Mold-casting structure and improvement method for grounding of the same

• US 20060254042A1
• Filed: 08/02/2005
• Published: 11/16/2006
• Est. Priority Date: 03/30/2005
• Status: Abandoned Application

• Current Assignee: Microelectronics Technology Inc (MTI Laboratory Inc)
• Original Assignee: Microelectronics Technology Inc (MTI Laboratory Inc)
• Inventors: Yang, Lan Chun, Chou, Wen Pin
• Application Number:
  US11/194,542
• Publication Number:
  US 20060254042A1
• Time in Patent Office: Days
• US Class Current: 29/527.100
• CPC Class Codes: B22D 17/22 Dies manufacture, see the appropriate class, e.g. B23P15/24; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
• CPC Class Codes: Y10T 29/4998 Combined manufacture including applying or shaping of fluent material
• CPC Class Codes: Y10T 29/49995 Shaping one-piece blank by removing material

Abstract

A mold-casting structure comprises at least one dishing and a plurality of micro-protrusions. The dishing(s) formed on the surface of a mold-casting body, the plurality of micro-protrusions sticking out of the surface of the dishing, and the tops of the micro-protrusions constitute on a plane, so that the grounding issue of the circuitry embedded in the mold-casting structure caused by the dishing can be resolved. The dishing can be verified by daubing paint and scrapping thereafter, the location of remaining paint is deemed the dishing. Moreover, a three-dimensional measurement instrument can be employed for more precise measurement. The micro-protrusions can be formed on the dishing by mechanical processing or electric discharge machining (EDM). Alternatively, a mold with a structure matching the micro-protrusions can be formed first, and consequently the micro-protrusions are formed directly by mold-filling, which is more suitable for mass production.

Claims

1. A mold-casting structure, comprising:

at least one dishing formed on a surface of a mold-casting body; and

a plurality of micro-protrusions formed on the dishing, and the tops of the plurality of micro-protrusions constitute a plane;

whereby the inferior grounding of the circuitry secured on the mold-casting structure due to the dishing can be avoided.

2. The mold-casting structure of claim 1, which is made of aluminum alloy or plastic.

3. The mold-casting structure of claim 1, wherein the distance between neighboring micro-protrusions is between 0.01 and 5 mm.

4. The mold-casting structure of claim 1, wherein the diameter of the micro-protrusion is between 0.01 and 5 mm.

5. The mold-casting structure of claim 1, which is applied to a microwave telecommunication apparatus.

6. The mold-casting structure of claim 1, which is applied to a low noise block down converter (LNB).

7. An improved method for grounding of a mold-casting structure, comprising:

verifying a location of at least one dishing on the mold-casting structure; and

forming micro-protrusions on the at least one dishing.

8. The mold-casting structure of claim 7, wherein the dishing is verified by a three-dimensional measurement instrument.

9. The mold-casting structure of claim 7, wherein the verification for the location of the dishing comprises the steps of:

daubing paint on a surface of the mold-casting structure; and

scraping the surface along a plane, and the location of the remaining paint being deemed the dishing.

10. The mold-casting structure of claim 7, wherein the micro-protrusions are formed on the surface of the dishing by mechanical processing or electric discharge machining.

11. The mold-casting structure of claim 7, wherein the micro-protrusions are formed on the surface of the dishing by a pin hammer.

12. The mold-casting structure of claim 7, wherein the micro-protrusions are molded by a mold with a concave-convex structure matching the micro-protrusions.