Method and apparatus for maskless photolithography

• US 20060256307A1
• Filed: 04/06/2006
• Published: 11/16/2006
• Est. Priority Date: 06/27/2001
• Status: Active Grant

• Current Assignee: University of South Florida (State University System of Florida)
• Original Assignee: University of South Florida (State University System of Florida)
• Inventors: Fries, David P.
• Granted Patent: US 7,271,877 B2
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices

Abstract

A method and apparatus to create two dimensional and three dimensional structures using a maskless photolithography system that is semi-automated, directly reconfigurable, and does not require masks, templates or stencils to create each of the planes or layers on a multi layer two-dimensional or three dimensional structure. In an embodiment, the pattern generator comprises a micromirror array wherein the positioning of the mirrors in the micromirror array and the time duration of exposure can be modulated to produce gray scale patterns to photoform layers of continuously variable thickness. The desired pattern can be designed and stored using conventional computer aided drawing techniques and can be used to control the positioning of the individual mirrors in the micromirror array to reflect the corresponding desired pattern. A fixture for mounting of the substrate can be incorporated and can allow the substrate to be moved three dimensions. The fixture can be rotated in one, two, or three directions.

Claims

1. A system for maskless photolithography comprising:

a. a computer system for generating mask patterns and alignment instructions;

b. an array of positionable micromirrors, operably connected to and controllable by said computer system, wherein said micromirrors reflect light according to said mask patterns provided by said computer system;

c. an optical system for generating, collimating, and directing a light beam to said micromirror array;

d. an optical system for further collimating the light beam reflected from said mirrors and directing the light beam onto a substrate;

e. an alignment fixture for mounting the substrate, wherein said alignment fixture is movable in coplanar first and second dimensions, and in a third dimension direction substantially perpendicular to said first and second coplanar dimensions and substantially parallel to the light beam reflected from said micromirrors;

said fixture providing three dimensional alignment of a substrate beneath the light beam, wherein said alignment fixture is moved in three dimensions in response to mechanical alignments directly provided by a user;

f. a means for controlling the position of the alignment fixture in the first, second, and third dimensions, such that controlling the position of the alignment fixture in the first, second, and third dimensions controls the position of the substrate in the first, second, and third dimensions.

g. a computer controlled pattern alignment system, for providing electrical alignment of said patterns in coplanar first and second dimensions, wherein said pattern alignment system adjusts the alignment of said mask patterns in coplanar first and second dimensions by altering the positioning of said micromirrors in response to instructions provided by said computer according to said alignment information, so that said pattern is shifted in at least one coplanar direction;

h. an optical viewer to allow optical monitoring of positioning of the substrate mounted in said alignment fixture by visually verifying that an image projected on the substrate is properly aligned; and

i. an optical filter, removably mounted in the light beam to selectively filter light impinging on the substrate to prevent exposure of the substrate during an alignment procedure.

2. The system according to claim 1, wherein the means for controlling the position of the alignment fixture is interconnected with the computer system such that control of the position of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system.

3. The system according to claim 1, further comprising:

a means for controlling the rotation of the alignment fixture in at least a first direction such that controlling the rotation of the alignment fixture in the at least first direction controls the rotation of the substrate in the at least first direction.

4. The system according to claim 3,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction is interconnected with the computer system such that control of the rotation of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system.

5. The system of claim 1, further comprising a computer controlled pattern modulation system, for varying the angular position and time duration of angular positioning of said micromirrors when exposing a substrate, said modulation system altering the positioning and time duration of angular positioning of said micromirrors in response to instructions provided by said computer, whereby pixelation and sticktion are reduced.

6. The system of claim 1 wherein said optical filter is an ultraviolet (UV) filter.

7. The system of claim 1 wherein the substrate is a photoresist coated substrate.

8. The system of claim 1 wherein the substrate is a photoreactive coated substrate.

9. A method for maskless photolithography comprising:

a. receiving mask pattern information corresponding to a desired pattern to be created on a substrate;

b. generating mask patterns based on received mask pattern information;

c. providing said mask patterns to an array of positionable micromirrors, operably connected to and controllable by a computer system;

d. generating, collimating, and directing a light beam to said micromirror array;

e. providing selective filtering of the light beam impinging on the substrate to prevent exposure of the substrate during an alignment procedure;

f. positioning said micromirrors to reflect the light beam from said micromirror array according to said mask patterns provided by said computer system;

g. collimating the light beam reflected from said micromirror array and directing the light beam onto a substrate;

h. aligning the substrate under the light beam by moving the substrate in three dimensions, wherein the substrate is moved in coplanar first and second dimensions, and moved in a third dimension direction substantially perpendicular to said first and second coplanar dimensions, and substantially parallel to the light beam reflected from said micromirror array, wherein aligning the substrate comprises aligning the substrate via a means for controlling the position of an alignment fixture in which the substrate is mounted,

i. allowing optical monitoring of positioning of the substrate under the light beam to visually verify that an image projected on the substrate is properly aligned;

j. receiving alignment information corresponding to alignment of a desired mask pattern projected onto a substrate;

k. generating alignment instructions based on received alignment information;

l. providing alignment instructions, based on said alignment information, to said micromirror array to further align said mask patterns in the coplanar first and second dimensions;

m. adjusting said micromirror array according to said alignment instructions by shifting the mask pattern in at least one of the coplanar first and second dimensions;

n. disabling filtering of the light beam;

o. exposing the substrate; and

p. repeating steps (a-o) to create a desired pattern on the substrate.

10. The method according to claim 9,

wherein the means for controlling the position of the alignment fixture is interconnected with the computer system such that control of the position of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system;

11. The method according to claim 9,

wherein aligning the substrate comprises aligning the substrate via a means for controlling the rotation of the alignment fixture in which the substrate is mounted in at least a first direction,

12. The method according to claim 11, wherein aligning the substrate comprises aligning the substrate via a means for controlling the rotation of the alignment fixture in which the substrate is mounted in the first direction, controlling the rotation of the alignment fixture in a second direction perpendicular to the first direction, and controlling the rotation of the alignment fixture in a third direction perpendicular to the first direction and perpendicular to the second direction.

13. The method according to claim 11,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction is interconnected with the computer system such that control of the rotation of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system.

14. The method of claim 9, further comprising varying the angular position and time duration of angular positioning of said micromirrors when exposing a substrate, whereby pixelation and sticktion are reduced.

15. The method of claim 9, wherein said receiving mask pattern information further comprises providing mask pattern information corresponding to a desired pattern to be created on a substrate.

16. The method of claim 9, wherein said providing selective filtering of the light beam further comprises placing an optical filter in the light beam path.

17. The method of claim 9, wherein allowing the substrate further comprises manually aligning a substrate under the light beam by moving the substrate in three dimensions in response to mechanical alignments provided by a user.

18. The method of claim 9, wherein said allowing optical monitoring further comprises optically monitoring positioning of the substrate under the light beam to visually verify that an image projected on the substrate is properly aligned.

19. The method of claim 9, wherein said disabling filtering further comprises removing said optical filter from the light beam path.

20. The method of claim 19 wherein said optical filter is an ultraviolet (UV) filter.

21. The method of claim 9 wherein the substrate is a photoresist coated substrate and successive layers are etched away from the substrate according to the projected mask pattern.

22. The method of claim 9, wherein the substrate is a photoreactive coated substrate and successive layers are added to the substrate according to the projected mask pattern.

23. A method for maskless photolithography comprising:

a. providing a computer system for generating mask patterns and alignment instructions, wherein said system provides mask patterns to a micromirror array and provides instructions to align patterns in coplanar first and second dimensions, by altering the position of said micromirrors in response to instructions provided by said computer according to alignment information so that the pattern is translated in at least one coplanar direction;

b. providing an array of positionable micromirrors, operably connected to and controllable by said computer system;

wherein said micromirrors reflect light according to said mask patterns provided by said computer system;

c. providing an optical system for generating, collimating, and directing a light beam to said array of micromirrors;

d. providing an optical system for further collimating the light beam reflected from said mirrors and directing the light beam onto a substrate;

e. an alignment fixture for mounting the substrate, wherein said alignment fixture is movable in coplanar first and second dimensions, and in a third dimension direction substantially perpendicular to said first and second coplanar dimensions and substantially parallel to the light beam reflected from said micromirrors;

said fixture providing three dimensional alignment of the substrate beneath the light beam, wherein the alignment fixture comprises a means for controlling the position of the alignment fixture in the first, second, and third dimensions; and

g. providing an optical viewer to allow optical monitoring of positioning of a substrate mounted in said alignment fixture by visually verifying that an image projected on the substrate is properly aligned;

24. The method according to claim 23,

wherein the means for controlling the position of the alignment fixture is interconnected with the computer system such that control of the position of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system

25. The method according to claim 23,

wherein the alignment fixture comprises a means for controlling the rotation of the alignment fixture in at least a first direction.

26. The method according to claim 25, wherein the means for controlling the rotation of the alignment fixture in at least a first direction controls the rotation of the alignment fixture in the first direction, controls the rotation of the alignment fixture in a second direction perpendicular to the first direction, and controls the rotation of the alignment fixture in a third direction perpendicular to the first direction and perpendicular to the second direction.

27. The method according to claim 25,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction is interconnected with the computer system such that control of the rotation of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system.

28. The method of claim 23, further comprising providing a computer controlled pattern modulation system, for varying the angular position of said micromirrors when exposing a substrate, said modulation system altering the positioning and time duration of angular positioning of said micromirrors in response to instructions provided by said computer, whereby pixelation and sticktion are reduced.

29. A computer system for maskless photolithography comprising:

a. a computing device comprising a display, a central processing unit (CPU), operating system software, memory for storing data, a user interface, and input/output capability for reading and writing data;

said computing device operably connected to and operating in conjunction with a maskless photolithography system;

b. computer program code for;

1) receiving mask pattern information corresponding to a desired pattern to be created on a substrate;

2) generating mask patterns based on received mask pattern information;

3) providing said mask patterns to an array of positionable micromirrors, operably connected to and controllable by said computer system;

4) receiving alignment information corresponding to alignment of a desired mask pattern projected onto a substrate;

5) generating alignment instructions based on received alignment information;

6) providing alignment instructions to a means for positioning an alignment fixture in which the substrate is mounted;

7) providing alignment instructions, based on said alignment information, to said micromirror array to further align said mask patterns in the coplanar first and second dimensions;

8) adjusting the micromirror array according to said alignment instructions by shifting the mask pattern in at least one of the coplanar first and second dimensions; and

9) repeating steps (1-8) to create a desired pattern on a substrate being fabricated in a maskless photolithography system;

wherein said computing device operates in conjunction with said maskless photolithography system and executes said computer code to control said micromirror array according to said received pattern information and alignment information.

30. The computer system according to claim 29,

wherein the means for controlling the position of the alignment fixture is interconnected with the computer system such that control of the position of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system

31. The computer system according to claim 29, wherein step 6 further comprises providing instructions to a means for rotating the alignment fixture in at least one direction.

32. The computer system according to claim 31,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction is interconnected with the computer system such that control of the rotation of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system.

33. The computer system of claim 29, further comprising a dedicated interface for receiving alignment information.

34. The computer system of claim 29, further comprising a dedicated interface for providing pattern information and alignment commands to a micromirror array.

35. The computer system of claim 29, further comprising computer code for varying the angular position of said micromirrors when exposing a substrate, whereby pixelation and sticktion are reduced.

36. A computer program product recorded on computer readable medium for a maskless photolithography system comprising:

a. computer readable medium for receiving mask pattern information corresponding to a desired pattern to be created on a substrate;

b. computer readable medium for generating mask patterns based on received mask pattern information;

c. computer readable medium for providing said mask patterns to an array of positionable micromirrors, operably connected to and controllable by said computer system;

d. computer readable medium for receiving alignment information corresponding to alignment of a desired mask pattern projected onto the substrate;

e. computer readable medium for generating alignment instructions based on received alignment information;

f. computer readable medium for generating alignment instructions based on received alignment information to a means for positioning an alignment fixture in which the substrate is mounted;

g. computer readable medium for providing alignment instructions, based on said alignment information, to said micromirror array to further align said mask patterns in the coplanar first and second dimensions;

h. computer readable medium for adjusting the micromirror array according to said alignment instructions by shifting the mask pattern in at least one of the coplanar first and second dimensions; and

i. computer readable medium for repeating steps (a-g) to create a desired pattern on the substrate being fabricated in a maskless photolithography system;

wherein said computer program product provides instructions for a computer system operating in conjunction with said maskless photolithography system to control said micromirror array according to said received pattern information and alignment information.

37. The computer program product according to claim 36, further comprising:

a computer readable medium for generating alignment instructions based on received alignment information to a means for rotating the alignment fixture in which the substrate is mounted.

38. The computer program product claim 36, further comprising computer readable medium for varying the angular position and time duration of angular positioning of said micromirrors when exposing the substrate, whereby pixelation and stiction are reduced.

39. A system for maskless photolithography, comprising:

an alignment fixture for mounting a substrate, wherein said alignment fixture allows alignment of the substrate in coplanar first and second dimensions, and in a third dimension direction substantially perpendicular to the first and second coplanar dimensions;

an array of micromirrors;

a means for directing light onto the array of micromirrors, wherein light incident on each micromirror of the array of micromirrors can be reflected by the each micromirror so as to be incident on the substrate mounted in the alignment fixture when the each micromirror is at or near a first position and can be reflected by the each micromirror so as to not be incident on the substrate mounted in the alignment fixture when the each micromirror is not at or near the first position;

a means for controlling the position of each micromirror of said array of micromirrors individually such that each micromirror is individually positioned to either reflect the light incident on the each micromirror so as to be incident on the substrate mounted in the alignment fixture or reflect the light incident on the each micromirror so as not to be incident on the substrate mounted in the alignment fixture, wherein some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to a desired mask pattern.

a means for controlling the position of the alignment fixture in the first, second, and third dimensions, such that controlling the position of the alignment fixture in the first, second, and third dimensions controls the position of the substrate in the first, second, and third dimensions.

40. The system according to claim 39, further comprising:

a means for controlling the rotation of the alignment fixture in at least a first direction such that controlling the rotation of the alignment fixture in the at least first direction controls the rotation of the substrate in the at least first direction.

41. The system according to claim 40, wherein the means for controlling the rotation of the alignment fixture in at least a first direction controls the rotation of the alignment fixture in a first direction, controls the rotation of the alignment fixture in a second direction perpendicular to the first direction, and controls the rotation of the alignment fixture in a third direction perpendicular to both the first direction and the second direction.

42. The system according to claim 40,

wherein the means for controlling the position of each micromirror of said array of micromirrors is a computer system which receives the desired mask pattern and controls the positions of each micromirror of the array of micromirrors so that some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to the desired mask pattern.

43. The system according to claim 39, wherein the means for controlling the position of the alignment fixture is interconnected with the computer system such that control of the position of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system.

44. The system according to 40,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction is interconnected with the computer system such that control of the rotation of the alignment fixture is coordinated with control of the position of each micromirror of said array of micromirrors by the computer system.

45. The system according to claim 42,

wherein the computer system receives a plurality of desired mask patterns and controls the positions of each micromirror of the array of micromirrors according to each of the plurality of desired mask patterns sequentially, wherein the means for controlling the position of the alignment fixture repositions the substrate mounted in the alignment fixture in the third dimension direction between one or more of the plurality of desired mask patterns.

46. The system according to claim 42, further comprising:

a computer controlled mask pattern alignment system for alignment of the desired mask pattern in the coplanar first and second dimensions, wherein the mask pattern alignment system adjusts the alignment of the desired mask pattern with respect to the substrate mounted in the alignment fixture in the coplanar first and second dimensions by altering the positioning of the micromirrors of the array of micromirrors in response to alignment information provided to the computer controlled mask pattern alignment system.

47. The system according to claim 39,

wherein the means for directing light onto the array of micromirrors comprises a first optical system for generating, collimating, and directing a light beam to the array of micromirrors.

48. The system according to claim 47, further comprising:

a second optical system for collimating the light beam reflected from the array of micromirrors and directing the light beam onto the substrate mounted in the alignment fixture.

49. The system according to claim 39,

wherein the means for controlling the position of each micromirror of the array of micromirrors dynamically varies the position of one or more of the micromirrors of the array of micromirrors such that pixelation is reduced.

50. The system according to claim 39,

wherein the means for controlling the position of each micromirror of the array of micromirrors dynamically varies the position of one or more of the micromirrors of the array of micromirrors such that sticktion is reduced.

51. The system according to claim 39,

wherein the substrate is a photoresist coated substrate, wherein light reflected by the array of micromirrors onto the photoresist coated substrate exposes a portion of the photoresist.

52. The system according to claim 39,

wherein the substrate is a photoreactive chemical coated substrate, wherein light reflected by the array of micromirrors onto the photoreactive chemical coated substrate causes a reaction between a portion of photoreactive chemicals and the photoreactive chemical coated substrate.

53. A method for maskless photolithography, comprising:

mounting a substrate onto an alignment fixture, wherein said alignment fixture allows alignment of the substrate in coplanar first and second dimensions, and in a third dimension direction substantially perpendicular to the first and second coplanar dimensions, wherein the alignment fixture comprises a means for controlling the position of the alignment fixture in the first, second, and third dimensions, such that controlling the position of the alignment fixture is the first, second, and third dimensions controls the position of the substrate in the first, second, and third dimensions

directing light onto an array of micromirrors, wherein light incident on each micromirror of the array of micromirrors can be reflected by the each micromirror so as to be incident on the substrate mounted in the alignment fixture when the each micromirror is at or near a first position and can be reflected by the each micromirror so as to not be incident on the substrate mounted in the alignment fixture when the each micromirror is not at or near the first position;

controlling the position of the alignment fixture in the first, second, and third dimensions so as to control the position of the substrate in the first, second, and third dimensions;

controlling the position of each micromirror of said array of micromirrors individually such that each micromirror is individually positioned to either reflect the light incident on the each micromirror so as to be incident on the substrate mounted in the alignment fixture or reflect the light incident on the each micromirror so as not to be incident on the substrate mounted in the alignment fixture, wherein some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to a desired mask pattern.

54. The method according to claim 53,

wherein the alignment fixture comprises a means for controlling the rotation of the alignment fixture in at least a first direction such that controlling the rotation of the alignment fixture in the at least first direction controls the rotation of the substrate in the at least first direction, wherein the method further comprises controlling the rotation of the alignment fixture at least a first direction so as to control the rotation of the substrate in the at least first direction.

55. The method according to 54,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction controls the rotation of the alignment fixture in the first direction, controls the rotation of the alignment fixture in a second direction perpendicular to the first direction, and controls the rotation of the alignment fixture in a third direction perpendicular to the first direction and perpendicular to the second direction, wherein controlling the rotation of the alignment fixture in at least a first direction comprises controlling the rotation of the alignment fixture in the first direction, controlling the rotation of the alignment fixture in a second direction perpendicular to the first direction, and controlling the rotation of the alignment fixture in a third direction perpendicular to the first direction and perpendicular to the second direction.

56. The method according to claim 53,

wherein controlling the position of each micromirror of said array of micromirrors comprises receiving the desired mask pattern via a computer system and controlling via the computer system the positions of each micromirror of the array of micromirrors so that some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to the desired mask pattern.

57. The method according to claim 53,

wherein controlling the position of the alignment fixture in the first, second, and third dimensions comprises receiving the desired mask pattern via a computer system and controlling via the computer system the means for controlling the position of the alignment fixture so as to control the position of the substrate.

58. The method according to claim 54,

wherein controlling the rotation of the alignment fixture in the at least first direction comprises receiving the desired mask pattern via a computer system and controlling via the computer system the means for controlling the rotation of the alignment fixture so as to control the rotation of the substrate.

59. The method according to claim 56,

wherein controlling the position of each micromirror of said array of micromirrors comprises recieving a plurality of desired mask patterns and controls the positions of each micromirror of the array of micromirrors according to each of the plurality of desired mask patterns sequentially, and repositioning the substrate mounted in the alignment fixture in the third dimension direction between controlling via the computer system the positions of each micromirror of the array of micromirrors one or more of the plurality of desired mask patterns.

60. The method according to claim 59,

wherein repositioning the substrate mounted in the alignment fixture in the third dimension direction comprises controlling via the computer system the means for controlling the position of the alignment fixture so as to control the position of the substrate.

61. The method according to claim 56, further comprising:

for aligning the desired mask pattern in the coplanar first and second dimensions via a computer controlled mask pattern alignment system,

adjusting the alignment of the desired mask pattern with respect to the substrate mounted in the alignment fixture in the coplanar first and second dimensions by altering the positioning of the micromirrors of the array of micromirrors in response to alignment information provided to the computer controlled mask pattern alignment system.

62. The method according to claim 54,

wherein directing light onto the array of micromirrors comprises generating, collimating, and directing a light beam to the array of micromirrors.

63. The method according to claim 62, further comprising:

collimating the light beam reflected from the array of micromirrors and directing the light beam onto the substrate mounted in the alignment fixture.

64. The method according to claim 54,

wherein controlling the position of each micromirror of the array of micromirrors comprises dynamically varying the position of one or more of the micromirrors of the array of micromirrors such that pixelation is reduced.

65. The method according to claim 54,

wherein controlling the position of each micromirror of the array of micromirrors comprises dynamically varying the position of one or more of the micromirrors of the array of micromirrors such that sticktion is reduced.

66. The method according to claim 54 further comprising:

coating the substrate with a photoresist, wherein light reflected by the array of micromirrors onto the photoresist coated substrate exposes a portion of the photoresist.

67. The method according to claim 54,

coating the substrate with a photoreactive chemical, wherein light reflected by the array of micromirrors onto the photoreactive chemical coated substrate causes a reaction between a portion of photoreactive chemicals and the photoreactive chemical coated substrate.

68. A system for maskless photolithography, comprising:

an alignment fixture for mounting a substrate, wherein said alignment fixture allows alignment of the substrate in coplanar first and second dimensions, and in a third dimension direction substantially perpendicular to the first and second coplanar dimensions;

an array of micromirrors;

a means for directing light onto the array of micromirrors, wherein light incident on each micromirror of the array of micromirrors can be reflected by the each micromirror so as to be incident on the substrate mounted in the alignment fixture when the each micromirror is at or near a first position and can be reflected by the each micromirror so as to not be incident on the substrate mounted in the alignment fixture when the each micromirror is not at or near the first position;

a means for controlling the position of each micromirror of said array of micromirrors individually such that each micromirror is individually positioned to either reflect the light incident on the each micromirror so as to be incident on the substrate mounted in the alignment fixture or reflect the light incident on the each micromirror so as not to be incident on the substrate mounted in the alignment fixture, wherein some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to a desired mask pattern,

wherein the means for controlling the position of each micromirror of the array of micromirrors dynamically varies the position of one or more of the micromirrors of the array of micromirrors such that pixelation and sticktion are reduced.

69. The system according to claim 68, further comprising:

a means for controlling the position of the alignment fixture in the first, second, and third dimensions, such that controlling the position of the alignment fixture in the first, second, and third dimensions controls the position of the substrate in the first, second, and third dimensions.

70. The system according to claim 68, further comprising:

a means for controlling the rotation of the alignment fixture in at least a first direction such that controlling the rotation of the alignment fixture in the at least first direction controls the rotation of the substrate in the at least first direction.

71. The system according to claim 70,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction controls the rotation of the alignment fixture in the first direction, controls the rotation of the alignment fixture in a second direction perpendicular to the first directions and controls the rotation of the alignment fixture in a third direction perpendicular to the first direction and perpendicular to the second direction.

72. The system according to claim 68,

wherein the means for controlling the position of each micromirror of said array of micromirrors is a computer system which receives the desired mask pattern and controls the positions of each micromirror of the array of micromirrors so that some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to the desired mask pattern.

73. The system according to claim 72,

wherein the computer system controls the means for controlling the position of the alignment fixture, such that the control of the position of the alignment fixture and control of the position of each micromirror of said array of micromirrors is coordinated by the computer system.

74. The system according to claim 72,

wherein the computer system controls the means for controlling the rotation of the alignment fixture, such that the control of the rotation of the alignment fixture and control of the position of each micromirror of said array of micromirrors is coordinated by the computer system.

75. The system according to claim 72, further comprising:

a computer controlled mask pattern alignment system for alignment of the desired mask pattern in a coplanar first and second dimensions wherein the mask pattern

alignment system adjusts the alignment of the desired mask pattern with respect to the substrate mounted in the alignment fixture in the coplanar first and second dimensions by altering the positioning of the micromirrors of the array of micromirrors in response to alignment information provided to the computer controlled mask pattern alignment system.

76. The system according to claim 68,

wherein the means for directing light onto the array of micromirrors comprises a first optical system for generating, collimating, and directing a light beam to the array of micromirrors.

77. The system according to claim 76, further comprising:

a second optical system for collimating the light beam reflected from the array of micromirrors and directing the light beam onto the substrate mounted in the alignment fixture.

78. The system according to claim 68,

wherein the substrate is a photoresist coated substrate, wherein light reflected by the array of micromirrors onto the photoresist coated substrate exposes a portion of the photoresist.

79. The system according to claim 68,

wherein the substrate is a photoreactive chemical coated substrate, wherein light reflected by the array of micromirrors onto the photoreactive chemical coated substrate causes a reaction between a portion of photoreactive chemicals and the photoreactive chemical coated substrate.

80. A method for maskless photolithography, comprising:

mounting a substrate onto an alignment fixture, wherein the alignment fixture comprises a means for controlling the position of the alignment fixture in the first, second, and third dimensions, such that controlling the position of the alignment fixture in the first, second, and third dimensions controls the position of the substrate in the first, second, and third dimensions.

directing light onto an array of micromirrors, wherein light-incident on each micromirror of the array of micromirrors can be reflected by the each micromirror so as to be incident on the substrate mounted in the alignment fixture when the each micromirror is at or near a first position and can be reflected by the each micromirror so as to not be incident on the substrate mounted in the alignment fixture when the each micromirror is not at or near the first position;

controlling the position of each micromirror of said array of micromirrors individually such that each micromirror is individually positioned to either reflect the light incident on the each micromirror so as to be incident on the substrate mounted in the alignment fixture or reflect the light incident on the each micromirror so as not to be incident on the substrate mounted in the alignment fixture, wherein some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to a desired mask pattern,

wherein controlling the position of each micromirror of the array of micromirrors comprises dynamically varying the position of one or more of the micromirrors of the array of micromirrors such that pixelation and sticktion are reduced.

81. The method according to claim 80,

wherein the alignment fixture comprises a means for controlling the rotation of the alignment fixture in at least a first direction such that controlling the rotation of the alignment fixture in the at least first direction controls the rotation of the substrate in the at least first direction.

82. The method according to claim 81,

wherein the means for controlling the rotation of the alignment fixture in at least a first direction controls the rotation of the alignment fixture in the first direction, controls the rotation of the alignment fixture in a second direction perpendicular to the first directions and controls the rotation of the alignment fixture in a third direction perpendicular to the first direction and perpendicular to the second direction.

83. The method according to claim 80,

wherein controlling the position of each micromirror of said array of micromirrors comprises receiving the desired mask pattern via a computer system and controlling via the computer system the positions of each micromirror of the array of micromirrors so that some, all, or none of the light incident on the array of micromirrors is reflected onto the substrate mounted in the alignment fixture according to the desired mask pattern.

84. The method according to claim 83,

wherein controlling the position of the alignment fixture comprises receiving the desired mask pattern via a computer system and controlling via the computer system the position of the alignment fixture.

85. The method according to claim 83,

wherein controlling the rotation of the alignment fixture comprises receiving the desired mask pattern via a computer system and controlling via the computer system the rotation of the alignment fixture.

86. The method according to claim 83, further comprising:

for aligning the desired mask pattern in a coplanar first and second dimensions via a computer controlled mask pattern alignment system,

adjusting the alignment of the desired mask pattern with respect to the substrate mounted in the alignment fixture in the coplanar first and second dimensions by altering the positioning of the micromirrors of the array of micromirrors in response to alignment information provided to the computer controlled mask pattern alignment system.

87. The method according to claim 80,

wherein directing light onto the array of micromirrors comprises generating, collimating, and directing a light beam to the array of micromirrors.

88. The method according to claim 87, further comprising:

collimating the light beam reflected from the array of micromirrors and directing the light beam onto the substrate mounted in the alignment fixture.

89. The method according to claim 80, further comprising:

coating the substrate with a photoresist, wherein light reflected by the array of micromirrors onto the photoresist coated substrate exposes a portion of the photoresist.

90. The method according to claim 80,

coating the substrate with a photoreactive chemical, wherein light reflected by the array of micromirrors onto the photoreactive chemical coated substrate causes a reaction between a portion of photoreactive chemicals and the photoreactive chemical coated substrate.