Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment

• US 20060262502A1
• Filed: 05/23/2005
• Published: 11/23/2006
• Est. Priority Date: 05/23/2005
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chrysler, Gregory M., Chang, Je-Young
• Granted Patent: US 7,317,615 B2
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a plurality of walls coupled to the microchannel structure to define a manifold. The manifold is in communication with at least a plurality of the microchannels. The plurality of walls includes a side wall. The side wall has a port therein. The port allows the coolant to flow in a direction that is either into the manifold or out of the manifold.

Claims

1. An apparatus comprising:

a microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant; and

a plurality of walls coupled to the microchannel structure to define a manifold that is in communication with at least a plurality of said microchannels, said plurality of walls including a side wall, said side wall having a port therein, said port for allowing coolant to flow in a direction, said direction being one of;

(a) into said manifold, and (b) out of said manifold.

2. The apparatus of claim 1, wherein said direction is parallel to a direction in which said coolant flows through said microchannels.

3. The apparatus of claim 1, wherein said plurality of walls is included in a member formed as a unitary body.

4. The apparatus of claim 1, wherein said plurality of walls is a first plurality of walls and defines a first manifold that is in communication with all of said microchannels, said direction being into said first manifold, the apparatus further comprising:

a second plurality of walls coupled to the microchannel structure at an opposite end of said microchannel structure from said first plurality of walls, said second plurality of walls to define a second manifold that is in communication with all of said microchannels, said plurality of walls including a side wall, said side wall of said second plurality of side walls having a port therein, said port of said side wall of said second plurality of walls for allowing coolant to flow out of said second manifold.

5. The apparatus of claim 1, wherein:

said port is a first port;

said manifold is open to all of said microchannels at a first end of said microchannel structure;

said side wall has a second port formed therein to allow coolant to flow to a second end of said microchannel structure that is opposite said first end; and

said coolant flows out of said first port.

6. The apparatus of claim 5, wherein said plurality of walls includes a horizontal wall to isolate said second port from said first port.

7. The apparatus of claim 1, wherein:

said port is a first port;

said manifold is a first manifold that is in communication with a first subset of said microchannels that includes substantially half of said microchannels;

said plurality of walls defines a second manifold adjacent said first manifold, said second manifold being in communication with all of said microchannels that are not included in said first subset of microchannels; and

said side wall has a second port formed therein to allow coolant to flow into said second manifold.

8. The apparatus of claim 7, wherein said plurality of walls includes a vertical wall to define a boundary between said first manifold and said second manifold.

9. The apparatus of claim 7, wherein said microchannel structure defines a third manifold that is in communication with all of said microchannels at an opposite end of said microchannel structure from said first and second ports.

10. A method comprising:

flowing a coolant in a first direction out of a plurality of microchannels into a manifold; and

flowing the coolant in said direction out of said manifold.

11. The method of claim 10, wherein said direction is horizontal.

12. The method of claim 10, further comprising:

flowing the coolant in said direction out of another manifold and into said plurality of microchannels.

13. The method of claim 12, further comprising:

flowing the coolant in said direction into said another manifold.

14. A system comprising:

a microprocessor integrated circuit die;

a network controller coupled to the microprocessor;

a microchannel structure thermally coupled to the microprocessor integrated circuit die, the microchannel structure having microchannels formed therein, said microchannels to transport a coolant; and

a plurality of walls coupled to the microchannel structure to define a manifold that is in communication with at least a plurality of said microchannels, said plurality of walls including a side wall, said side wall having a port therein, said port for allowing coolant to flow in a direction, said direction being one of;

(a) into said manifold, and (b) out of said manifold.

15. The system of claim 14, wherein said direction is parallel to a direction in which said coolant flows through said microchannels.

16. The system of claim 14, wherein said plurality of walls is included in a member formed as a unitary body.

17. The system of claim 14, wherein said plurality of walls is a first plurality of walls and defines a first manifold that is in communication with all of said microchannels, said direction being into said first manifold, the system further comprising:

a second plurality of walls coupled to the microchannel structure at an opposite end of said microchannel structure from said first plurality of walls, said second plurality of walls to define a second manifold that is in communication with all of said microchannels, said plurality of walls including a side wall, said side wall of said second plurality of side walls having a port therein, said port of said side wall of said second plurality of walls for allowing coolant to flow out of said second manifold.

18. The system of claim 14, wherein:

said port is a first port;

said manifold is open to all of said microchannels at a first end of said microchannel structure;

said side wall has a second port formed therein to allow coolant to flow to a second end of said microchannel structure that is opposite said first end; and

said coolant flows out of said first port.

19. The system of claim 14, wherein:

said port is a first port;

said manifold is a first manifold that is in communication with a first subset of said microchannels that includes substantially half of said microchannels;

said plurality of walls defines a second manifold adjacent said first manifold, said second manifold being in communication with all of said microchannels that are not included in said first subset of microchannels; and

said side wall has a second port formed therein to allow coolant to flow into said second manifold.

20. The system of claim 19, wherein said microchannel structure defines a third manifold that is in communication with all of said microchannels at an opposite end of said microchannel structure from said first and second ports.