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Microelectronic die including thermally conductive structure in a substrate thereof and method of forming same

  • US 20060246621A1
  • Filed: 03/31/2006
  • Published: 11/02/2006
  • Est. Priority Date: 02/14/2002
  • Status: Abandoned Application
First Claim
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1. A method of forming a microelectronic die having a backside and an active surface, the method, comprising:

  • providing a die substrate;

    providing a thermally conductive structure configured to conduct heat through a thickness of the die substrate, the thermally conductive structure comprising thermal contact zones disposed to dissipate heat from a backside of the die;

    providing a plurality of build-up layers on the die substrate to form the die comprising;

    providing a plurality of microelectronic devices on the die substrate; and

    providing electrical interconnects connecting the microelectronic devices and providing electrical contacts to and from the devices, the interconnects being distinct from the thermally conductive structure.

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