Photo-radiation source

• US 20060252336A1
• Filed: 04/20/2006
• Published: 11/09/2006
• Est. Priority Date: 03/29/2004
• Status: Active Grant

• Current Assignee: Articulated Technologies, LLC
• Original Assignee: Articulated Technologies, LLC
• Inventors: Daniels, John J., Nelson, Gregory V.
• Granted Patent: US 7,677,943 B2
• Time in Patent Office: Days
• US Class Current: 445/23
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G03G 15/6582 Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 428/917 Electroluminescent

Abstract

A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Claims

1. A method of making a photo-radiation source comprising the steps of:

providing a first planar conductor;

disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor;

disposing a second planar conductor on top formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip;

binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

2. A method of making a photo-radiation source according to claim 38;

wherein at least one of the first planar electrode and the second planar electrode is transparent.

3. A method of making a photo-radiation source according to claim 38;

wherein the first planar electrode and the second planar electrode are bound together by an adhesive disposed between the first and second electrode.

4. A method of making a photo-radiation source according to claim 38;

wherein formation of light emitting chips are fixed to at least one of the first planar electrode and the second planar electrode by a binder material.

5. A method of making a photo-radiation source according to claim 41;

wherein the binder material comprises an intrinsically conductive polymer.

6. A method of making a photo-radiation source according to claim 41;

wherein the first planar electrode and the second planar electrode are bound together by the binder material that fixes the formation of light emitting chips.