Methods for preparing ball grid array substrates via use of a laser

• US 20060249492A1
• Filed: 07/13/2006
• Published: 11/09/2006
• Est. Priority Date: 05/21/2001
• Status: Abandoned Application

• Current Assignee: Frank L. Hall
• Original Assignee: Frank L. Hall
• Inventors: Hall, Frank L.
• Application Number:
  US11/485,704
• Publication Number:
  US 20060249492A1
• Time in Patent Office: Days
• US Class Current: 219/121.690
• CPC Class Codes: B08B 7/0042 by laser
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 26/3584 Increasing rugosity, e.g. roughening
• CPC Class Codes: G03F 7/42 Stripping or agents therefor
• CPC Class Codes: H01L 21/4864 Cleaning, e.g. removing of solder
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2223/5448 Located on chip prior to dicing and remaining on chip after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/381 by special treatment of the substrate

Abstract

A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Claims

1. A method for use in an automolding system comprising:

providing a substrate cleaning device for the automolding system;

introducing a substrate having a surface in the automolding system;

preheating the substrate;

forming a resist layer;

baking the substrate; and

removing contaminants from the substrate using the cleaning device.

2. The method for use in an automolding system of claim 1, wherein the substrate cleaning device comprises a laser.

3. The method for use in an automolding system of claim 2, wherein the laser comprises one of an Nd:

YAG laser and an excimer laser.

4. The method for use in an automolding system of claim 1, further comprising:

placing the substrate in a mold; and

encapsulating the substrate in the automolding system.

5. A cleaning method for use in an automolding system comprising:

providing a substrate cleaning device for the automolding system;

introducing a substrate having a surface in the automolding system;

preheating the substrate;

forming a resist layer;

baking the substrate; and

removing contaminants from the substrate using the cleaning device.

6. The cleaning method for use in an automolding system of claim 5, wherein the substrate cleaning device comprises a laser.

7. The cleaning method for use in an automolding system of claim 6, wherein the laser comprises one of an Nd:

YAG laser and an excimer laser.

8. The cleaning method for use in an automolding system of claim 5, further comprising:

placing the substrate in a mold; and

encapsulating the substrate in the automolding system.

9. A cleaning contaminant removal method for use in an automolding system comprising:

providing a substrate cleaning device for the automolding system;

introducing a substrate having a surface in the automolding system;

preheating the substrate;

forming a resist layer;

baking the substrate; and

removing contaminants from the substrate using the cleaning device.

10. The cleaning contaminant removal method for use in an automolding system of claim 9, wherein the substrate cleaning device comprises a laser.

11. The cleaning contaminant removal method for use in an automolding system of claim 10, wherein the laser comprises one of an Nd:

YAG laser and an excimer laser.

12. The cleaning contaminant removal method for use in an automolding system of claim 10, further comprising:

placing the substrate in a mold; and

encapsulating the substrate in the automolding system.

13. A method for cleaning contaminant removal for use in an automolding system comprising:

providing a substrate cleaning device for the automolding system;

introducing a substrate having a surface in the automolding system;

preheating the substrate;

forming a resist layer;

baking the substrate; and

removing contaminants from the substrate using the cleaning device.

14. The method for cleaning contaminant removal for use in an automolding system of claim 13, wherein the substrate cleaning device comprises a laser.

15. The method for cleaning contaminant removal for use in an automolding system of claim 14, wherein the laser comprises one of an Nd:

YAG laser and an excimer laser.

16. The method for cleaning contaminant removal for use in an automolding system of claim 13, further comprising:

placing the substrate in a mold; and

encapsulating the substrate in the automolding system.