Solder comprising elemental powder

• US 20060249231A1
• Filed: 04/28/2006
• Published: 11/09/2006
• Est. Priority Date: 04/28/2005
• Status: Abandoned Application

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Bezerra, Patricia, Ott, Michael
• Application Number:
  US11/413,840
• Publication Number:
  US 20060249231A1
• Time in Patent Office: Days
• US Class Current: 148/425
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: B23K 35/3046 Co as the principal constituent
• CPC Class Codes: C22C 19/05 with chromium
• CPC Class Codes: C22C 19/051 and Mo or W
• CPC Class Codes: C22C 19/058 without Mo and W
• CPC Class Codes: C22C 19/07 based on cobalt
• CPC Class Codes: F01D 5/005 Repairing methods or devices
• CPC Class Codes: F05D 2230/237 Brazing
• CPC Class Codes: F05D 2230/30 with deposition of material
• CPC Class Codes: Y02T 50/60 Efficient propulsion technologies, e.g. for aircraft

Abstract

Solders contain at least one agent for lowering the melting point, but these agents lead to a deterioration in the properties of the component to which the solder is applied. The solder according to the invention has a composition which is identical or similar to that of a solder according to the prior art, but in this case the elements which form a compound with the agent for lowering the melting point are at least partially added in powder form.

Claims

1. A solder for repairing a nickel, cobalt or iron based super alloy component, comprising:

a base alloy made from a plurality of alloying elements; and

an agent that lowers the melting temperature of the solder and forms a foreign phase-forming alloying element in the solder during soldering or during use of the component wherein the foreign phase-forming alloying element in the solder is at least partially in the form of elemental metallic additional powder.

2. The solder as claimed in claim 1, wherein the solder contains alloying elements selected from the group consisting of:

chromium, aluminum, tantalum and tungsten.

3. The solder as claimed in claim 2, wherein the solder comprises a single agent for lowering the melting point.

4. The solder as claimed in claim 3, wherein the agent for lowering the melting point is boron.

5. The solder as claimed in claim 3, wherein the solder includes two agents for lowering the melting point.

6. The solder as claimed in claim 3, wherein the agent for lowering the melting point is silicon.

7. The solder as claimed in claim 1, wherein the foreign phase-forming alloying element is tungsten or chromium.

8. The solder as claimed in claim 1, wherein the foreign phase-forming alloying element is tungsten and chromium.

9. The solder as claimed in claim 1, wherein the foreign phase-forming alloying element is from 1 to 4% by weight of tungsten or chromium in powder form.

10. The solder as claimed in claim 1, wherein the foreign phase-forming alloying element is from 1 to 4% by weight of tungsten and chromium in powder form.

11. The solder as claimed in claim 1, wherein the additional powder has a grain sizes of less than 500 nm.

12. The solder as claimed in claim 11, wherein the additional powder has a grain sizes of less than 300 nm.

13. The solder as claimed in claim 12, wherein the additional powder has a grain sizes of less than 100 nm.

14. The solder as claimed in claim 11, wherein in the foreign phase-forming alloying element in powder form is added to a solder having the composition Me1Me2_YMe3_ZMe4_w wherein Me is an alloying element.

15. The solder as claimed in claim 14, wherein the solder stoichiometry is restored to an initial solder stoichiometry by the addition of the at least one foreign phase-forming alloying element in powder form.

16. The solder as claimed in claim 15, wherein the alloyed base material of the solder is in powder form.

17. The solder as claimed in claim 1, wherein the solder consists essentially of:

23% by weight of chromium,

3.5% by weight of tantalum,

10% by weight of nickel,

7.0% by weight of tungsten,

0.5% by weight of zirconium,

0.2% by weight of titanium,

0.1% by weight of manganese,

0.4% by weight of silicon,

0.6% by weight of carbon,

3.0% by weight of boron,

1.5% by weight of iron, and

remainder cobalt.

18. The solder as claimed in claim 1, wherein the solder consists essentially of:

20% by weight of chromium,

20% by weight of cobalt,

3% by weight of boron,

3% by weight of tantalum, and

remainder nickel.

19. The solder as claimed in claim 1, wherein the solder consists essentially of:

14% by weight of chromium,

10% by weight of cobalt,

2.7% by weight of boron,

2.5% by weight of tantalum,

3.5% by weight of aluminum, and

remainder nickel.

20. The solder as claimed in claim 1, wherein the solder consists essentially of:

21% by weight of nickel,

22% by weight of chromium,

2% by weight of boron,

3.5% by weight of tantalum; and

remainder cobalt.