Electromagnetic interference shielding of electrical cables and connectors

• US 20060243476A1
• Filed: 06/09/2006
• Published: 11/02/2006
• Est. Priority Date: 04/17/2000
• Status: Abandoned Application

• Current Assignee: WaveZero, Inc.
• Original Assignee: WaveZero, Inc.
• Inventors: Ortiz, Jesus Al, Arnold, Rocky R.
• Application Number:
  US11/450,087
• Publication Number:
  US 20060243476A1
• Time in Patent Office: Days
• US Class Current: 174/75.C
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49176 with molding of electrically insulating material
• CPC Class Codes: Y10T 29/4922 with molding of insulation
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Claims

1. A shielded cable comprising:

a conductive lead encapsulated within a dielectric;

a polymer layer surrounding the dielectric;

a metallized layer surrounding the polymer layer; and

a insulative coating disposed around the metallized layer.

2. The shielded cable of claim 1 wherein the metallized layer is thermally evaporated over the polymer layer so as to create a substantially uniform thickness.

3. The shielded cable of claim 1 further comprising a base coating disposed between the metallized layer and the polymer layer, wherein the base coating improves adherence of the metallized layer to the polymer layer.

4. The shielded cable of claim 1 wherein the polymer layer comprises a thermoformable material.

5. The shielded cable of claim 1 further comprising an electrically conductive connector that is electrically coupled to the metallized layer, wherein the connector can be coupled to ground.

6. The shielded cable of claim 5 wherein the electrically conductive connector comprises a metallized thermoform.

7. The shielded cable of claim 6 wherein the metallized thermoform comprises a first body and a second body.

8. A cable shield for shielding a cable body, the shield comprising:

a thermoform body comprising an inner surface and outer surface, the thermoform body sized and shaped to surround the cable; and

a metal layer disposed along one of the inner surface and outer surface.

9. The cable shield of claim 8 further wherein the thermoform body comprises a first body and a second body.

10. The cable shield of claim 9 wherein the first body and second body are coupled together with a clamp.

11. The cable shield of claim 8 wherein the thermoform body comprises at least one of ribs, cutouts, and corrugation to facilitate flexing of the thermoform body.

12. The cable shield of claim 8 wherein the metallized layer is disposed along the outer surface of the thermoform body, the shield further comprising an insulating layer disposed over the metal layer.

13. The cable shield of claim 8 wherein the metallized thermoform comprises an integral connector at an end of the thermoform body, wherein the integral connector can shield a connector pin assembly of the cable.