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Semiconductor package and manufacturing method thereof

  • US 20060261458A1
  • Filed: 11/12/2003
  • Published: 11/23/2006
  • Est. Priority Date: 11/12/2003
  • Status: Abandoned Application
First Claim
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1. A semiconductor package comprising:

  • an image sensor die comprising;

    a photo sensing surface, the photo sensing surface converting lights incident from an outside into electrical signals;

    bond pads formed around the photo sensing surface;

    first conductive bumps formed at the bond pads;

    a non-photo sensing surface opposite to the photo sensing surface; and

    side surfaces, each of the side surfaces formed between the photo sensing surface and the non-photo sensing surface;

    a substrate comprising;

    an insulative layer comprising a window formed at an area corresponding to the photo sensing surface of the image sensor die, the insulative layer attached to the non-photo sensing surface of the image sensor die by a first adhesive;

    electrically conductive patterns formed at the insulative layer and connected to the first conductive bumps, the electrically conductive patterns extending over one of the side surfaces and the non-photo sensing surface of the image sensor die; and

    first holes formed at the insulative layer corresponding to the non-photo sensing surface so that the electrically conductive patterns are opened downward; and

    a glass attached to the insulative layer of the substrate by a second adhesive to cover the window.

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