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TANDEM UV CHAMBER FOR CURING DIELECTRIC MATERIALS

  • US 20060251827A1
  • Filed: 05/09/2005
  • Published: 11/09/2006
  • Est. Priority Date: 05/09/2005
  • Status: Abandoned Application
First Claim
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1. An ultraviolet (UV) curing chamber for curing dielectric materials disposed on substrates, comprising:

  • a body defining first and second process regions that are separate and adjacent to one another;

    a lid coupled to a top of the body to cover the first and second process regions, wherein the lid includes first and second quartz windows aligned respectively above the first and second process regions; and

    first and second UV bulbs disposed respectively above the first and second windows.

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