Vertical integrated-gate CMOS device and its fabrication process
First Claim
1. Yijian Chen claims that he invents the vertical integrated-gate CMOS device as shown in the FIG. 2 of the attached document, and he designs several examples of process sequence as shown in FIGS. 3, 4, 5 and 6 of the attached document to fabricate this device.
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Abstract
A vertical integrated-gate CMOS (Complementary Metal-Oxide-Silicon field effect transistor) device is invented for the first time and its possible fabrication processes are proposed. This CMOS architecture integrates PMOS (P-channel MOSFET) and NMOS (N-channel MOSFET) together vertically to increase the transistor density, and use epitaxy layer thickness to define the transistor channel/gate length. The epitaxy growth rate can be controlled accurately thus with much less channel/gate critical dimension (CD) variations than defined by lithography, which also relaxes lithographic resolution requirements for continuous cost-effective CMOS shrinking. This device structure can be used in the post-planar-CMOS ultra-dense integrated circuits.
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Citations
1 Claim
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1. Yijian Chen claims that he invents the vertical integrated-gate CMOS device as shown in the
FIG. 2 of the attached document, and he designs several examples of process sequence as shown inFIGS. 3, 4 , 5 and 6 of the attached document to fabricate this device.
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1-1. Yijian Chen claims that he invents the vertical integrated-gate CMOS device as shown in the
FIG. 2 of the attached document, and he designs several examples of process sequence as shown inFIGS. 3, 4 , 5 and 6 of the attached document to fabricate this device.
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