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PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES

  • US 20060244112A1
  • Filed: 07/12/2006
  • Published: 11/02/2006
  • Est. Priority Date: 08/25/1999
  • Status: Abandoned Application
First Claim
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1. An integrated circuit assembly comprising:

  • an electronic chip; and

    a post structure mounted on the electronic chip and capable of protecting an air-bridge structure and supporting a C4 structure.

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