INTEGRATED CIRCUIT HEAT PIPE HEAT SPREADER WITH THROUGH MOUNTING HOLES

• US 20060243425A1
• Filed: 07/14/2006
• Published: 11/02/2006
• Est. Priority Date: 05/12/1999
• Status: Abandoned Application

• Current Assignee: Aavid Thermalloy LLC (LTI Flexible Products Inc.)
• Original Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Inventors: Dussinger, Peter M., Myers, Thomas L.
• Application Number:
  US11/457,682
• Publication Number:
  US 20060243425A1
• Time in Patent Office: Days
• US Class Current: 165/104.260
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

Claims

1. A heat pipe for spreading heat comprising:

a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber;

at least one hollow column positioned within said vapor chamber and sealingly bonded to said first and second plates, having an open first end that opens through said first plate and an open second end that opens through said second plate so as to form at least one mounting hole that is isolated from said vapor chamber.

2. A heat pipe for spreading heat according to claim 1 wherein said spaced-apart first and second plates include confronting interior surfaces;

and

a wick positioned upon said confronting interior surfaces of said first and second plates the exterior surface of said at least one hollow column disposed within said vapor chamber.