it and the processing tank, a heating section for heating the plating solution in the plating solution circulation tank, a thermometer for measuring the temperature of the plating solution stored in the plating solution circulation tank, a thermometer for measuring the temperature of the plating solution in the processing tank, and a plating solution supply pump for controlling the circulation amount of the plating solution circulating between the plating solution circulation tank and the processing tank so that the temperature of the plating solution in the processing tank becomes a suitable temperature for plating.
-
-
21. A substrate processing apparatus, comprising:
-
a loading/unloading area for carrying in and out a substrate;
a cleaning area for cleaning the substrate; and
a plating area provided with a processing tank for plating the substrate, and a plating solution circulation tank for storing a plating solution and circulating the plating solution between it and the processing tank, wherein the plating solution circulation tank is provided with a plating solution concentration diluting device for adjusting the concentration of the plating solution to a proper concentration.
-
-
22-29. -29. (canceled)
-
30. A substrate processing apparatus, comprising:
-
a loading/unloading area for carrying in and out a substrate;
a cleaning area for cleaning the substrate; and
a plating area provided with a processing tank for plating the substrate, wherein the plating area is provided with a plating solution circulation tank for supplying a plating solution to the processing tank and circulating the plating solution, and the plating solution circulation tank is provided with an indirect heating section for circulating a heated fluid as a heat medium within a tube to thereby heat the plating solution in an indirect manner.
-
-
31. A substrate processing apparatus, comprising:
-
a loading/unloading area for carrying in and out a substrate;
a cleaning area for cleaning the substrate; and
a plating area provided with a processing tank for plating the substrate, wherein the plating area is provided with a plating solution circulation tank for supplying a plating solution to the processing tank and circulating the plating solution, and the plating solution circulation tank has a double or multiple structure.
-
-
32. A substrate processing apparatus, comprising:
-
a loading/unloading area for carrying in and out a substrate;
a cleaning area for cleaning the substrate; and
a plating area provided with a processing tank for plating the substrate, wherein the processing tank is equipped with a thermometer for measuring the temperature of a plating solution in the processing tank.
-
-
33. (canceled)
-
34. A substrate processing apparatus, comprising:
-
a loading/unloading area for carrying in and out a substrate;
a cleaning area for cleaning the substrate; and
a plating area provided with a processing tank for plating the substrate, wherein the plating area is provided with a plating solution circulation tank for supplying a plating solution to the processing tank and circulating the plating solution, and a gas bubble dissolution preventing section which, when the plating solution flows into the plating solution circulation tank, prevents gas bubbles from dissolving into the plating solution is provided in a pipe for circulating the plating solution from the processing tank to the plating solution circulation tank.
-
-
35-71. -71. (canceled)
Specification