Actively cooled external energy source, external charger, system of transcutaneous energy transfer, system of transcutaneous charging and method therefore

• US 20060247738A1
• Filed: 04/29/2005
• Published: 11/02/2006
• Est. Priority Date: 04/29/2005
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Phillips, William C., Howard, William G., Scott, Erik R., Olson, David P., Schmeling, Andrew L., Schommer, Mark E.
• Granted Patent: US 7,505,816 B2
• Time in Patent Office: Days
• US Class Current: 607/61
• CPC Class Codes: A61N 1/3787 from an external energy source

Abstract

External energy source, external charger, system of transcutaneous energy transfer, system of transcutaneous charging and method thereof. An implantable medical device has a secondary coil operatively coupled to therapeutic componentry. An external power source has a housing, a primary coil carried in the housing with the primary coil being capable of inductively energizing the secondary coil when the housing is externally placed in proximity of the secondary coil with a first surface of the housing positioned closest to the secondary coil and a thermo-electric cooling device placed associated with the first surface of the housing.

Claims

1. An external power source for an implantable medical device having a secondary coil operatively coupled to therapeutic componentry, comprising:

a housing;

a primary coil carried in said housing, said primary coil being capable of inductively energizing said secondary coil when said housing is externally placed in proximity of said secondary coil with a first surface of said housing positioned closest to said secondary coil;

a thermoelectric cooling device placed associated with said first surface of said housing.

2. An external power source as in claim 1 wherein said thermo-electric cooling device is contained within said housing.

3. An external power source as in claim 2 wherein said thermo-electric cooling device is capable of transferring heat away from said first surface of said housing.

4. An external power source as in claim 2 wherein said thermo-electric device comprises a Peltier junction.

5. An external power source as in claim 2 further comprising at least one additional cooling device thermally coupled with said thermo-electric cooling device.

6. An external power source as in claim 5 wherein said additional cooling device comprises a fan.

7. An external power source as in claim 5 wherein said additional cooling device comprises a cooling fin.

8. An external power source as in claim 2 wherein said external power source further comprises two layers of ceramic and wherein said thermo-electric cooling device is sandwiched between said two layers of ceramic.

9. An external power source as in claim 8 wherein one of said two layers of ceramic forms said first surface.

10. An external power source as in claim 1 wherein said first surface is thermally conductive.

11. An external power source as in claim 1 further comprising an energy absorptive material carried within said housing.

12. An external power source as in claim 1 further comprising a thermally conductive liquid carried within said housing.

13. An external power source as in claim 12 further comprising a liquid pump operatively coupled to said thermally conductive liquid.

14. An external power source as in claim 1 further comprising at least one layer of highly permeable material placed on at least one side of said thermo-electric cooling device.

15. A system of transcutaneous energy transfer, comprising:

an implantable medical device having a secondary coil operatively coupled to therapeutic componentry;

an external power source as in claim 1.

16. A system of charging, comprising:

an implantable medical device as in claim 1, further comprising;

a rechargeable power source;

wherein said therapeutic componentry is operatively coupled to said rechargeable power source; and

wherein said secondary coil is operatively coupled to said rechargeable power source.

17. A method of transcutaneous energy transfer from an external power source comprising an external housing and a primary coil carried in said external housing, said primary coil being capable of inductively energizing said secondary coil when said housing is externally placed in proximity of said secondary coil with a first surface of said housing positioned closest to said secondary coil to an implantable medical device comprising a first housing having operational componentry for providing said therapeutic output and a secondary housing mechanically coupled to said first housing having a secondary coil operatively coupled to said componentry, said secondary coil capable of receiving energy from said external source, comprising the steps of:

positioning a magnetically shielding material between said secondary coil and said first housing;

applying energy to said primary coil; and

actively cooling said first surface of said housing.

18. A method of transcutaneous energy transfer as in claim 17 wherein said step of actively cooling said first surface comprises transferring heat away from said first surface of said housing.

19. A method of transcutaneous energy transfer as in claim 17 wherein said thermo-electric device comprises a Peltier junction.

20. A method of transcutaneous energy transfer as in claim 17 further comprising the step of additionally cooling said housing with an additional cooling device.

21. A method of transcutaneous energy transfer as in claim 20 wherein said additional cooling device comprises a fan.

22. A method of transcutaneous energy transfer as in claim 20 wherein said additional cooling device comprises a cooling fin.

23. A method of transcutaneous energy transfer as in claim 17 further comprising the step of making said first surface of said housing thermally conductive.

24. A method of transcutaneous energy transfer as in claim 17 further comprising the step of carrying an energy absorptive material carried within said housing.

25. A method as in claim 17 further comprising the step of coupling a temperature sensor thermally to said thermally conductive surface.

26. A method as in claim 17 further comprising the step of pumping a cooling liquid through said housing.