Radio frequency identification tag with improved directivity and coverage distance stability

• US 20060244605A1
• Filed: 12/23/2005
• Published: 11/02/2006
• Est. Priority Date: 04/28/2005
• Status: Abandoned Application

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Sakama, Isao, Ashizawa, Minoru
• Application Number:
  US11/315,213
• Publication Number:
  US 20060244605A1
• Time in Patent Office: Days
• US Class Current: 340/572.700
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/04 Resonant antennas

Abstract

A radio frequency IC tag has wide directivity and is rich in flexibility. A radiation conductor is formed on the entire surface of a dielectric formed of synthetic resin foam and a back conductor is formed on the entire back surface of the dielectric. An IC chip is mounted to the radiation conductor on the front side. An L-shaped slit is formed at the portion of the radiation conductor at which the IC chip is mounted. The radiation conductor and the back conductor have the same size or the size of the back conductor is not greater than twice the size of the radiation conductor.

Claims

1. A radio wave IC tag equipped with a micro-strip antenna, said micro-strip antenna including a radiation electrode to which an IC chip is mounted, a ground electrode and a dielectric interposed between said radiation electrode and said ground electrode, wherein said radiation electrode and said ground electrode have substantially the same size.

2. A radio frequency IC tag according to claim 1, wherein said dielectric is synthetic resin foam.

3. A radio frequency IC tag according to claim 2, wherein said synthetic resin foam is any of acryl, synthetic rubber or polyethylene, or their composite body.

4. A radio frequency IC tag according to claim 3, wherein a foaming ratio of said synthetic resin foam is zero.

5. A radio frequency IC tag according to claim 2, wherein the shape of said synthetic resin foam is a rectangle, a polygon or a circle.

6. A radio frequency IC tag according to claim 5, wherein said dielectric includes a thin film resin, and said radiation electrode and said ground electrode are shaped into a thin film by metal vacuum deposition through said thin film resin.

7. A radio frequency IC tag according to claim 1, wherein said dielectric is paper.

8. A radio frequency IC tag according to claim 1, further comprising a casing having therein a cavity, and wherein said radiation electrode and said ground electrode are arranged on a lid side and a bottom side of said casing, respectively, and said dielectric is materialized by air between said radiation electrode and said ground electrode.

9. A radio frequency IC tag according to claim 8, wherein said radiation electrode has a power feed portion to which said IC chip is mounted and radiation portions existing on both sides of said power feed portion, and said radiation electrode has generally an H-shape that is contracted at said power feed portion and expands at said radiation portions.

10. A radio frequency IC tag according to claim 9, wherein an opening is formed in said radiation electrode, said ground electrode and said dielectric in such a manner as to penetrate through them.

11. A radio frequency IC tag according to claim 8, wherein said radiation electrode has a power feed portion to which said IC chip is mounted and radiation portions existing on both sides of said power feed portion, said radiation electrode is contracted at said power feed portion, said radiation portions are shaped into a semi-circle, respectively, and said power feed portion and said radiation portions form a circle.

12. A radio wave IC tag equipped with a micro-strip antenna, said micro-strip antenna including a radiation electrode to which an IC chip is mounted, a ground electrode and a dielectric interposed between said radiation electrode and said ground electrode, wherein the size of said ground electrode is not greater than twice the size of said radiation electrode.

13. A radio frequency IC tag according to claim 12, wherein said dielectric is synthetic resin foam.

14. A radio frequency IC tag according to claim 13, wherein said synthetic resin foam is any of acryl, synthetic rubber and polyethylene, or their composite body.

15. A radio frequency IC tag according to claim 14, wherein a foaming ratio of said synthetic resin foam is zero.

16. A radio frequency IC tag according to claim 13, wherein the shape of said synthetic resin foam is a rectangle, a polygon or a circle.

17. A radio frequency IC tag according to claim 16, wherein said dielectric includes a thin film resin, and said radiation electrode and said ground electrode are shaped into a thin film by metal vacuum deposition through said thin film resin.

18. A radio frequency IC tag according to claim 12, wherein said dielectric is paper.

19. A radio frequency IC tag according to claim 12, further comprising a casing having therein a cavity, and wherein said radiation electrode and said ground electrode are arranged on a lid side and a bottom side of said casing, respectively, and said dielectric is materialized by air between said radiation electrode and said ground electrode.

20. A radio frequency IC tag according to claim 19, wherein said radiation electrode has a power feed portion to which said IC chip is mounted and radiation portions existing on both sides of said power feed portion, and said radiation electrode has generally an H-shape that is contracted at said power feed portion and expands at said radiation portions.

21. A radio frequency IC tag according to claim 20, wherein an opening is formed in said radiation electrode, said ground electrode and said dielectric in such a manner as to penetrate through them.

22. A radio frequency IC tag according to claim 19, wherein said radiation electrode has a power feed portion to which said IC chip is mounted and radiation portions existing on both sides of said power feed portion, said radiation electrode is contracted at said power feed portion, said radiation portions are shaped into a semi-circle, respectively, and said power feed portion and said radiation portions form a circle.

23. A radio wave IC tag equipped with a micro-strip antenna, said antenna having a micro-strip antenna structure including a radiation electrode to which an IC chip is mounted, a ground electrode and a dielectric interposed between said radiation electrode and said ground electrode, wherein said antenna has both-side directivity.

24. A radio frequency IC tag according to claim 23, wherein said radiation electrode and said ground electrode have substantially the same size.

25. A radio frequency IC tag according to claim 23, wherein the size of said ground electrode is not greater than twice the size of said radiation electrode.