Integrated circuit package with glass layer and oscillator
First Claim
Patent Images
1. An integrated circuit package comprising:
- an integrated circuit that comprises;
a temperature sensor that senses a temperature of said integrated circuit;
a memory module that stores oscillator calibrations and that selects one of said oscillator calibrations as a function of said sensed temperature; and
an oscillator module that generates a reference signal having a frequency that is based on said selected one of said oscillator calibrations; and
a glass layer;
an epoxy layer that adheres said glass layer to said integrated circuit; and
a packaging material that encases at least part of said glass layer and said integrated circuit.
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Abstract
An integrated circuit package comprises an integrated circuit that comprises a temperature sensor that senses a temperature of the integrated circuit. A memory module stores oscillator calibrations and selects one of the oscillator calibrations as a function of the sensed temperature. An oscillator module generates a reference signal having a frequency that is based on the selected one of the oscillator calibrations. An epoxy layer adheres a glass layer to the integrated circuit. A packaging material encases at least part of the glass layer and the integrated circuit.
96 Citations
15 Claims
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1. An integrated circuit package comprising:
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an integrated circuit that comprises;
a temperature sensor that senses a temperature of said integrated circuit;
a memory module that stores oscillator calibrations and that selects one of said oscillator calibrations as a function of said sensed temperature; and
an oscillator module that generates a reference signal having a frequency that is based on said selected one of said oscillator calibrations; and
a glass layer;
an epoxy layer that adheres said glass layer to said integrated circuit; and
a packaging material that encases at least part of said glass layer and said integrated circuit. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit package comprising:
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an integrated circuit that comprises;
temperature sensing means for sensing a temperature of said integrated circuit;
storing means for storing oscillator calibrations and for selecting one of said oscillator calibrations as a function of said sensed temperature; and
oscillating means for generating a reference signal having a frequency that is based on said selected one of said oscillating means calibrations; and
a glass layer;
means for attaching said glass layer to said integrated circuit; and
packaging means that encases at least part of said glass layer and said integrated circuit. - View Dependent Claims (7, 8, 9, 10)
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11. A method for providing an integrated circuit package comprising:
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sensing a temperature of an integrated circuit;
storing oscillator calibrations;
selecting one of said oscillator calibrations as a function of said sensed temperature;
generating a reference signal having a frequency that is based on said selected one of said oscillator calibrations;
attaching a glass layer to said integrated circuit; and
encasing at least part of said glass layer and said integrated circuit in a packaging material. - View Dependent Claims (12, 13, 14, 15)
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Specification