PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES

• US 20060244112A1
• Filed: 07/12/2006
• Published: 11/02/2006
• Est. Priority Date: 08/25/1999
• Status: Abandoned Application

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Farrar, Paul A.
• Application Number:
  US11/457,110
• Publication Number:
  US 20060244112A1
• Time in Patent Office: Days
• US Class Current: 257/672
• CPC Class Codes: H01L 21/7682 the dielectric comprising air gaps
• CPC Class Codes: H01L 23/20 gaseous at the normal operating temperature of the device
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/4821 Bridge structure with air gap
• CPC Class Codes: H01L 23/5222 Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5329 Insulating materials
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structure embedded in a plurality of materials having a plurality of vaporization temperatures. The plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip. To fabricate the circuit assembly, a support structure that may include post structures is formed on an electronic chip. Interstices of the support structure are filled with a material having a vaporization temperature that is less than the vaporization temperature of the support structure. Conductive structures are embedded in the support structure and the material, and a connective structure is mounted on the support structure. Finally, the material is removed from the interstices by heating the circuit assembly.

Claims

1. An integrated circuit assembly comprising:

an electronic chip; and

a post structure mounted on the electronic chip and capable of protecting an air-bridge structure and supporting a C4 structure.

2. The integrated circuit assembly of claim 1, wherein the post structure is fabricated from a same material as the air-bridge structure.

3. The integrated circuit assembly of claim 1, wherein the post structure is mounted on an insulating base formed on the electronic chip.

4. The integrated circuit assembly of claim 1, wherein the post structure is fabricated from an insulator.

5. The integrated circuit assembly of claim 4, wherein the insulator is silicon dioxide.

6. The integrated circuit assembly of claim 1, wherein the post structure is fabricated from a polymer.

7. The integrated circuit assembly of claim 6, wherein the polymer is polyimide.

8. An integrated circuit assembly comprising:

an electronic chip;

a material layer fabricated on a surface of the electronic chip, the material layer including a fill material;

a plurality of post structures embedded in the fill material; and

one or more air-bridge conductive structures embedded in the fill material.

9. The integrated circuit assembly of claim 8, further including a C4 structure including an insulating layer, a vaporization plug, and one or more conductive elements formed in the insulating layer, the C4 structure formed above the fill material.

10. The integrated circuit assembly of claim 8, wherein the plurality of post structures isformed from an inorganic material.

11. The integrated circuit assembly of claim 8, wherein the plurality of post structures is formed from a conductor.

12. The integrated circuit assembly of claim 11, wherein each of the plurality of posts structures is formed on an insulating base on the a surface of the electronic chip.

13. The integrated circuit assembly of claim 8, wherein the plurality of post structures is formed from a same material used to form the air-bridge conductive structure.

14. The integrated circuit assembly of claim 8, wherein the fill material is carbon.

15. The integrated circuit assembly of claim 8, wherein the fill material is foam.

16. The integrated circuit assembly of claim 8, wherein the fill material has a vaporization temperature that is different from a vaporization temperature of the material from which the plurality of post structures is fabricated.

17. The integrated circuit assembly of claim 8, wherein the electronic chip is a memory chip.

18. The integrated circuit assembly of claim 8, wherein the one or more air-bridge conductive structures include copper.

19. The integrated circuit assembly of claim 8, wherein at least one of the one or more air-bridge conductive structures include a plurality of vertical wiring vias and a conductive interconnect path.

20. An integrated circuit assembly comprising:

an electronic chip;

an air-bridge conductive structure coupling one or more electronic devices embedded in the electronic chip; and

a plurality of post structures to support a C4 conductive structure, wherein one or more of the plurality of post structures supports the air-bridge conductive structure.

21. The integrated circuit assembly of claim 20, wherein the air-bridge conductive structure is a long-run air bridge conductive structure.

22. The integrated circuit assembly of claim 20, wherein each of the one or more post structures supporting the air-bridge conductive structure is fabricated from a same material as the air-bridge conductive structure.

23. The integrated circuit assembly of claim 22, wherein each of the one more post structures supporting the air-bridge conductive structure terminates in an insulator at a surface of the electronic chip.

24. The integrated circuit assembly of claim 20, wherein the one or more post structures supporting the air-bridge conductive structure are insulating posts.

25. The integrated circuit assembly of claim 24, wherein the insulating posts are formed from silicon dioxide.

26. The integrated circuit assembly of claim 20, wherein the air-bridge conductive structure includes copper.

27. The integrated circuit assembly of claim 20, wherein the air-bridge conductive structure includes gold.

28. A computer system comprising:

a processor;

a memory device having a plurality of circuit devices, the memory device coupled to the processor; and

an air-bridge structure and a support structure fabricated on the memory device, the air-bridge structure capable of coupling at least two of the plurality of circuit devices and the support structure capable of supporting the memory device mounted as a flip chip, wherein the support structure includes a plurality of post structures.

29. The computer system of claim 28, wherein the plurality of post structures is fabricated from a conductor.

30. The computer system of claim 29, wherein the conductor includes copper.

31. The computer system of claim 29, wherein the conductor includes aluminum.

32. The computer system of claim 29, wherein the conductor includes gold.

33. The computer system of claim 29, wherein the conductor includes silver.

34. The computer system of claim 28, wherein one or more of the plurality of post structures are insulating posts.

35. The computer system of claim 28, wherein one or more of the plurality of post structures is fabricated from silicon dioxide.

36. The computer system of claim 28, wherein one or more of the plurality of post structures supports the air-bridge structure.

37. The computer system of claim 28, wherein one or more of the plurality of post structures supporting the air-bridge structure is formed from a same material as the air-bridge structure.

38. The computer system of claim 28, wherein the memory device is coupled to the processor by an address bus, a data bus, and a control bus.

39. The computer system of claim 28, further including a heat sink coupled to the electronic chip.