Electrosurgical electrode and method of manufacturing same

• US 20060259033A1
• Filed: 01/11/2006
• Published: 11/16/2006
• Est. Priority Date: 05/12/2005
• Status: Active Grant

• Current Assignee: Innovatech, LLC
• Original Assignee: Innovatech, LLC
• Inventors: Nesbitt, Bruce
• Granted Patent: US 8,814,861 B2
• Time in Patent Office: Days
• US Class Current: 606/45
• CPC Class Codes: A61B 17/320016 Endoscopic cutting instruments, e.g. arthroscopes, resectoscopes A61B10/0233, A61B17/29, A61B17/3207 take precedence
• CPC Class Codes: A61B 18/14 Probes or electrodes therefor
• CPC Class Codes: A61B 18/1402 Probes for open surgery
• CPC Class Codes: A61B 2017/0088 ceramic
• CPC Class Codes: A61B 2017/00889 antimicrobial, disinfectant
• CPC Class Codes: A61B 2018/0013 non-sticking
• CPC Class Codes: A61B 2018/00595 Cauterization
• CPC Class Codes: A61B 2018/00607 Coagulation and cutting with the same instrument
• CPC Class Codes: A61B 2018/1412 Blade
• CPC Class Codes: A61B 2018/1417 Ball
• CPC Class Codes: A61B 2018/1425 Needle
• CPC Class Codes: A61B 2018/144 Wire
• CPC Class Codes: B05D 1/06 Applying particulate materials
• CPC Class Codes: B05D 1/12 Applying particulate materials B05D1/06, B05D1/10 take precedence

Abstract

An electrosurgical device coated an epoxy modified rigid silicone powder coating which includes a solvent-free hydroxyl functional solid phenyl silicone resin in the range of about 40% to about 60% parts per weight of the coating; a calcium metasilicate in the range of about 20% to about 40% parts per weight of the coating; an epoxy cresol novalac resin in the range of about 5% to about 15% parts per weight of the coating; an ultra-fine air micronized muscovite mica in the range of about 0% to about 10% parts per weight of the coating; a 60% active powder version of a methyl alkyl polysiloxane in the range of about 3% to about 7% parts per weight of the coating; a high temperature calcination of coprecipitated compound with manganese-copper-iron in the range of about 0% to about 10% parts per weight of the coating; an o-cresol novolac resin in the range of about 0.5% to about 3% parts per weight of the coating; and an acrylate copolymer in the range of about 0.5% to about 3% parts per weight of the coating;. This coating is applied to the surfaces of an electrosurgical device minimize the build-up of charred tissue (i.e., eschar) on the surfaces of the electrosurgical device.

Claims

1. An electrosurgical device including an electrode, a handle connected to the electrode and an electrical source in communication with the handle to transfer electrical energy to the electrode for contacting tissue in a body during an electrosurgical procedure, said electrode comprising:

a conductive substrate; and

at least one epoxy modified rigid silicone powder coating applied to said substrate, wherein the epoxy modified rigid silicone powder coating at least includes;

(a) about 50% parts per weight of a solvent-free hydroxyl functional solid phenyl silicone resin;

(b) about 23.5% parts per weight of a calcium metasilicate;

(c) about 10% parts per weight of an epoxy cresol novalac resin;

(d) about 5% parts per weight of a 60% active powder version of a methyl alkyl polysiloxane;

(e) about 1.5% parts per weight of an o-cresol novolac resin; and

(f) about 1% parts per weight of an acrylate copolymer.

2. The electrosurgical device of claim 1, wherein the epoxy modified rigid silicone powder coating includes about 5% parts per weight of an ultra-fine air micronized muscovite mica.

3. The electrosurgical device of claim 1, wherein the epoxy modified rigid silicone powder coating includes about 4% parts per weight of a high temperature calcination of coprecipitated compound with manganese-copper-iron.

4. The electrosurgical device of claim 1, wherein the conductive substrate includes a metal.

5. The electrosurgical device of claim 1, wherein at least a portion of the conductive substrate includes an electrically insulative material, which is applied to the surface of the conductive substrate.

6. The electrosurgical device of claim 1, wherein a plurality of anti-microbial particles are interspersed in said powder coating.

7. The electrosurgical device of claim 1, wherein a wet bonding material applied to the surface of the substrate and the powder coating is applied to the wet bonding material.

8. An electrosurgical device comprising:

a conductive substrate including a proximal end and a distal end;

a handle connected to the proximal end of said substrate;

at least one electrical transfer member connected to the handle, which transfers electrical energy from an electrical source through the handle to the conductive substrate; and

at least one layer of epoxy modified rigid silicone powder applied to the surface of the substrate, wherein the epoxy modified rigid silicone powder coating at least includes;

(a) a solvent-free hydroxyl functional solid phenyl silicone resin in the range of about 40% to about 60% parts per weight of the coating;

(b) a calcium metasilicate in the range of about 20% to about 40% parts per weight of the coating;

(c) an epoxy cresol novalac resin in the range of about 5% to about 15% parts per weight of the coating;

(d) a 60% active powder version of a methyl alkyl polysiloxane in the range of about 3% to about 7% parts per weight of the coating;

(e) an o-cresol novolac resin in the range of about 0.5% to about 3% parts per weight of the coating; and

(f) an acrylate copolymer in the range of about 0.5% to about 3% parts per weight of the coating.

9. The electrosurgical device of claim 8, wherein the epoxy modified rigid silicone powder coating includes an ultra-fine air micronized muscovite mica in the range of about 0% to about 10% parts per weight of the coating.

10. The electrosurgical device of claim 8, wherein the epoxy modified rigid silicone powder coating includes a high temperature calcination of coprecipitated compound with manganese-copper-iron in the range of about 0% to about 10% parts per weight of the coating.

11. The electrosurgical device of claim 8, wherein the epoxy modified rigid silicone powder coating includes an aluminum pigment in the range of about 0% to about 6% parts per weight of the powder coating.

12. The electrosurgical device of claim 8, wherein the epoxy modified rigid silicone powder coating includes an ultra marine blue pigment in the range of about 0% to about 10% parts per weight of the powder coating.

13. The electrosurgical device of claim 8, wherein the conductive substrate includes a metal.

14. The electrosurgical device of claim 8, wherein the epoxy modified rigid silicone powder includes a plurality of anti-microbial particles.

15. The electrosurgical device of claim 8, wherein at least a portion of the conductive substrate includes an electrically insulative material, which is applied to the surface of the conductive substrate.

16. The electrosurgical device of claim 8, wherein a wet bonding material applied to the surface of the substrate and the epoxy modified rigid silicone powder is applied to the wet bonding material.

17. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of:

(a) evenly applying an epoxy modified rigid silicone powder coating to a surface of the conductive substrate, wherein the epoxy modified rigid silicone powder coating at least includes;

(i) about 50% parts per weight of a solvent-free hydroxyl functional solid phenyl silicone resin;

(ii) about 23.5% parts per weight of a calcium metasilicate;

(iii) about 10% parts per weight of an epoxy cresol novalac resin;

(iv) about 5% parts per weight of a 60% active powder version of a methyl alkyl polysiloxane;

(v) about 1.5% parts per weight of an o-cresol novolac resin; and

(vi) about 1% parts per weight of an acrylate copolymer; and

(b) at least partially curing the epoxy modified rigid silicone powder coating.

18. The method of claim 17, which includes the step of applying wet bonding material to the surface of the conductive substrate prior to step (a).

19. The method of claim 17, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles.

20. The method of claim 17, which includes the step of applying an electrically insulative material to at least a portion of the surface of the conductive substrate.

21. The method of claim 17, wherein the epoxy modified rigid silicone powder coating includes about 5% parts per weight of an ultra-fine air micronized muscovite mica.

22. The method of claim 17, wherein the epoxy modified rigid silicone powder coating includes about 4% parts per weight of a high temperature calcination of coprecipitated compound with manganese-copper-iron.

23. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of:

(a) evenly applying an epoxy modified rigid silicone powder coating to a surface of the conductive substrate, wherein the epoxy modified rigid silicone powder coating at least includes;

(i) a solvent-free hydroxyl functional solid phenyl silicone resin in the range of about 40% to about 60% parts per weight of the coating;

(ii) a calcium metasilicate in the range of about 20% to about 40% parts per weight of the coating;

(iii) an epoxy cresol novalac resin in the range of about 5% to about 15% parts per weight of the coating;

(iv) a 60% active powder version of a methyl alkyl polysiloxane in the range of about 3% to about 7% parts per weight of the coating;

(v) an o-cresol novolac resin in the range of about 0.5% to about 3% parts per weight of the coating; and

(vi) an acrylate copolymer in the range of about 0.5% to about 3% parts per weight of the coating; and

(b) at least partially curing the epoxy modified rigid silicone powder coating.

24. The method of claim 23, which includes the step of applying wet bonding material to the surface of the conductive substrate prior to step (a).

25. The method of claim 23, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles.

26. The method of claim 23, which includes the step of applying an electrically insulative material to at least a portion of the surface of the conductive substrate.

27. The method of claim 23, wherein the epoxy modified rigid silicone powder coating includes an ultra-fine air micronized muscovite mica in the range of about 0% to about 10% parts per weight of the coating.

28. The method of claim 23, wherein the epoxy modified rigid silicone powder coating includes a high temperature calcination of coprecipitated compound with manganese-copper-iron in the range of about 0% to about 10% parts per weight of the coating.

29. The method of claim 23, wherein the epoxy modified rigid silicone powder coating includes an aluminum pigment in the range of about 0% to about 6% parts per weight of the powder coating.

30. The method of claim 23, wherein the epoxy modified rigid silicone powder coating includes an ultra marine blue in the range of about 0% to about 10% parts per weight of the powder coating.