Light emitting device, method of preparing the same and device for fabricating the same
1 Assignment
0 Petitions
Accused Products
Abstract
A light emitting device having a high definition, a high aperture ratio and a high reliability is provided. The present invention realizes a high definition and a high aperture ratio for a flat panel display of full colors using luminescent colors of red, green and blue without being dependent upon the film formation method and deposition precision of an organic compound layer by forming the laminated sections 21, 22 by means of intentionally and partially overlapping different organic compound layers of adjacent light emitting elements. Moreover, the protective film 32a containing hydrogen is formed and the drawback in the organic compound layer is terminated with hydrogen, thereby realizing the enhancement of the brightness and the reliability.
95 Citations
54 Claims
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1-30. -30. (canceled)
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31. A light emitting device comprising:
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a substrate;
a pixel portion including a light emitting element on the substrate;
a drive circuit portion on the substrate;
a first terminal portion for pasting a first FPC on the substrate; and
a second terminal portion for pasting a second FPC on the substrate. - View Dependent Claims (32, 33, 34)
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35. A light emitting device comprising:
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a substrate;
a pixel portion including a light emitting element on the substrate;
a drive circuit portion on the substrate;
a first terminal portion for pasting a first FPC on the substrate;
a second terminal portion for pasting a second FPC on the substrate; and
a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion, wherein the sealing substrate is pasted with a sealing member at least in the part of the first terminal portion, in the part of the second terminal portion and a part of the drive circuit portion. - View Dependent Claims (36, 37, 38)
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39. A light emitting device comprising:
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a substrate;
a pixel portion including a light emitting element on the substrate;
a drive circuit portion on the substrate;
a first terminal portion for pasting a first FPC on the substrate;
a second terminal portion for pasting a second FPC on the substrate; and
a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion, wherein the sealing substrate is pasted with a sealing member at least in the part of the first terminal portion, and in the part of the second terminal portion, wherein a convex portion is formed on a region of the sealing substrate, and wherein the sealing member is between the substrate and the region where the convex portion is formed. - View Dependent Claims (40, 41, 42, 43)
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44. A light emitting device comprising:
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a substrate;
a pixel portion including a light emitting element on the substrate;
a drive circuit portion on the substrate;
a first terminal portion for pasting a first FPC on the substrate;
a second terminal portion for pasting a second FPC on the substrate;
an interlayer insulating film over the substrate; and
a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion, wherein the interlayer insulating film has a concave portion in each of the first terminal portion and the second terminal portion, wherein an inorganic insulating film is formed over the interlayer insulating film and in the concave portion, and wherein a sealing member is between the sealing substrate and the inorganic insulating film and a part of the sealing member is in the concave portion. - View Dependent Claims (45, 46, 47, 48)
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49. A light emitting device comprising:
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a substrate;
a pixel portion including a light emitting element on the substrate;
a drive circuit portion on the substrate;
a first terminal portion for pasting a first FPC on the substrate;
a second terminal portion for pasting a second FPC on the substrate;
an interlayer insulating film over the substrate; and
a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion, wherein the interlayer insulating film has a concave portion in each of the first terminal portion and the second terminal portion, wherein an inorganic insulating film is formed over the interlayer insulating film and in the concave portion, wherein a convex portion is formed on a region of the sealing substrate, and wherein a sealing member is between the region where the convex portion is formed and the inorganic insulating film and a part of the sealing member is in the concave portion. - View Dependent Claims (50, 51, 52, 53, 54)
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Specification