PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES
First Claim
1. An integrated circuit assembly comprising:
- an electronic chip; and
a post structure mounted on the electronic chip and capable of protecting an air-bridge structure and supporting a C4 structure.
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Accused Products
Abstract
A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structure embedded in a plurality of materials having a plurality of vaporization temperatures. The plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip. To fabricate the circuit assembly, a support structure that may include post structures is formed on an electronic chip. Interstices of the support structure are filled with a material having a vaporization temperature that is less than the vaporization temperature of the support structure. Conductive structures are embedded in the support structure and the material, and a connective structure is mounted on the support structure. Finally, the material is removed from the interstices by heating the circuit assembly.
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Citations
39 Claims
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1. An integrated circuit assembly comprising:
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an electronic chip; and
a post structure mounted on the electronic chip and capable of protecting an air-bridge structure and supporting a C4 structure. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated circuit assembly comprising:
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an electronic chip;
a material layer fabricated on a surface of the electronic chip, the material layer including a fill material;
a plurality of post structures embedded in the fill material; and
one or more air-bridge conductive structures embedded in the fill material. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An integrated circuit assembly comprising:
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an electronic chip;
an air-bridge conductive structure coupling one or more electronic devices embedded in the electronic chip; and
a plurality of post structures to support a C4 conductive structure, wherein one or more of the plurality of post structures supports the air-bridge conductive structure. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
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28. A computer system comprising:
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a processor;
a memory device having a plurality of circuit devices, the memory device coupled to the processor; and
an air-bridge structure and a support structure fabricated on the memory device, the air-bridge structure capable of coupling at least two of the plurality of circuit devices and the support structure capable of supporting the memory device mounted as a flip chip, wherein the support structure includes a plurality of post structures. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification