Hermetic bio-inert coatings for bio-implants fabricated using atomic layer deposition

• US 20060251875A1
• Filed: 05/06/2005
• Published: 11/09/2006
• Est. Priority Date: 05/06/2005
• Status: Abandoned Application

• Current Assignee: U Chicago Argonne, LLC
• Original Assignee: University of Chicago
• Inventors: Wang, Jian, Elam, Jeffrey W., Pellin, Michael J., Carlisle, John A.
• Application Number:
  US11/123,602
• Publication Number:
  US 20060251875A1
• Time in Patent Office: Days
• US Class Current: 428/213
• CPC Class Codes: A61L 27/30 Inorganic materials
• CPC Class Codes: A61L 27/50 Materials characterised by their function or physical properties , e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/249921 Web or sheet containing structurally defined element or component
• CPC Class Codes: Y10T 428/265 1 mil or less

Abstract

A biocompatible and bio-inert device is disclosed along with a method of making same. The device includes multiple layers of materials, preferably at least on layer of Al₂O₃, and an exterior amorphous layer, preferably TiO₂.

Claims

1. A device biocompatible with a warm blooded animal, comprising a structure having a conformal coating thereon that is substantially pinhole free and is composed of one or more layers deposited by atomic layer deposition (ALD), the exterior layer of said conformal coating being selected from one or more of Al₂O₃ or TiO₂ or ZrO₂ or V₂O₅ or TiN or Si₃N₄ or SiC or Ti.

2. The device of claim 1, wherein at least one of said layers is about 1 Angstrom in thickness.

3. The device of claim 1, wherein at least one of said layers is deposited at a temperature of less than about 400°

C.

4. The device of claim 1, wherein at least one of said layers is deposited at a temperature of not more than about 900°

C.

5. The device of claim 1, wherein at least one of said layers is deposited at a temperature of less than about 100°

C.

6. The device of claim 1, wherein at least one of said layers is deposited at substantially ambient temperature.

7. The device of claim 1, wherein said conformal coating has a thickness in the range of from about 100 Angstroms to about 10 microns.

8. The device of claim 1, wherein said conformal coating contains multiple layers at least one of which is Al₂O₃.

9. The device of claim 1, wherein the exterior layer of said conformal coating is substantially bio-inert in a human.

10. The device of claim 1, wherein the exterior layer of said conformal coating is TiO₂.

11. The device of claim 1, wherein said structure contains one or more of Si, Au, Ag, Pt, Pd, Ta, Cr, W, Ta, SiO₂, Al₂O₃, TiN, TaN, Si₃N₄, and polymers

12. A device implantable in a human, comprising a structure containing an electrical component having a conformal coating thereon that is substantially pinhole free and has a thickness not less than about 100 Angstroms and is composed of one or more layers deposited by atomic layer deposition (ALD), the exterior layer of said conformal coating being selected from one or more of Al₂O₃ or TiO₂ or ZrO₂ or V₂O₅ or TiN or Si₃N₄ or SiC or Ti.

13. The device of claim 12, wherein said electrical component includes a micro electrical mechanical (MEMS) device.

14. The device of claim 12, wherein said electrical component includes a semiconductor.

15. The device of claim 12, wherein said conformal coating has an exterior layer of TiO₂ with a thickness up to about 10 microns.

16. The device of claim 12, wherein ALD depositions occur at temperatures in the range of from about ambient to about 900°

C.

17. The device of claim 12, wherein said structure contains one or more of Si, Au, Ag, Pt, Pd, Ta, Cr, W, Ta, SiO₂, Al₂O₃, TiN, TaN, Si₃N₄, and polymers

18. A method of making a device biocompatible with a warm blooded animal, comprising providing a structure, depositing one or more amorphous layers on the structure by atomic layer deposition (ALD) forming a conformal coating thereon that is substantially pinhole free, the exterior layer of the conformal coating being selected from one or more of Al₂O₃ or TiO₂ or ZrO₂ or V₂O₅ or TiN or Si₃N₄ or SiC or Ti.

19. The method of claim 18, wherein the structure includes a layer of Al₂O₃ and an exterior layer of TiO₂.

20. The method of claim 19, wherein the Al₂O₃ layer has a thickness between about 100 Angstroms and 5 microns.