Method of fabricating printheads having multiple nozzle assemblies

• US 20060261423A1
• Filed: 06/12/2006
• Published: 11/23/2006
• Est. Priority Date: 05/24/2000
• Status: Active Grant

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Granted Patent: US 7,465,405 B2
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation

Abstract

A method of fabricating printheads each having a plurality of nozzle assemblies positioned on a substrate from a plurality of sets of the nozzle assemblies positioned on the substrate includes the step of applying a guard defining a plurality of recesses to the substrate so that each set is located within a respective recess. The substrate is then segmented.

Claims

1. A method of fabricating printheads each having a plurality of nozzle assemblies positioned on a substrate from a plurality of sets of the nozzle assemblies positioned on the substrate, the method comprising the steps of:

applying a guard defining a plurality of recesses to the substrate so that each set is located within a respective recess; and

segmenting the substrate.

2. A method as claimed in claim 1, wherein the step of segmenting the substrate comprises the step of etching the substrate from a back side of the substrate.

3. A method as claimed in claim 2, which includes the step of etching a plurality of ink supply channels in the back side of the substrate so that each nozzle assembly is in fluid communication with a respective ink supply channel.

4. A method as claimed in claim 3, further including the step of applying an adhesive layer to the back side of the substrate, subsequent to the step of segmenting the substrate.

5. A method as claimed in claim 4, further including the step of applying a handling layer to the adhesive layer so that the adhesive layer is located between the handling layer and the printheads.

6. A method as claimed in claim 1, further including the step of etching a plurality of ink ejection channels in the guard so that each ink ejection channel is in register with a respective nozzle assembly.