Method for manufacturing photoelectric package having control chip

• US 20060252173A1
• Filed: 05/03/2006
• Published: 11/09/2006
• Est. Priority Date: 05/06/2005
• Status: Abandoned Application

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Lin, John, Wang, Bily, Wu, Shih-Yu
• Application Number:
  US11/416,161
• Publication Number:
  US 20060252173A1
• Time in Patent Office: Days
• US Class Current: 438/48
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

A manufacturing method for a photoelectric package structure having a control chip is proposed. The photoelectric package structure concentrates light emitted therefrom, prevents external light interference and can be applied for advertising signs and backlight modules. Using the present invention increases the defect-free ratio and production quality. Applying the present invention for packaging light-emitting diode (LED) or optical sensor chips allows the necessary light-emitting requirements of electronic chips to be easily met. The package structure of the present invention is superior to conventional ones and the installation of the control chip doesn'"'"'t reduce the light-emitting intensity. The major innovation of the present invention is disposing a photoelectric chip (or multiple photoelectric chips) on a control chip and then installing the control chip upon a substrate. Thus, installation-of the components is more convenient. Furthermore, an external frame or optical gratings can also be included to prevent external light interference.

Claims

1. A manufacturing method for a photoelectric package structure having a control chip, comprising:

providing the control chip and a photoelectric chip, which are combined to form an initial structure;

combining the initial structure with a substrate to form a semi-finished package structure, wherein a surface of the control chip not being used for the chips'"'"' installation is combined with the substrate; and

providing, a package structure made of a transparent material for light transmission and disposed above the substrates to cover the photoelectric chip and the control chip;

wherein the substrate has an internal circuit.

2. The manufacturing method as claimed in claim 1, wherein the substrate has multiple layers.

3. The manufacturing method as claimed in claim 1, wherein the photoelectric chip is a light-emitting diode (LED) or an optical sensor.

4. The manufacturing method as claimed in claim 1, wherein the package structure is made of a macromolecule material.

5. The manufacturing method as claimed in claim 1, wherein the package structure further has a fluorescent powder distributed therein.

6. The manufacturing method as claimed in claim 5, wherein the fluorescent powder is a green or yellow fluorescent powder or includes a mixture of both.

7. The manufacturing method as claimed in claim 1, wherein the substrate is made of a copper circuit board.

8. The manufacturing method as claimed in claim 1, wherein the package structure further has a reflective frame surrounding thereof.

9. The manufacturing method as claimed in claim 1, wherein the package structure further has a processed portion.

10. The manufacturing method as claimed in claim 9, wherein the processed portion is formed with optical gratings or optical filter films.

11. The manufacturing method as claimed in claim 1, further comprising multiple photoelectric chips.

12. The manufacturing method as claimed in claim 11, wherein the photoelectric chips are arranged as an array or a totem.

13. The manufacturing method as claimed in claim 11, wherein lights emitted from the photoelectric chips are mixed to form a white light.

14. The manufacturing method as claimed in claim 11, wherein the substrate has external contacts, which connect to the internal circuit and are provided on one side, multiple predetermined sides or upon a rear surface of the substrate.

15. The manufacturing method as claimed in claim 1, further comprising:

connecting the control chip and the photoelectric chip to the internal circuit of the substrate via metal wires before the package structure is provided.

16. The manufacturing method as claimed in claim 1, wherein the control chip and the photoelectric chip are connected to the internal circuit of the substrate via a metal eutectic structure.